Patents by Inventor Masayuki Mochizuki
Masayuki Mochizuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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PAPER TRANSPORT DEVICE, AND DOCUMENT TRANSPORT DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME
Publication number: 20150291379Abstract: A paper transport device includes a transport motor, a branch motor, and a processing unit. In order to generate a holding torque in the branch motor while the transport motor is rotating, the processing unit supplies the exciting current of a first current value to the branch motor in a first time period including the start of the rotation of the transport motor and an acceleration period of the rotation. In a second time period following the first time period and including a stable period in which a rotational speed of the transport motor is stable, the processing unit supplies the exciting current of a second current value, the absolute value of which is smaller than that of the first current value, to the branch motor.Type: ApplicationFiled: April 8, 2015Publication date: October 15, 2015Inventor: Masayuki Mochizuki -
Patent number: 9154659Abstract: In an image forming apparatus, in order to make an engine CPU perform first processing after output of a return request, a main CPU sets a level of a signal line, through which the return request is output, at a first level. In order to make the engine CPU perform second processing, the main CPU sets the level of the signal line at a second level. The engine CPU determines on the basis of the level of the signal line after the output of the return request which processing is to perform, the first processing or the second processing.Type: GrantFiled: August 27, 2013Date of Patent: October 6, 2015Assignee: KYOCERA Document Solutions Inc.Inventor: Masayuki Mochizuki
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Patent number: 9025169Abstract: An image forming apparatus includes a power receiving unit, a power supply unit, an image forming unit, an execution control unit, a switching command receiving unit, a storage unit, and a power shutdown detection unit. The execution control unit executes, when started, a mode which is indicated by start mode information stored in the storage unit. The execution control unit causes the storage unit to store information indicating the standby mode as the start mode information if power shutdown is not detected when the standby mode is started, and causes the storage unit to store information indicating the execution mode as the start mode information if power shutdown is not detected when the execution mode is started.Type: GrantFiled: April 18, 2013Date of Patent: May 5, 2015Assignee: KYOCERA Document Solutions Inc.Inventor: Masayuki Mochizuki
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Publication number: 20150091243Abstract: The pickup roller is placed above a lifting plate made of a flexible material and feeds the sheet with abutting on an upper surface of the sheets loaded on the lifting plate. The sensor detects an arrival of the sheet fed by the pickup roller on a downstream side of the pickup roller. The abnormality detection unit detects the sheet feeding abnormality of the sheet fed by the pickup roller based on the drive start time of the pickup roller and the time sheet detection by the sensor. The abnormality detecting condition correction unit corrects the abnormality detecting condition of the abnormality detection unit depending on the amount of sheets on the lifting plate.Type: ApplicationFiled: September 23, 2014Publication date: April 2, 2015Applicant: KYOCERA Document Solutions Inc.Inventors: Yuya KOBAYASHI, Hideyuki TERAMOTO, Masayuki MOCHIZUKI
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Patent number: 8991681Abstract: A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.Type: GrantFiled: March 6, 2012Date of Patent: March 31, 2015Assignee: Hitachi High-Tech Instuments Co., Ltd.Inventors: Hiroshi Maki, Masayuki Mochizuki, Yukio Tani, Takehito Mochizuki
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Patent number: 8783319Abstract: The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.Type: GrantFiled: September 2, 2011Date of Patent: July 22, 2014Assignee: Hitachi High-Tech Instruments Co., Ltd.Inventors: Takashi Yamagami, Ryuichi Takano, Hiroshi Maki, Masayuki Mochizuki
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Patent number: 8703583Abstract: A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.Type: GrantFiled: November 13, 2009Date of Patent: April 22, 2014Assignee: Renesas Electronics CorporationInventors: Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa, Keisuke Nadamoto, Tatsuyuki Okubo
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Publication number: 20140074280Abstract: A horizontal axis drive mechanism includes a first linear motor including a first fixed section and a first movable section fixing a load section and moving the load section in the horizontal direction, a support body supporting the first fixed section, a first linear guide arranged between the support body and the first fixed section and moving the first fixed section, a rotation conversion type counter including a rotating body rotatably supported by the support body and a converting means converting movement of the first fixed section in the horizontal direction into rotation of the rotating body, and a control section controlling the position of the first movable section in the horizontal direction.Type: ApplicationFiled: March 4, 2013Publication date: March 13, 2014Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.Inventors: Yoshihide ISHII, Masayuki MOCHIZUKI
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Publication number: 20140063524Abstract: In an image forming apparatus, in order to make an engine CPU perform first processing after output of a return request, a main CPU sets a level of a signal line, through which the return request is output, at a first level. In order to make the engine CPU perform second processing, the main CPU sets the level of the signal line at a second level. The engine CPU determines on the basis of the level of the signal line after the output of the return request which processing is to perform, the first processing or the second processing.Type: ApplicationFiled: August 27, 2013Publication date: March 6, 2014Applicant: KYOCERA DOCUMENT SOLUTIONS INC.Inventor: Masayuki MOCHIZUKI
