Patents by Inventor Masayuki Komaru

Masayuki Komaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed board and manufacturing method thereof
    Patent number: 7479013
    Abstract: A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: January 20, 2009
    Assignee: U-AI Electronics Corporation
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno
  • Print board and manufacturing method thereof
    Publication number: 20080282538
    Abstract: A method for manufacturing such a printed board with high efficiency is disclosed. The printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Application
    Filed: June 11, 2008
    Publication date: November 20, 2008
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno
  • Printed Board And Manufacturing Method Thereof
    Publication number: 20080076276
    Abstract: A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
    Type: Application
    Filed: February 28, 2005
    Publication date: March 27, 2008
    Inventors: Masanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno