Abstract: A cylinder body includes a first guide surface made up from first guide grooves and a first bulging portion, wherein a slide table is displaceably supported on the first guide surface via a guide mechanism. Additionally, guide members of a guide block that constitutes the guide mechanism are inserted into and fixed within the first guide grooves. Further, the cylinder body is equipped with a second guide surface, which is formed with substantially the same shape as the first guide surface. In the event that the first guide surface is oriented upwardly and the slide table is installed thereon, the second guide surface acts as a mounting surface, whereas, in the event that the second guide surface is oriented upwardly and the slide table is installed thereon, the first guide surface acts as the mounting surface.

Abstract: A semiconductor device has a semiconductor element; an interposer substrate having a wiring pattern electrically connected to the semiconductor element and an insulating substrate formed with the wiring pattern; a connection layer for adhering between the semiconductor element and the interposer substrate; and a solder ball external terminal arranged on the interposer substrate. The insulating substrate is folded in a portion mounted with the external terminal arranged on an outer side to the semiconductor element, and the unfolded and folded portions of the insulating substrate are opposite each other to form a gap therebetween.

Abstract: An inner member having a supply port is installed at the inside of a housing, wherein the housing and the inner member are connected together by connecting bolts. Air is supplied to the supply port of the inner member and is directed and introduced through communication passages into an annular passage. Thereafter, the air is directed outwardly from a plurality of lead-out holes, which communicate with the annular passage, in a swirling direction with respect to an annular recess facing the workpiece. In addition, by having the air flow along the annular recess, which is formed with a substantially trapezoidal shape in cross section, the workpiece is maintained in a non-contact state with respect to a holding surface of the inner member.

Abstract: A multilayer semiconductor device has plural semiconductor devices, each having a circuit board for a ball grid array and a semiconductor chip provided on the board. The semiconductor boards are bonded together by a reflow mounting process to use a solder ball for interlayer connection so as to form a multilayer structure. The plural semiconductor devices each have a projection for restricting inclination of the circuit board, and the projection is provided between neighboring two of the circuit boards.

Abstract: A cylinder body includes a first guide surface made up from first guide grooves and a first bulging portion, wherein a slide table is displaceably supported on the first guide surface via a guide mechanism. Additionally, guide members of a guide block that constitutes the guide mechanism are inserted into and fixed within the first guide grooves. Further, the cylinder body is equipped with a second guide surface, which is formed with substantially the same shape as the first guide surface. In the event that the first guide surface is oriented upwardly and the slide table is installed thereon, the second guide surface acts as a mounting surface, whereas, in the event that the second guide surface is oriented upwardly and the slide table is installed thereon, the first guide surface acts as the mounting surface.

Abstract: A semiconductor device has a semiconductor element; an interposer substrate having a wiring pattern electrically connected to the semiconductor element and an insulating substrate formed with the wiring pattern; a connection layer for adhering between the semiconductor element and the interposer substrate; and a solder ball external terminal arranged on the interposer substrate. The insulating substrate is folded in a portion mounted with the external terminal arranged on an outer side to the semiconductor element, and the unfolded and folded portions of the insulating substrate are opposite each other to form a gap therebetween.

Abstract: An inner member having a supply port is installed at the inside of a housing, wherein the housing and the inner member are connected together by connecting bolts. Air is supplied to the supply port of the inner member and is directed and introduced through communication passages into an annular passage. Thereafter, the air is directed outwardly from a plurality of lead-out holes, which communicate with the annular passage, in a swirling direction with respect to an annular recess facing the workpiece. In addition, by having the air flow along the annular recess, which is formed with a substantially trapezoidal shape in cross section, the workpiece is maintained in a non-contact state with respect to a holding surface of the inner member.

Abstract: A multilayer semiconductor device has plural semiconductor devices, each having a circuit board for a ball grid array and a semiconductor chip provided on the board. The semiconductor boards are bonded together by a reflow mounting process to use a solder ball for interlayer connection so as to form a multilayer structure. The plural semiconductor devices each have a projection for restricting inclination of the circuit board, and the projection is provided between neighboring two of the circuit boards.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

Abstract: A tube joint including a joint body having a tube connection mechanism at one end and a coupling member coupled integrally with the other end of the joint body, where the tube connection mechanism is provided with a packing surrounding an outer surface of a tube to be inserted to function as a seal, and a stopper member for fixing the packing to prevent sliding movement.

