Abstract: A rubbery composition is prepared by combining (A) a rubber component, (B) a cellulose, and (C) fluorene compound having a 9,9-bis(aryl)fluorene skeleton. The fluorene compound (C1) may be a compound represented by the following formula (1): wherein a ring Z represents an arene ring, R1 and R2 represent a substituent, X1 represents a heteroatom-containing functional group, k denotes an integer of 0 to 4, n denotes an integer of not less than 1, p denotes an integer of not less than 0. The rubbery composition has improved mechanical properties such as strength, elongation, and hardness.

Abstract: A film is high in water resistance and degradability and formed mainly of biodegradable resin. The film includes a thermoplastic resin (A), and a filler (B) in an amount of 1 to 70 mass % of the total mass, i.e. 100 mass %, of the film, and having a porosity of 80% or less, a tear strength of 200 mN or less in a direction, and a tensile strength of less than 15 MPa in a direction.

Abstract: A polylactic acid based film includes a composition containing a polylactic acid based resin (A), a thermoplastic resin other than polylactic acid based resin (B), and a compound treated with a surface treatment agent as filler (C), the polylactic acid based resin containing a crystalline polylactic acid based resin and an amorphous polylactic acid based resin, and resin (A) accounting for 10 to 95 mass % and resin (B) accounting for 5 to 90 mass % of a combined total of 100 mass % of resin (A) and resin (B), and filler (C) accounting for 10 to 400 parts by mass per a combined total of 100 parts by mass of resin (A) and resin (B).

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: A polylactic acid based film includes a composition containing a polylactic acid based resin (A), a thermoplastic resin other than polylactic acid based resin (B), and a compound treated with a surface treatment agent as filler (C), the polylactic acid based resin containing a crystalline polylactic acid based resin and an amorphous polylactic acid based resin, and resin (A) accounting for 10 to 95 mass % and resin (B) accounting for 5 to 90 mass % of a combined total of 100 mass % of resin (A) and resin (B), and filler (C) accounting for 10 to 400 parts by mass per a combined total of 100 parts by mass of resin (A) and resin (B).

Abstract: A temperature detection method for a semiconductor device and a power conversion apparatus are disclosed. A temperature detection device is used to detect the temperature for thermal protection of a power semiconductor device. The temperature detection device is placed in the proximity of a component having the power semiconductor device packaged therein, and either an emitter terminal or a collector terminal of the power semiconductor device. Since the temperature detection device is mounted on a circuit board, it does not require insulation from a cooling fin on which the power semiconductor device is mounted and lead wires can be eliminated.

Abstract: The solid-state imaging device according to the present invention includes: pixel units arranged two-dimensionally in rows and columns; signal holding units each holding an analog signal outputted from one of the pixel units in a corresponding one of the columns; and column AD circuits each converting, into a digital signal, the analog signal held by a corresponding one of said signal holding units. The signal holding units and the column AD circuits are respectively provided for the columns of the pixel units. Each of the signal holding units includes: a switching element connected to a column signal line through which the analog signal outputted from the one of the pixel units is transmitted; and a capacitor element holding the analog signal and being connected to the column signal line through the switching element.

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

Abstract: The solid-state imaging device includes: a first node for receiving a first signal from outside the solid-state imaging device; a second node for receiving a second signal from outside the solid-state imaging device; a test signal selection circuit for outputting the first signal received at the first node and the second signal received at the second node as a test signal by switching between the first and second signals at desired timing; and a test signal input circuit for supplying the test signal from the test signal selection circuit to an input of the A/D converter.

Abstract: For applications in a facility where a power conversion apparatus is frequently started and stopped, a power conversion apparatus and a power cycle longevity estimation method are provided which improve an ease of use of the facility. The power conversion apparatus comprises power conversion circuits to supply ac power of variable voltage and variable frequency, a detection circuit to detect a temperature of the power semiconductor in the power conversion circuits, and a computation device to calculate a power cycle longevity of the power semiconductor based on a maximum temperature rise detected by the detection circuit.

