Patents by Inventor Masayuki Hironaga

Masayuki Hironaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080078920
    Abstract: There is disclosed a die 1 for forming a honeycomb structure comprising a die base 22 having a first plate-like member 23 and a second plate-like member 24, the first plate-like member is provided with groove portions on the side of a bonding surface 28 between the first plate-like member and the second plate-like member 24, and a depth y (mm) of the groove portions 7 satisfies the following equation (1): y?a·(t1×E1+t2×E2)/(t1×t2×E1×E2)??(1), in which t1 is a thickness (mm) obtained by subtracting the depth (mm) of the groove portions from a thickness (mm) of the first plate-like member, E1 is an apparent volume elasticity (GPa) of the first plate-like member at 25° C. in consideration of a state in which back holes are formed, t2 is a thickness (mm) of the second plate-like member, E2 is a volume elasticity (GPa) of the second plate-like member at 25° C., and a is a coefficient determined on the basis of conditions during manufacturing.
    Type: Application
    Filed: November 1, 2007
    Publication date: April 3, 2008
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hironori TAKAHASHI, Masayuki HIRONAGA
  • Patent number: 7335848
    Abstract: A process for producing a die for forming a honeycomb structure having slits having hexagonal honeycomb cell shape 5 at one of surfaces 7 of a plate-like base material for die 2, and backside holes 4 each communicating with respective slits 5 at the other surface 8, which comprises the steps of forming holes 3 for dielectric fluid each having an opening diameter smaller than the width of the slit 5 in a predetermined depth at the one of surfaces 7 thereof, and holes 4 communicating with holes 3 at the rest surface 8; and then passing a dielectric fluid 10 for electrical discharge machining from the surface 8 to the surface 7 via holes 3 and 4 until the machining proceeds to a position communicating with each hole 4; thereby, the slits 5 are formed at the surface 7 of the base material 2.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: February 26, 2008
    Assignee: NGK Insulators, Ltd.
    Inventors: Masayuki Hironaga, Masanari Iwade, Seiichiro Hayashi
  • Publication number: 20080017520
    Abstract: A method for manufacturing a die to be used for formation of honeycomb structure, the die having a die base having two faces, honeycomb-shaped slits 5 being formed in one face and back holes communicating with the slits 5 being formed in the other face in order to introduce a forming material thereinto, at least the slit portions of the die being made of a super had alloy, wherein slits 5 are formed by grinding or electric discharge machining, then a discharging electrode 40 having a square-shaped section is disposed near each crossing portion of slits 5, and electric discharge machining is conducted from the upper side of slit 5 toward the depth direction of slit.
    Type: Application
    Filed: September 6, 2007
    Publication date: January 24, 2008
    Applicant: NGK INSULATORS, LTD.
    Inventors: Masaaki Koishikura, Masayuki Hironaga
  • Patent number: 7311510
    Abstract: Disclosed is a die (10) for forming a honeycomb body having a structure provided with groovy slits (2) on a front face thereof, the slits being formed by cell blocks (3) and back holes (4) on a back surface thereof, each hole being communicatively connected with the slit. The number N of the cell blocks per one side of the die is even number. According to the die for forming the honeycomb body, strain generated on an extruded face of the honeycomb body after extrusion and bending of the honeycomb body can be reduced as well as the die can maintain a stable frictional force of extrusion and is excellent in extrudability and wear resistance.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: December 25, 2007
    Assignee: NGK Insulators, Ltd.
    Inventors: Masayuki Nate, Takahisa Kaneko, Masayuki Hironaga, Yuji Deguchi
  • Publication number: 20060034972
    Abstract: There is disclosed a die for forming a honeycomb structure, which realizes a sophisticated formability and which is superior in resistance to wear. A die for forming the honeycomb structure is provided with a die base having two surfaces, one surface is provided with slits of a honeycomb shape, and the other surface is provided with back holes which introduce a forming material therethrough. This die base includes: a die precursor which is obtained by stacking and bonding a first member which is one surface of the die base and is made of a tungsten carbide-based super hard alloy containing at least tungsten carbide, and a second member which is the other surface of the die base and is made of a metal material capable of causing at least one of three phase transformations of martensite transformation, bainite transformation, and pearlite transformation by cooling of an austenite phase together. Tensile and compressive stresses in a mutually bonded surface of the two plate-like members are 1000 MPa or less.