Abstract: Disclosed is a pressure-adjusting mechanism comprising a pressure-adjusting handle, a pressure-adjusting screw for adjusting resilient force of a spring member by making rotation integrally with the pressure-adjusting handle, and a pressure-setting scale for indicating a preset pressure value by rotating the pressure-adjusting handle in a predetermined direction. As a result, it is possible to obtain the pressure-adjusting mechanism which is constructed integrally with a pressure control valve owing to a simple structure and which makes it possible to easily adjust the pressure by an operator.

Abstract: A semiconductor chip is mounted on a tape carrier by interposing an elastmer layer therebetween, so that thermal stress caused by a difference of thermal expansion coefficients of the semiconductor chip and the tape carrier is relieved. The tape carrier is structured by an insulating film and a plurality of leads formed on the insulating film. The insulating film has an opening for bonding the plurality of leads to the electrodes of the semiconductor chip, and the elastmer layer comprises first and second elastmer layers provided on the opposite sides of the opening to be separated around at least one end of the opening. The opening may be divided into a plurality of openings, in each of which a corresponding one or some of connected portions of the plurality of leads and the electrodes of the semiconductor chip are positioned, and sealing resins are filled in the plurality of openings to seal the connected portions.

Abstract: Disclosed is an actuator control circuit which adopts a meter-in control system to control the displacement speed of a piston of a pneumatic cylinder and which is provided with a first pressure control valve to be in a free flow state when compressed air is supplied to the pneumatic cylinder and a second pressure control valve for retaining discharge pressure of compressed air discharged from the pneumatic cylinder to be a previously set predetermined pressure.

Abstract: Disclosed is a pressure/flow rate control valve comprising a valve-opening/closing section having a valve plug which is installed with an elastic member having a substantially tapered cross section at one end, a stem which is displaceable integrally with the valve plug and which is installed with a packing disposed between a pair of disk sections separated from each other by a predetermined spacing distance, and a spring member which is fastened to one end of the stem, for seating the valve plug on an annular projection in accordance with the action of resilient force.

Abstract: Disclosed is a pressure/flow rate control valve comprising a pressure-adjusting section having a valve plug for reducing the pressure of a pressure fluid flowing through a clearance between a hole and itself, a stem which is displaceable integrally with the valve plug and which is installed with a packing, and a spring member which is fastened to one end of the stem, for pressing the valve plug toward an annular projection formed on an inner wall surface of a first valve body.

Abstract: Pinching of the fingers of an air chuck is prevented during opening or closing in order to allow them to open or close smoothly and to miniaturize the air chuck. In a linear guide air chuck having a rod that is operated by an air cylinder mechanism; a pair of fingers is provided that can be opened and closed to grip a workpiece; a guide mechanism moves the fingers linearly to open or close them; and a pair of levers convert operation of the rod into the opening and closing operation of both fingers the lever and finger being coupled together by fitting a spherical engagement element formed on the lever so, in a circular engagement hole cut in the top surface of the finger, at a position at which the acting force of the lever can be transmitted to the finger at nearly the same height as that of the guide mechanism.

Abstract: A chuck device has a pair of grippers pivotally supported in a recess defined in an end of a body for angular movement about a predetermined angle, a joint member connected to a piston reciprocally movably disposed in a cylinder chamber defined in the body, and a pair of rollers engaging respectively in grooves in the grippers and angularly movably mounted on the joint member. Linear movement of the piston can be transmitted as angular movement to the grippers through the rollers while the rollers are angularly moving with respect to the joint member. A cover is mounted on the end of the body in closing relation to the recess.

Abstract: A control for a vehicle fitted with an internal combustion engine as a power source. At the time of a driver deceleration intention (when travelling downhill), then with an arrangement where the opening control for the throttle valve and the fuel supply control (fuel cut off control or the like) are automatically controlled in order to obtain a predetermined target vehicle acceleration, when the intention of the driver shifts from a deceleration intention to a non deceleration intention, and hence the automatic control reverts to normal control, the fuel supply control is returned to normal control once the throttle valve opening has reached a predetermined opening. In this way, it is possible to avoid the situation where for example, the fuel supply control reverts to normal control with the throttle valve opened more than necessary. Consequently the occurrence of shock or an unintended acceleration due to a mismatch in the throttle opening at the time of reverting to normal control can be suppressed.

Abstract: A linear actuator comprising a guide section formed along a longitudinal direction to protrude on a bottom surface of a slide table, a pair of guide blocks formed mutually opposingly and seperated from each other by a predetermined spacing distance on an upper surface of the main cylinder body, attachment holes for attaching the main cylinder body to another member in any direction of attachment from a side of the slide table or from a side of the main cylinder body, and an adjuster bolt for adjusting an amount of displacement of the slide table.