Abstract: According to one embodiment, a semiconductor memory device includes first-third conductive layers, a semiconductor layer, a resistance change layer and a metal-containing layer. The second conductive layer is separated from the first conductive layer in a first direction. The semiconductor layer is provided between the first and the second conductive layers. The third conductive layer is arranged with the first semiconductor layer in a direction crossing the first direction. The first resistance change layer is provided between the first semiconductor layer and the first conductive layer. The first metal-containing layer is provided between the first resistance change layer and the first conductive layer. The first conductive layer extends in a second direction crossing the first direction. The second conductive layer extends in a third direction crossing the first direction and crossing the second direction. The third conductive layer extends in a direction crossing the first direction.

Abstract: According to one embodiment, a semiconductor device includes a substrate; a first interconnect portion provided on the substrate and including a plurality of interconnect layers separately stacked each other; a second interconnect portion provided separately from the first interconnect portion on the substrate and including the plurality of interconnect layers having a number of stacked layers same as a number of stacked layers of the first interconnect portion; a first pillar provided adjacent to the first interconnect portion and the second interconnect portion and extending in a stacking direction of the plurality of interconnect layers; and a plurality of conductive layers. The plurality of conductive layers is separately stacked each other, surrounding a side surface of the first pillar, and electrically connected to the first interconnect portion and the second interconnect portion.

Abstract: According to one embodiment, a device includes: word lines extending in a first direction, widths of the word lines in a second direction intersecting the first direction having a first width and a second width greater than the first width; bit lines provided above or under the word lines, the bit lines extending in the second direction, widths of the bit lines in the first direction having a third width and a forth width greater than the third width; storage elements; and a control circuit applying a potential for at least one of a plurality of non-selected word lines and a plurality of non-selected bit lines other than a selected word line and a selected bit line connected to a selected storage element, among the word lines and the bit lines, the potential applied thereto according to a width thereof.

Abstract: This nonvolatile semiconductor memory device comprises a memory cell array configured having a plurality of memory mats arranged therein, each of the memory mats having a memory cell disposed therein at an intersection of a first line and a second line, the memory cell including a first variable resistance element. A third line extends through a plurality of the memory mats. A second variable resistance element is connected between the third line and the second line of each of the plurality of memory mats.

Abstract: A nonvolatile memory device according to an embodiment includes: a semiconductor substrate; a memory cell array unit provided on an upper side of the semiconductor substrate; an integrated circuit unit provided between the memory cell array unit and the semiconductor substrate; and a peripheral circuit unit provided on the semiconductor substrate. The integrated circuit unit includes: a first contact electrode electrically connected to one of plurality of first interconnection layers; a second contact electrode connected to the peripheral circuit unit; and a first switching element connected between the first contact electrode and the second contact electrode, and conduction between the first contact electrode and the second contact electrode being controlled by a control circuit unit provided in the peripheral circuit unit.

Abstract: A nonvolatile memory device includes: a first interconnection extending in a first direction; a second interconnection extending in a second direction, and a lower end of the second interconnection being located above the first interconnection; a plurality of third interconnections extending in a third direction, and the third interconnections being arranged in the second direction; a current limitation layer provided between the second interconnection and the third interconnections; a metal ion source layer provided between the current limitation layer and the third interconnections; a resistance change layer provided between the current limitation layer and the third interconnections; and a selector provided between the first interconnection and the lower end of the second interconnection.

Abstract: This nonvolatile semiconductor memory device comprises a memory cell array configured having a plurality of memory mats arranged therein, each of the memory mats having a memory cell disposed therein at an intersection of a first line and a second line, the memory cell including a first variable resistance element. A third line extends through a plurality of the memory mats. A second variable resistance element is connected between the third line and the second line of each of the plurality of memory mats.

Abstract: According to an embodiment, a nonvolatile semiconductor memory device includes a plurality of memory cells and a control circuit. The memory cell includes a semiconductor layer, a gate insulating layer, a floating gate, a lower control gate, and an upper control gate. The semiconductor layer extends in a certain direction. The lower control gate is formed on the floating gate via an insulating layer. The upper control gate is formed on the lower control gate via an insulating layer. In addition, the control circuit, when performing a write operation, applies a first pass voltage to the upper control gate in a selected memory cell, and applies a first write voltage which is larger than the first pass voltage to the upper control gate in an adjacent memory cell formed on an identical semiconductor layer to the selected memory cell and adjacent to the selected memory cell.

Abstract: This nonvolatile semiconductor memory device comprises a memory cell array configured having a plurality of memory mats arranged therein, each of the memory mats having a memory cell disposed therein at an intersection of a first line and a second line, the memory cell including a first variable resistance element. A third line extends through a plurality of the memory mats. A second variable resistance element is connected between the third line and the second line of each of the plurality of memory mats.

Abstract: A semiconductor memory includes: a plurality of active regions AAi, AAi?1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of non-uniformly arranged word line patterns WL1, WL2, . . . , extending along the row length; a plurality of select gate line patterns SG1, SG2, . . . , arranged parallel to the plurality of word line patterns; borderless contacts formed near the ends of the word line patterns on the memory cell array, in contact with part of an interconnect extended from the end of the memory cell array, but not in contact with interconnects adjacent to that interconnect; and bit line contacts formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.

