Abstract: A connection structure including: a first circuit member having a plurality of first electrodes; a second circuit member having a plurality of second electrodes; and an intermediate layer having a plurality of bonding portions electrically connecting the first electrodes and the second electrodes, in which at least one of the first electrode and the second electrode that are connected by the bonding portion is a gold electrode, and 90% or more of the plurality of bonding portions include a first region containing a tin-gold alloy and connecting the first electrode and the second electrode and a second region containing bismuth and being in contact with the first region.

Abstract: In an on-vehicle control device, control units of multiple sections forming a redundant section include fail-safe calculation units that complement each other by respective calculation results. The control united in which the fail-safe calculation units are disposed are configured as a collective aggregate, the control units include calculation boards configured to perform calculation processing on the multiple sections, respectively, and output boards configured to output calculation results of the calculation processing by the calculation boards, and a common unit including a common interface connected to a plurality of the output boards respectively corresponding to the multiple sections is aggregated in a partial specific region of the aggregate.

Abstract: A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 ?m and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H1, and a height of the solder particle is designated as H2, H1<H2 is established.

Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.

Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.

Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.

Abstract: A semiconductor device has a plurality of external connection lead terminals including an input lead terminal, an output lead terminal, and an RF grounding lead terminal, a heat dissipation plate connected to the RF grounding lead terminal, a semiconductor device and a printed circuit board each mounted on the heat dissipation plate, and a mold resin for sealing the semiconductor device, the printed circuit board, and the heat dissipation plate such that at least a part of the back surface of the heat dissipation plate is exposed. The semiconductor device amplifies a signal inputted to the input lead terminal and outputs the amplified signal from the output lead terminal.

Abstract: The conventional feedforward amplifier is unable to suppress distortion components efficiently. The present invention provides a feedforward amplifier wherein the vector adjustor is adjusted so that (1) suppression is performed on only the distortion component generated within a predetermined frequency range out of the range of frequencies to be suppressed in which distortion components to be suppressed occur or (2) the suppression of the distortion component generated within the predetermined frequency range is greater than the suppression of the distortion component generated within the frequency range other than the predetermined frequency range out of the range of frequencies to be suppressed, and the pre-distortion circuit is adjusted so that at least the distortion component generated within the frequency range other than the predetermined frequency range is suppressed.

Abstract: It is difficult that the impedance of the circuit part on the output side of an amplifying element at the frequency of a modulating wave is lower, and consequently, it is difficult to more effectively use the linearity of the amplifying element. The phase of a signal of the frequency of the modulating wave included in an amplified signal output from a FET is inverted by a difference frequency inverting circuit. The inverted signal of the frequency of the modulating wave and a signal of the frequency of a modulated wave included in an amplified signal output from a FET cancel each other out at the drain of the FET. At the drain end of the FET, the signal of the frequency of the modulating wave included in the amplified signal of the FET and a signal of the frequency of the modulating wave output from the FET cancel each other out.

Abstract: A balun design incorporating the functions of a splitter (combiner) which can be employed in a high power amplifier circuit configuration. The balun is formed of a dielectric multilayer board with conductor patterns on each conductor pattern layer. The balun includes the propagation of a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal. The balun provides the output signals at the first and second opposite-phase output terminals 180° out of phase employing through holes in the main line and coupling lines for promoting electromagnetic coupling therebetween.

Abstract: The conventional feedforward amplifier is unable to suppress distortion components efficiently. The present invention provides a feedforward amplifier wherein the vector adjustor is adjusted so that (1) suppression is performed on only the distortion component generated within a predetermined frequency range out of the range of frequencies to be suppressed in which distortion components to be suppressed occur or (2) the suppression of the distortion component generated within the predetermined frequency range is greater than the suppression of the distortion component generated within the frequency range other than the predetermined frequency range out of the range of frequencies to be suppressed, and the pre-distortion circuit is adjusted so that at least the distortion component generated within the frequency range other than the predetermined frequency range is suppressed.

