Abstract: A manufacturing tool for an optical connector includes: a tool body that includes a concave part; a handle that includes an operating part and a contact part; and a connecting shaft that rotatably connects the handle to the tool body. The handle is rotatable between: a stand-by position, and a push-into position in which a larger portion of the contact part is disposed inside the concave part than in the stand-by position. A direction in which the operating part moves is different from a direction in which the contact part moves.

Abstract: A ferrule, for an optical connector, includes: a main body part formed with a fiber hole configured to accommodate insertion of an optical fiber. The main body part is formed of a material having a coefficient of linear expansion within a range of 1.7×10?5 to 3.0×10?5. A ratio of an inner diameter dh of the fiber hole to an outer diameter df of a cladding of the optical fiber is within a range of 99.632 [%]?dh/df?99.880 [%].

Abstract: The present invention provides a glass for semiconductor element coating including as a glass composition, in terms of mol %, 55% to 85% of SiO2, 12% to 40% of PbO, 0.1% to 10% of Al2O3, and 0.1% to 6% of GeO2+Ta2O5+Nb2O5+Bi2O3.

Abstract: Provided is a glass for semiconductor device coating, which is substantially free of an environmental load substance, is excellent in acid resistance, and has a low surface charge density while enabling coating at a firing temperature of 900° C. or less. The glass for semiconductor device coating of the present invention includes, as a glass composition, 40% to 65% of ZnO+SiO2, 7% to 25% of B2O3, 5% to 15% of Al2O3, and 8% to 22% of MgO, and is substantially free of a lead component.

Abstract: An optical connector includes: a ferrule that includes a connection end surface, and a fiber hole into which an optical fiber is configured to be inserted up to the connection end surface; a spring that is disposed on a rear side of the ferrule that is opposite to a front side that is a side on which the connection end surface is disposed in a longitudinal direction of the fiber hole; a spring push that sandwiches the spring with the ferrule and through which the optical fiber is inserted in the longitudinal direction; and a housing that accommodates the ferrule and the spring and that is engaged with the spring push such that the ferrule is biased to the front side by the spring. The optical fiber is configured to be inserted into and removed from the spring push.

Abstract: An optical connector includes: a ferrule having a fiber hole into which an optical fiber is inserted and a guide hole into which a guide pin is inserted; a housing that accommodates the ferrule; and a biasing member disposed in the housing and applies to the ferrule a biasing force directed toward a side close to an opening portion of the housing in an axial direction of the guide hole, the biasing force having nonlinear characteristics.

Abstract: A ferrule pin clamp used for a ferrule into which a guide pin is inserted includes: a main body including a pin holder that holds a groove portion of the guide pin. The pin holder includes a pair of arcs. A diameter of the pair of arcs: is smaller than a maximum shaft diameter of the guide pin, and is larger than a shaft diameter of the groove portion of the guide pin.

Abstract: An optical fiber pitch conversion jig for converting a pitch among optical fibers by inserting the optical fibers from a first end of the optical fiber pitch conversion jig and making the optical fibers protrude from a second end of the optical fiber pitch conversion jig, the optical fiber pitch conversion jig includes: a groove portion including grooves extending from the first end to the second end, a first linear part on a side closer to the first end and in which a pitch among the grooves is a first pitch, and a pitch change part that is continuous with the first linear part and in which the pitch widens to a second pitch larger than the first pitch. In the pitch change part, at least one of the grooves is curved.

Abstract: The glass for covering a semiconductor element contains: in mol %, as a glass composition, SiO2: 20% to 36%, ZnO: 8% to 40%, B2O3: 10% to 24%, Al2O3: 10% to 20%, and MgO+CaO: 8% to 22%, in which SiO2/ZnO is 0.6 or more and less than 3.3 in terms of a molar ratio, and a lead component is substantially not contained.

Abstract: A composite ceramic powder of the present invention includes: a LAS-based ceramic powder having precipitated therein ?-eucryptite or a ?-quartz solid solution as a main crystal; and TiO2 powder and/or ZrO2 powder.

Abstract: The present invention provides a ceramic powder, in which ?-eucryptite or a ?-quartz solid solution is precipitated as a main crystal phase, and which includes TiO2 and/or ZrO2.

Abstract: A cover glass for a hermetic package includes a sealing material layer on one surface. The sealing material layer satisfies one of the following relationships (1) to (6) between its center line length (LCL) and average width (WA): (1) when LCL is 150 mm or more, WA is 0.20% or more of LCL; (2) when LCL is 100 mm or more and less than 150 mm, WA is 0.30% or more of LCL; (3) when LCL is 75 mm or more and less than 100 mm, WA is 0.35% or more of LCL; (4) when LCL is 50 mm or more and less than 75 mm, WA is 0.40% or more of LCL; (5) when LCL is 25 mm or more and less than 50 mm, WA is 0.60% or more of LCL; and (6) when LCL is less than 25 mm, WA is 0.90% or more of LCL.

Abstract: Provided is a ceramic powder having precipitated therein ?-eucryptite or a ?-quartz solid solution as a main crystal phase, having an average particle diameter D50 of 20 ?m or less, and having a negative thermal expansion coefficient in a range of from 30° C. to 300° C.

Abstract: A glass for sealing of the present invention includes as a glass composition, in terms of mol %, 60% to 80% of SiO2, 8% to 5.8% of B2O3, 12% to 18.7% or Li2O+Na2O+K2O, and 2% to 12% of MgO+CaO+SrO+BaO, and has a molar ratio SiO2/B2O3 of 14 or more.

Abstract: A sealing material of the present invention is a sealing material for sealing a metal material, including 70 mass % to 100 mass % of glass powder including alkali silicate glass and 0 mass % to 30 mass % of ceramic powder, and having a linear thermal expansion coefficient in a temperature range of from 30° C. to 380° C. of more than 100×10?7/° C. and 170×10?7/° C. or less.

Abstract: A cover glass of the present invention includes a sealing material layer on one surface, wherein the sealing material layer has a gap formed therein.

Abstract: A composite ceramic powder of the present invention includes: a LAS-based ceramic powder having precipitated therein ?-eucryptite or a ?-quartz solid solution as a main crystal; and TiO2 powder and/or ZrO2 powder,.

Abstract: Provided is a ceramic powder having precipitated therein ?-eucryptite or a ?-quartz solid solution as a main crystal phase, having an average particle diameter D50 of 20 ?m or less, and having a negative thermal expansion coefficient in a range of from 30° C. to 300° C.

Abstract: The present invention provides a ceramic powder, in which ?-eucryptite or a ?-quartz solid solution is precipitated as a main crystal phase, and which includes TiO2 and/or ZrO2.

Abstract: A glass for sealing of the present invention includes as a glass composition, in terms of mol %, 60% to 80% of SiO2, 8% to 5.8% of B2O3, 12% to 18.7% or Li2O+Na2O+K2O, and 2% to 12% of MgO+CaO+SrO+BaO, and has a molar ratio SiO2/B2O3 of 14 or more.