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Patent number: 8574933Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: GrantFiled: January 10, 2013Date of Patent: November 5, 2013Assignee: Renesas Electronics CorporationInventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Publication number: 20130286419Abstract: An image forming apparatus includes a power receiving unit, a power supply unit, an image forming unit, an execution control unit, a switching command receiving unit, a storage unit, and a power shutdown detection unit. The execution control unit executes, when started, a mode which is indicated by start mode information stored in the storage unit. The execution control unit causes the storage unit to store information indicating the standby mode as the start mode information if power shutdown is not detected when the standby mode is started, and causes the storage unit to store information indicating the execution mode as the start mode information if power shutdown is not detected when the execution mode is started.Type: ApplicationFiled: April 18, 2013Publication date: October 31, 2013Applicant: KYOCERA Document Solutions Inc.Inventor: Masayuki Mochizuki
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Publication number: 20130221764Abstract: A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.Type: ApplicationFiled: August 16, 2012Publication date: August 29, 2013Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Yoshihide ISHII, Masayuki MOCHIZUKI, Yoshihiro KURIHARA
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Patent number: 8457505Abstract: An image forming apparatus according to the present invention includes: a fixing part having a heater; a control part controlling ON/OFF of power distribution to the heater; a power source part generating a voltage for driving the control part; a main switch for turning ON/OFF power supply from outside to the power source part; and an interrupt signal generation part generating a periodical interrupt signal. The control part, based on the interrupt signal, controls ON/OFF of the power distribution to the heater, turns OFF power supply to the heater upon passage of predetermined time since disappearance of the interrupt signal, and judges that an error has occurred, when the control part is still driving after passage of driving stop time from when the main switch is turned OFF to when the control part stops its driving since the disappearance of the interrupt signal.Type: GrantFiled: August 4, 2010Date of Patent: June 4, 2013Assignee: Kyocera Mita CorporationInventor: Masayuki Mochizuki
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Patent number: 8452202Abstract: A controller outputs a heater control signal in synchronization with a rise in a zero-cross signal. In response to the heater control signal, a switching device of a heater driving circuit switches ON/OFF. However, a noise occurs in an output voltage of an AC power source at the time of switching, and this noise causes a false zero-cross signal. For the purpose of preventing operation of a heater in accordance with the false zero-cross signal, the controller disregards the rise in the zero-cross signal during a set time period after the rise in the heater control signal.Type: GrantFiled: February 25, 2009Date of Patent: May 28, 2013Assignee: Kyocera Mita CorporationInventor: Masayuki Mochizuki
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Publication number: 20130068824Abstract: A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.Type: ApplicationFiled: August 15, 2012Publication date: March 21, 2013Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Masayuki MOCHIZUKI, Hiroshi Maki, Yukio Tani, Takehito Mochizuki
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Publication number: 20130068823Abstract: A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.Type: ApplicationFiled: March 6, 2012Publication date: March 21, 2013Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Hiroshi MAKI, Masayuki MOCHIZUKI, Yukio TANI, Takehito MOCHIZUKI
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Publication number: 20130068826Abstract: A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.Type: ApplicationFiled: March 9, 2012Publication date: March 21, 2013Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Hiroshi Maki, Masayuki Mochizuki, Yukio Tani, Takehito Mochizuki
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Patent number: 8367433Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: GrantFiled: July 21, 2010Date of Patent: February 5, 2013Assignee: Renesas Electronics CorporationInventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Publication number: 20120241096Abstract: The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.Type: ApplicationFiled: September 2, 2011Publication date: September 27, 2012Applicant: Hitachi High-Tech Instruments Co., Ltd.Inventors: Takashi YAMAGAMI, Ryuichi Takano, Hiroshi Maki, Masayuki Mochizuki
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Publication number: 20110259525Abstract: The present invention aims to provide a lightened reaction absorber or to provide a semiconductor assembling system with further shorter processing time and high productivity or high quality using the lightened reaction absorber. The present invention is based upon a reaction absorber provided with a counter mechanism equipped with a load unit moved in a predetermined direction by a first ball screw, a second ball screw that generates reactive force in a reverse direction to the predetermined direction and a driving unit having a driving motor that drives the first ball screw and the second ball screw, and has a characteristic of including a reaction absorbing unit with one end side equipped with a nut connected to the second ball screw and the other end side fixed to a unit base movable relatively to the counter mechanism.Type: ApplicationFiled: September 13, 2010Publication date: October 27, 2011Inventors: Masayuki MOCHIZUKI, Yasushi ISHII