Patents by Inventor Masayuki Kaneto

Masayuki Kaneto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110071377
    Abstract: A circuit board for body fluid collection includes a belt-like supporting substrate, and a plurality of measurement units defined in the supporting substrate along the longitudinal direction of the supporting substrate. The measurement units each include a puncture needle formed from the supporting substrate along the longitudinal direction of the supporting substrate by forming an opening in the supporting substrate, an insulating base layer formed on the supporting substrate, and a conductive layer formed on the insulating base layer and including an electrode for making contact with a body fluid collected by puncturing with the puncture needle.
    Type: Application
    Filed: January 9, 2009
    Publication date: March 24, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Tetsuya Ohsawa, Saori Ishigaki, Toshiki Naito
  • Patent number: 7858543
    Abstract: In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m?1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).
    Type: Grant
    Filed: August 6, 2007
    Date of Patent: December 28, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Naoyuki Matsuo, Atsushi Hino, Masayuki Kaneto
  • Publication number: 20100324393
    Abstract: A circuit board for body fluid collection includes a measurement unit including a puncture needle and an electrode for making contact with the body fluid collected by the puncturing with the puncture needle, wherein the measurement unit is provided in a plural number and disposed radially on a same plane.
    Type: Application
    Filed: January 21, 2009
    Publication date: December 23, 2010
    Applicant: Nitto Denko Corporation
    Inventor: Masayuki Kaneto
  • Publication number: 20100292610
    Abstract: A circuit board for body fluid collection includes a circuit board portion including an insulating layer and a conductor pattern which is supported by the insulating layer and in which an electrode, a terminal to be connected to a device for measuring the component of a body fluid, and a wire which electrically connects the electrode and the terminal are integrally provided. The circuit board for body fluid collection comprises a puncture needle for extracting the body fluid by performing puncturing, which is formed integrally with the circuit board portion and which is protruded from the circuit board portion, and a guard portion for guarding the tip of the puncture needle, which is arranged in opposition to the puncture needle in the lower flow side in the puncture direction of the puncture needle.
    Type: Application
    Filed: March 19, 2008
    Publication date: November 18, 2010
    Inventors: Jun Ishii, Toshiki Naito, Masayuki Kaneto, Tetsuya Ohsawa
  • Publication number: 20100130886
    Abstract: A circuit board for body fluid collection is provided with an insulating layer, a puncture needle supported by the insulating layer and a conductor pattern that integrally has an electrode which is supported by the insulating layer and brings body fluid collected by puncture of the puncture needle into contact with the board, a terminal connected to a device measuring a component of body fluid and wiring for electrically connecting the electrode and the terminal.
    Type: Application
    Filed: March 12, 2008
    Publication date: May 27, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Hirokazu Iwasaki, Jun Ishii, Toshiki Naito
  • Patent number: 7632236
    Abstract: The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: December 15, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20090191410
    Abstract: In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m?1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).
    Type: Application
    Filed: March 24, 2009
    Publication date: July 30, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoyuki Matsuo, Atsushi Hino, Masayuki Kaneto
  • Publication number: 20080085420
    Abstract: In a resin joined body including at least one member made of a resin material that forms a first resin layer and a second resin layer, the at least one of the first and second resin layers having the rear side from which the laser beam has been irradiated has an absorption constant of 50 to 5000 m?1 for the wavelength of the laser beam, and the fuse bonded portion is formed to have a relationship of X>Y, wherein a light transmittance of light passing from the first resin layer to the second resin layer via the fused portion is designated as X(%), and a light transmittance of light passing continuously from the first resin layer to the second resin layer via a portion other than the fused portion is designated as Y(%).
    Type: Application
    Filed: August 6, 2007
    Publication date: April 10, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoyuki MATSUO, Atsushi HINO, Masayuki KANETO
  • Patent number: 7351914
    Abstract: The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: April 1, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20060244177
    Abstract: The present invention provides a flexible printed circuit board 100 having a band-like meander pattern as a whole, which includes multiple linear parts 1 configured in about parallel to each other and a folding margin connected to one end in the longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin 2 is double-folded at the about center thereof, and, at the folding margin 2, either of the two linear parts 1 connected to the folding margin 2 is folded back in the direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus, which improves the degree of freedom of movement in a tube.
    Type: Application
    Filed: April 18, 2006
    Publication date: November 2, 2006
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20060129061
    Abstract: The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 15, 2006
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Patent number: 6373000
    Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: April 16, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Megumu Nagasawa, Takuji Okeyui, Masayuki Kaneto, Shinya Ota
  • Publication number: 20010004944
    Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.
    Type: Application
    Filed: December 14, 2000
    Publication date: June 28, 2001
    Inventors: Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Megumu Nagasawa, Takuji Okeyui, Masayuki Kaneto, Shinya Ota
  • Patent number: 5575662
    Abstract: A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.
    Type: Grant
    Filed: August 11, 1994
    Date of Patent: November 19, 1996
    Assignee: Nitto Denko Corporation
    Inventors: Yasuhiko Yamamoto, Isao Ohki, Junji Yoshida, Hideo Yamashita, Kazuo Ouchi, Masayuki Kaneto
  • Patent number: 5411779
    Abstract: The present invention relates to a composite tubular article for use as the fixing belt in an image-forming device such as a copying machine etc., particularly as a fixing belt suited for thermal fixing, and also relates to a process for producing the same.Conventionally known as an image-fixing belt is a belt consisting of a polyimide resin as the inner layer and a fluoroplastic as the outer layer. However, this fixing belt has problems that clear images cannot be obtained because the thickness of each layer is uneven, and that unglossed, so-called matt images cannot be obtained because the belt surface is smooth.This invention provides a composite tubular article comprising a tubular inner layer made of a polyimide resin and a tubular outer layer made of a fluoroplastic, the outer circumferential surface of the fluoroplastic tubular outer layer having a surface roughness of 1 to 10 .mu.m.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: May 2, 1995
    Assignee: Nitto Denko Corporation
    Inventors: Toshio Nakajima, Masayuki Kaneto, Toshihiko Tomita, Tokio Fujita, Hitoshi Ishizaka, Chiaki Harada, Gosei Uemura, Taizo Sasaki, Masao Nakamura, Mamoru Hondo, Tadanori Michimoto, Toshiaki Iwamoto
  • Patent number: 5374469
    Abstract: A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
    Type: Grant
    Filed: September 17, 1992
    Date of Patent: December 20, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Atsushi Hino, Amane Mochizuki, Kazuo Ouchi, Shoji Morita, Toshiki Naito, Kazumi Higashi, Masako Maeda, Masayuki Kaneto, Munekazu Tanaka, Masakazu Sugimoto