Patents by Inventor Masayuki Miyoshi
Masayuki Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929858Abstract: A communication system includes a communication apparatus and a base station. The communication apparatus includes a Discrete Fourier Transform (DFT) transformer which transforms a time-domain signal into a frequency-domain signal with a DFT size that is a product of powers of a plurality of values; a mapper which maps the frequency-domain signal on a plurality of frequency bands, each frequency band being located at a position separate from position(s) of other(s) of the plurality of frequency bands; and a signal generator which generates a single carrier-frequency division multiple access (SC-FDMA) time-domain signal from the mapped signal. The base station includes a receiver which receives the SC-FDMA time-domain signal; a combiner which generates the frequency-domain signal from the SC-FDMA time-domain signal; and a transformer which transforms the frequency-domain signal into the time-domain signal with an inverse Discrete Fourier Transform (IDFT) having the DFT size.Type: GrantFiled: January 3, 2023Date of Patent: March 12, 2024Assignee: Sun Patent TrustInventors: Shinsuke Takaoka, Masayuki Hoshino, Kenichi Miyoshi
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Patent number: 11345808Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.Type: GrantFiled: July 18, 2018Date of Patent: May 31, 2022Assignee: TORAY INDUSTRIES, INC.Inventors: Eiki Takahashi, Daisuke Konishi, Masayuki Miyoshi, Noriyuki Hirano
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Patent number: 11186692Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.Type: GrantFiled: April 14, 2020Date of Patent: November 30, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Patent number: 11186691Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.Type: GrantFiled: April 14, 2020Date of Patent: November 30, 2021Assignee: TORAY INDUSTRIES, INC.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Publication number: 20210198417Abstract: An epoxy resin composition comprises components [A] to [C]. The component [C] is a component [c1] or [c2] and the rubbery state elastic modulus of a cured article produced by curing the epoxy resin composition in a dynamic viscoelasticity evaluation is 10 MPa or less. Component[A] is a phenyl glycidyl ether substituted by a tert-butyl group, a sec-butyl group, an isopropyl group or a phenyl group. Component [B] is a bifunctional or higher aromatic epoxy resin. Component [C] is a curing agent selected from component [c1], which is an acid anhydride-type curing agent and component [c2], which is an aliphatic amine-type curing agent.Type: ApplicationFiled: December 21, 2016Publication date: July 1, 2021Applicant: TORAY INDUSTRIES, INC.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Publication number: 20200239648Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. Another purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.Type: ApplicationFiled: April 14, 2020Publication date: July 30, 2020Applicant: Toray Industries, Inc.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Publication number: 20200239649Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C. or higher.Type: ApplicationFiled: April 14, 2020Publication date: July 30, 2020Applicant: Toray Industries, Inc.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Patent number: 10696805Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C.Type: GrantFiled: June 22, 2016Date of Patent: June 30, 2020Assignee: Toray Industries, Inc.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Publication number: 20200140676Abstract: The present invention aims to provide an epoxy resin composition that is high in both fast curability and storage stability, a prepreg prepared by using the epoxy resin composition, and a fiber reinforced composite material prepared by curing the prepreg. The epoxy resin composition contains the following components [A], [B], [C], and [D] and meets the following requirements [a], [b], and [c]: [A]: epoxy resin, [B]: dicyandiamide, [C]: aromatic urea, [D]: borate ester, [a]: 0.014?(content of component [D]/content of component [C])?0.045, [b]: 0.9?(number of moles of active groups in component [A]/number of moles of active hydrogen in component [B])?1.2, and [c]: 14?(content of component [A]/content of component [C])?25.Type: ApplicationFiled: July 18, 2018Publication date: May 7, 2020Applicant: Toray Industries, Inc.Inventors: Eiki Takahashi, Daisuke Konishi, Masayuki Miyoshi, Noriyuki Hirano
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Patent number: 10538637Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.Type: GrantFiled: February 5, 2016Date of Patent: January 21, 2020Assignee: TORAY INDUSTRIES, INC.Inventors: Toshiya Kamae, Shinji Kochi, Masayuki Miyoshi, Kenichi Yoshioka
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Patent number: 10253142Abstract: An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.Type: GrantFiled: September 30, 2015Date of Patent: April 9, 2019Assignee: TORAY INDUSTRIES, INC.Inventors: Ayumi Matsuda, Masayuki Miyoshi, Noriyuki Hirano
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Publication number: 20180186946Abstract: One purpose of the present invention is to provide an epoxy resin composition which is for obtaining a fiber-reinforced composite material that combines heat resistance with tensile strength on a high level. The other purpose is to provide: a fiber-reinforced composite material obtained using this epoxy resin composition; and a molded article and a pressure vessel both containing the fiber-reinforced composite material. The present invention has the following configuration in order to achieve the above purposes. Namely, the epoxy resin composition includes the constituent element [A]: An epoxy resin including an aromatic ring and having a functionality of 2 or higher and the following constituent element [B]: An amine-based hardener or an acid anhydride-based hardener, and is characterized in that a cured object obtained by curing the epoxy resin composition has a rubber-state modulus of 10 MPa or less when evaluated for dynamic viscoelasticity and the cured object has a glass transition temperature of 95° C.Type: ApplicationFiled: June 22, 2016Publication date: July 5, 2018Applicant: TORAY INDUSTRIES, INC.Inventors: Ayumi Mori, Noriyuki Hirano, Masayuki Miyoshi