    Type: Application
    Filed: July 22, 2005
    Publication date: February 16, 2006
    Applicant: NGK INSULATORS, LTD.
    Inventors: Hironori Takahashi, Hirofumi Hosokawa, Yoshimasa Kondo, Masayuki Hironaga
  • Publication number: 20050198822
    Abstract: A process for producing a die for forming a honeycomb structure having slits having hexagonal honeycomb cell shape 5 at one of surfaces 7 of a plate-like base material for die 2, and backside holes 4 each communicating with respective slits 5 at the other surface 8, which comprises the steps of forming holes 3 for dielectric fluid each having an opening diameter smaller than the width of the slit 5 in a predetermined depth at the one of surfaces 7 thereof, and holes 4 communicating with holes 3 at the rest surface 8; and then passing a dielectric fluid 10 for electrical discharge machining from the surface 8 to the surface 7 via holes 3 and 4 until the machining proceeds to a position communicating with each hole 4; thereby, the slits 5 are formed at the surface 7 of the base material 2.
    Type: Application
    Filed: March 7, 2005
    Publication date: September 15, 2005
    Applicant: NGK INSULATORS, LTD.
    Inventors: Masayuki Hironaga, Masanari Iwade, Seiichiro Hayashi
  • Publication number: 20050147707
    Abstract: Disclosed is a die (10) for forming a honeycomb body having a structure provided with groovy slits (2) on a front face thereof, the slits being formed by cell blocks (3) and back holes (4) on a back surface thereof, each hole being communicatively connected with the slit. The number N of the cell blocks per one side of the die is even number. According to the die for forming the honeycomb body, strain generated on an extruded face of the honeycomb body after extrusion and bending of the honeycomb body can be reduced as well as the die can maintain a stable frictional force of extrusion and is excellent in extrudability and wear resistance.
    Type: Application
    Filed: January 31, 2003
    Publication date: July 7, 2005
    Applicant: NGK INSULATORS, LTD.
    Inventors: Masayuki Nate, Takahisa Kaneko, Masayuki Hironaga, Yuji Deguchi
  • Publication number: 20050118296
    Abstract: There is disclosed a die (10) for forming a honeycomb body having a structure provided with groovy slits (2) on a front face thereof, the slits being formed by cell blocks (3) and back holes (4) on a back surface thereof, each hole being communicatively connected with the slit. The die (10) is made of cemented carbide having wear resistance. The cemented carbide is formed by compacting, followed by sintering at high temperature, metal carbide powder of transition metal element series with an iron group metal binder having toughness. A connection area ratio of the back hole (4) and the cell block (3) is 35 to 65%. According to the die for forming a honeycomb body and the die jig for forming a honeycomb body using the same, wear resistance of the die or the die jig can be enhanced when the raw material containing the material having very high hardness such as SiC and the like is extruded as well as the defect in shape of an extruded body due to wear of the die can be overcome.
    Type: Application
    Filed: January 31, 2003
    Publication date: June 2, 2005
    Applicant: NGK INSULATORS, LTD.
    Inventors: Takahisa Kaneko, Masayuki Nate, Masayuki Hironaga, Yuji Deguchi
  • Patent number: 6320150
    Abstract: Disclosed is a wire electric discharge machining apparatus comprising a wire-driving system for feeding a wire electrode while opposing it to a workpiece, and a power supply unit for supplying electric power to the wire electrode, wherein electric discharge is effected between the wire electrode and the workpiece to machine the workpiece to have an arbitrary shape. The wire electrode is allowed to approach the workpiece to effect the electric discharge between the wire electrode and the workpiece so that the workpiece is machined to have an arbitrary shape, while a suction mechanism is used to remove undesirable matters including sludge together with a working fluid via cylindrical members from holes formed in the workpiece.
    Type: Grant
    Filed: July 12, 1999
    Date of Patent: November 20, 2001
    Assignee: NGK Insulators, Ltd.
    Inventor: Masayuki Hironaga