Abstract: The solid-state imaging device according to the present invention includes: pixel units arranged two-dimensionally in rows and columns; signal holding units each holding an analog signal outputted from one of the pixel units in a corresponding one of the columns; and column AD circuits each converting, into a digital signal, the analog signal held by a corresponding one of said signal holding units. The signal holding units and the column AD circuits are respectively provided for the columns of the pixel units. Each of the signal holding units includes: a switching element connected to a column signal line through which the analog signal outputted from the one of the pixel units is transmitted; and a capacitor element holding the analog signal and being connected to the column signal line through the switching element.

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: A solid state imaging device includes a plurality of pixels arranged in a matrix, a plurality of vertical signal lines VL arranged to correspond to columns of the pixels, respectively, such that each of them is connected to the pixels in each column and a column amplifier including a plurality of amplifiers AP. Each of the amplifiers AP includes a current source MOS transistor T1, an amplifying MOS transistor T2 for amplifying an image signal and a cascode MOS transistor T3 which is cascode-connected to the amplifying MOS transistor and outputs an amplified image signal between the cascode MOS transistor T3 and the current source MOS transistor T1. Gate terminals of the cascode MOS transistors T3 of the amplifiers AP are connected to each other.

Abstract: The invention provides a technique and a product in which for a frequency converter supplying electric power to, for example, a motor, a downsizing, lightening or the like of the frequency converter is realized while providing a filter apparatus reducing electromagnetic noises and the like. The filter apparatus reducing electromagnetic noises and the like is provided near a main circuit terminal board of the frequency converter, and the filter apparatus is connected directly to a main circuit terminal as a wiring drawing portion of the frequency converter. Part of a housing of the frequency converter and part of a filter housing are fitted to each other to fix the filter housing to the frequency converter.

Abstract: The solid-state imaging device includes: a first node for receiving a first signal from outside the solid-state imaging device; a second node for receiving a second signal from outside the solid-state imaging device; a test signal selection circuit for outputting the first signal received at the first node and the second signal received at the second node as a test signal by switching between the first and second signals at desired timing; and a test signal input circuit for supplying the test signal from the test signal selection circuit to an input of the A/D converter.

Abstract: Provided is a solid-state imaging device being capable of suppressing RTS noise and preventing decrease in S/N when a signal having a smaller value is converted to a digital signal. The solid-state imaging device includes: an imaging unit including pixels arranged in rows and columns; column amplifying units each amplifying a column signal with a variable gain, each of the column amplifying units being provided for each column of the imaging unit; column sample-hold units each selectively sample-holding and passing the column signal, the column signal being amplified by a corresponding one of the column amplifying units; and column AD conversion units each converting, using a ramp signal, the column signal representing a signal component and a reference component to a digital signal corresponding to a difference between the signal component and the reference component, the column signal being read from a corresponding one of said column sample-hold units.

Abstract: A frequency converter in which the inductance is reduced by enlarging the forms of bus bars which connect a P phase, an N phase of an inverter part and a positive electrode or a negative electrode of smoothing capacitors and the form of a wiring bus bar which connects an intermediate layer of capacitors which are connected in series to enlarge areas where they overlap each other, and by making currents flow in the opposite directions to each other.

Abstract: The present invention provides an electric power converter in which a tip portion of a cooling fin on an air flow inlet side is limited to flow a large quantity of air around a connection portion, where the fin efficiency is high, of a base surface of the cooling fin and the fin so that the cooling efficiency of the cooling fin can be improved. By providing the limiting member, air or atmosphere flowing into the cooling fin is directed to flow toward the fin near the base surface. Further, by providing the limiting member, an area of a portion from which the air or atmosphere flows into the cooling fin is also limited so that the velocity of the air or atmosphere flow becomes high. By these functions and the like, the cooling efficiency of the cooling fin can be increased as compared to the prior art.

Abstract: A power converter in which a filter apparatus is connected to a wiring drawing portion, said filter apparatus including: a condenser element having an electronic part having an insulator as a dielectric material held between conductor plates; a sealing agent sealing said condenser element; a filter circuit comprising said condenser element; a connection conductor establishing wiring connections of said filter circuit; and a filter housing supporting said sealing agent.