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Publication number: 20170327652Abstract: An epoxy resin composition is provided including at least the following component [A], component [B], and component [C] or [D] wherein cured product obtained by curing the epoxy resin composition has a rubbery state modulus in dynamic viscoelasticity evaluation of 10 MPa or less, and the cured product has a glass transition temperature of at least 95° C.; [A] an aromatic epoxy resin having a functionality of at least 3, [B] an aromatic diamine having a substituent at ortho position of each amino group or a cycloalkyldiamine wherein the carbon atom adjacent to the carbon atom bonded to each amino group has a substituent, [C] an aliphatic polyamine having an alkylene glycol structure, [D] a straight chain or branched aliphatic polyamine containing 6 to 12 carbon atoms.Type: ApplicationFiled: September 30, 2015Publication date: November 16, 2017Applicant: TORAY INDUSTRIES, INC.Inventors: Ayumi Matsuda, Masayuki Miyoshi, Noriyuki Hirano
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Publication number: 20160159993Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.Type: ApplicationFiled: February 5, 2016Publication date: June 9, 2016Applicant: TORAY INDUSTRIES, INC.Inventors: Toshiya KAMAE, Shinji KOCHI, Masayuki MIYOSHI, Kenichi YOSHIOKA
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Patent number: 9062203Abstract: A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.Type: GrantFiled: September 14, 2010Date of Patent: June 23, 2015Assignee: TORY INDUSTRIES INC.Inventors: Shinji Kochi, Kenichi Yoshioka, Masayuki Miyoshi
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Publication number: 20120178329Abstract: A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.Type: ApplicationFiled: September 14, 2010Publication date: July 12, 2012Applicant: TORAY INDUSTRIES, INC.Inventors: Shinji Kochi, Kenichi Yoshioka, Masayuki Miyoshi
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Publication number: 20110097568Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.Type: ApplicationFiled: March 23, 2009Publication date: April 28, 2011Inventors: Toshiya Kamae, Shinji Kochi, Masayuki Miyoshi, Kenichi Yoshioka
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Publication number: 20040004179Abstract: A temperature compensating circuit includes a first circuit network 1 between an inverting input terminal of an operational amplifier 13 and an output terminal of the operational amplifier 13, and a second circuit network 2 between the inverting input terminal of the operational amplifier 13 and a reference potential. At least one of the first circuit network and the second circuit network is made of an arrangement containing a plurality of series-connected thermistor/resistor pairs in which the thermistors are connected parallel to the resistors, and the temperature compensating circuit compensates a temperature-dependent signal which is inputted into a positive phase input terminal of the operational amplifier 13, and outputs the temperature-compensated signal.Type: ApplicationFiled: June 24, 2003Publication date: January 8, 2004Inventors: Akihiro Hayami, Tadaaki Fujii, Tomonao Kikuchi, Tadashi Hatano, Yasuhiro Yamada, Takayuki Nakao, Tomoaki Shimotsu, Toshiaki Murai, Tohru Oyama, Hidehiro Ikeuchi, Masayuki Miyoshi
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Patent number: 6603110Abstract: A temperature compensating circuit includes a first circuit network 1 between an inverting input terminal of an operational amplifier 13 and an output terminal of the operational amplifier 13, and a second circuit network 2 between the inverting input terminal of the operational amplifier 13 and a reference potential. At least one of the first circuit network and the second circuit network is made of an arrangement containing a plurality of series-connected thermistor/resistor pairs in which the thermistors are connected parallel to the resistors, and the temperature compensating circuit compensates a temperature-dependent signal which is inputted into a positive phase input terminal of the operational amplifier 13, and outputs the temperature-compensated signal.Type: GrantFiled: June 27, 2002Date of Patent: August 5, 2003Assignees: Hitachi, Ltd., Hitachi Communication System, Inc., Hitachi Video and Information System, Inc.Inventors: Akihiro Hayami, Tadaaki Fujii, Tomonao Kikuchi, Tadashi Hatano, Yasuhiro Yamada, Takayuki Nakao, Tomoaki Shimotsu, Toshiaki Murai, Tohru Oyama, Hidehiro Ikeuchi, Masayuki Miyoshi
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Publication number: 20030029991Abstract: A temperature compensating circuit includes a first circuit network 1 between an inverting input terminal of an operational amplifier 13 and an output terminal of the operational amplifier 13, and a second circuit network 2 between the inverting input terminal of the operational amplifier 13 and a reference potential. At least one of the first circuit network and the second circuit network is made of an arrangement containing a plurality of series-connected thermistor/resistor pairs in which the thermistors are connected parallel to the resistors, and the temperature compensating circuit compensates a temperature-dependent signal which is inputted into a positive phase input terminal of the operational amplifier 13, and outputs the temperature-compensated signal.Type: ApplicationFiled: June 27, 2002Publication date: February 13, 2003Inventors: Akihiro Hayami, Tadaaki Fujii, Tomonao Kikuchi, Tadashi Hatano, Yasuhiro Yamada, Takayuki Nakao, Tomoaki Shimotsu, Toshiaki Murai, Tohru Oyama, Hidehiro Ikeuchi, Masayuki Miyoshi