Abstract: A high power amplifier has a first balun propagating a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal; first and second power amplifier circuits connected to the first and second opposite-phase output terminals of the first balun and having the same characteristics;a third power amplifier circuit connected to the in-phase output terminal of the first balun and having output power substantially twice as much as the output power of the first or second power amplifier circuit; and a second balun having first and second opposite-phase input terminals for receiving the outputs of the first and second power amplifier circuits, having an in-phase input terminal for receiving the output of the third power amplifier circuit, combining the outputs of th

Abstract: A feedforward amplifier includes a first power splitter for dividing an input signal into two paths. The first path, in sequence, includes a first vector adjuster, a main amplifier, a second power splitter and a delay circuit. The second path, in sequence, includes a delay circuit, a distortion detecting power combiner, a second vector adjuster and an error amplifier. The distortion detecting power combiner combines a portion of a signal from the first path with a signal in the second path. Each vector adjuster adjusts amplitude and phase of a signal in each path. A distortion suppression power combiner synthesizes a signal in the first path with a signal in the second path. Control is included for stopping operation of the error amplifier or main amplifier based on a predetermined condition.

Abstract: A high power amplifier has a first balun propagating a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal; first and second power amplifier circuits connected to the first and second opposite-phase output terminals of the first balun and having the same characteristics; a third power amplifier circuit connected to the in-phase output terminal of the first balun and having output power substantially twice as much as the output power of the first or second power amplifier circuit; and a second balun having first and second opposite-phase input terminals for receiving the outputs of the first and second power amplifier circuits, having an in-phase input terminal for receiving the output of the third power amplifier circuit, combining the outputs of t

Abstract: A balun design incorporating the functions of a splitter (combiner) which can be employed in a high power amplifier circuit configuration. The balun is formed of a dielectric multilayer board with conductor patterns on each conductor pattern layer. The balun includes the propagation of a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal. The balun provides the output signals at the first and second opposite-phase output terminals 180° out of phase employing through holes in the main line and coupling lines for promoting electromagnetic coupling therebetween.

Abstract: To reduce the size of a multi-carrier transmitter circuit for a mobile communication base station, by suppressing instantaneous peak output power to a small value with respect to a wide-band signal of a few MHz to tens of MHz so that the peak factor of a multi-carrier signal is reduced.

Abstract: It is difficult that the impedance of the circuit part on the output side of an amplifying element at the frequency of a modulating wave is lower, and consequently, it is difficult to more effectively use the linearity of the amplifying element. The phase of a signal of the frequency of the modulating wave included in an amplified signal output from a FET is inverted by a difference frequency inverting circuit. The inverted signal of the frequency of the modulating wave and a signal of the frequency of a modulated wave included in an amplified signal output from a FET cancel each other out at the drain of the FET. At the drain end of the FET, the signal of the frequency of the modulating wave included in the amplified signal of the FET and a signal of the frequency of the modulating wave output from the FET cancel each other out.

Abstract: A balun design incorporating the functions of a splitter (combiner) which can be employed in a high power amplifier circuit configuration. The balun is formed of a dielectric multilayer board with conductor patterns on each conductor pattern layer. The balun includes the propagation of a half of an input signal to an in-phase output terminal, and also propagating a fourth of the input signal to first and second opposite-phase output terminals, the signal propagated to the first and second opposite-phase output terminals lagging 180 degrees behind the signal propagated to the in-phase output terminal. The balun provides the output signals at the first and second opposite-phase output terminals 180° out of phase employing through holes in the main line and coupling lines for promoting electromagnetic coupling therebetween.

Abstract: A power amplifier that reduces intermodulation distortion generated by the amplifier while reducing the number of parts is provided. A power amplifier comprises a first balun, to which a combined signal combining two signals of different frequencies is inputted, and which outputs, based on the combined signal, the first and the second signal whose phase are opposite; a first amplifier that outputs the first amplified signal containing the differential frequency component comprising the difference of the frequencies of two signals from the first signal; a second amplifier that outputs the second amplified signal containing the component comprising the difference of the frequencies of two signals from the second signal; and a second balun that outputs the combined signal of the first and the second amplified signals. The component contained in the first and the second amplified signal are inputted via the second and the first amplifier, respectively, to reduce the component.

Abstract: A feedforward amplifier includes a first power splitter for dividing an input signal into two paths. The first path, in sequence, includes a first vector adjuster, a main amplifier, a second power splitter and a delay circuit. The second path, in sequence, includes a delay circuit, a distortion detecting power combiner, a second vector adjuster and an error amplifier. The distortion detecting power combiner combines a portion of a signal from the first path with a signal in the second path. Each vector adjuster adjusts amplitude and phase of a signal in each path. A distortion suppression power combiner synthesizes a signal in the first path with a signal in the second path. Control is included for stopping operation of the error amplifier or main amplifier based on a predetermined condition.