Abstract: This nonvolatile semiconductor memory device comprises a memory cell array configured having a plurality of memory mats arranged therein, each of the memory mats having a memory cell disposed therein at an intersection of a first line and a second line, the memory cell including a first variable resistance element. A third line extends through a plurality of the memory mats. A second variable resistance element is connected between the third line and the second line of each of the plurality of memory mats.

Abstract: A nonvolatile semiconductor memory includes first and second memory cells having a floating gate and a control gate. The floating gate of the first and second memory cells is comprised a first part, and a second part arranged on the first part, and a width of the second part in an extending direction of the control gate is narrower than that of the first part. A first space between the first parts of the first and second memory cells is filled with one kind of an insulator. The control gate is arranged at a second space between the second parts of the first and second memory cells.

Abstract: A nonvolatile semiconductor memory includes a memory cell transistor including a first floating gate electrode layer formed on a first tunneling insulating film, a first inter-gate insulating film, first and second control gate electrode layers, and a first metallic silicide film; a high voltage transistor including a high voltage gate electrode layer formed on a high voltage gate insulating film, a second inter-gate insulating film having an aperture, third and fourth control gate electrode layers, and a second metallic silicide film; a low voltage transistor including a second floating gate electrode layer formed on a second tunneling insulating film, a third inter-gate insulating film having an aperture, fifth and sixth control gate electrode layers, and a third metallic silicide film; and a liner insulating film directly disposed on source and drain regions of each of the memory cell transistor, the low voltage transistor, and the high voltage transistor.

Abstract: A storage device includes a recording medium, a probe, a substrate, and a processing unit. The recording medium stores a signal. The probe reads or writes the signal to/from the recording medium. The substrate is provided with the probe via a conductive anchor interposed therebetween and a first connection terminal connected to the probe. The processing unit is provided on the substrate and has a second connection terminal. The second connection terminal is connected to the first connection terminal.

Abstract: In general, according to one embodiment, a semiconductor memory device includes active areas extending in a first direction, tunnel films provided on the active areas, floating gate electrodes provided on the tunnel films, an interelectrode insulating film provided on the floating gate electrodes and extending in a second direction, a control gate electrode provided on the interelectrode insulating film and extending in the second direction, a lower insulating portion provided between the active areas, between the tunnel films, and between the floating gate electrodes adjacent in the second direction, and an upper insulating portion provided between the lower insulating portion and the interelectrode insulating film. The lower insulating portion includes a void. Relative dielectric constant of the upper insulating portion is higher than that of the lower insulating portion. Relative dielectric constant of the interelectrode insulating film is higher than that of the upper insulating portion.

Abstract: A nonvolatile semiconductor memory includes first and second memory cells having a floating gate and a control gate. The floating gate of the first and second memory cells is comprised a first part, and a second part arranged on the first part, and a width of the second part in an extending direction of the control gate is narrower than that of the first part. A first space between the first parts of the first and second memory cells is filled with one kind of an insulator. The control gate is arranged at a second space between the second parts of the first and second memory cells.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of memory cell blocks, a plurality of first wirings, a plurality of second wirings, and a contact. Each of the memory cell blocks includes a plurality of memory cell units. Each of the plurality of memory cell units includes a plurality of memory cells and is provided in a first direction at a prescribed spacing. The plurality of memory cell blocks is arranged in a second direction intersecting with the first direction. The plurality of first wirings extends in the second direction and is provided in the first direction at a prescribed spacing. The plurality of second wirings is provided at least one of above and below the first wiring. The contact is provided at both end portions of the second wiring in the second direction and connects the first wiring to the second wiring. A width dimension of the second wiring along the first direction is larger than a width dimension of the first wiring along the first direction.

Abstract: According to one embodiment, a device includes a semiconductor substrate, a first region including a first well which is formed in substrate, a second well which is formed in substrate and on first well, and a memory cell which is formed on second well, and a second region including a third well which is formed in substrate, and a first transistor which is formed on third well. The device includes a third region including a second transistor which is formed on semiconductor substrate, and a fourth region including a fourth well which is formed in semiconductor substrate, a fifth well which is formed in substrate and on fourth well, and a third transistor which is formed on fifth well. Bottoms of first well and fourth well are lower than a bottom of third well, and bottom of third well is lower than bottoms of second well and fifth well.

Abstract: A nonvolatile semiconductor memory includes first and second memory cells having a floating gate and a control gate. The floating gate of the first and second memory cells is comprised a first part, and a second part arranged on the first part, and a width of the second part in an extending direction of the control gate is narrower than that of the first part. A first space between the first parts of the first and second memory cells is filled with one kind of an insulator. The control gate is arranged at a second space between the second parts of the first and second memory cells.

Abstract: A semiconductor memory includes: a plurality of active regions AAi, AAi?1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of non-uniformly arranged word line patterns WL1, WL2, . . . , extending along the row length; a plurality of select gate line patterns SG1, SG2, . . . , arranged parallel to the plurality of word line patterns; borderless contacts formed near the ends of the word line patterns on the memory cell array, in contact with part of an interconnect extended from the end of the memory cell array, but not in contact with interconnects adjacent to that interconnect; and bit line contacts formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.