Patents by Inventor Masayuki Mogi
Masayuki Mogi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7351504Abstract: In a quadrangular photomask blank substrate with a length on each side of at least 6 inches, which has a pair of strip-like regions that extend from 2 to 10 mm inside each of a pair of opposing sides along an outer periphery of a substrate top surface, with a 2 mm edge portion excluded at each end, each strip-like region is inclined downward toward the outer periphery of the substrate, and a difference between maximum and minimum values for height from a least squares plane for the strip-like region to the strip-like region is at most 0.5 ?m. The substrate exhibits a good surface flatness at the time of wafer exposure.Type: GrantFiled: July 23, 2004Date of Patent: April 1, 2008Assignees: Shin-Etsu Chemical Co., Ltd., Kabushiki Kaisha Toshiba, Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7344808Abstract: A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.Type: GrantFiled: July 23, 2004Date of Patent: March 18, 2008Assignees: Shin-Etsu Chemical Co., Ltd., Nikon CorporationInventors: Tsuneo Numanami, Masayuki Nakatsu, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7329475Abstract: Provided that a pair of strip-like regions extend from 2 mm to 10 mm inside each of a pair of opposing sides along an outer periphery of a top surface of a substrate on which a mask pattern is to be formed, with a 2 mm edge portion excluded at each end in a lengthwise direction thereof, the height from a least squares plane for the strip-like regions on the substrate top surface to the strip-like regions is measured at intervals of 0.05-0.35 mm in horizontal and vertical directions, and a substrate in which the difference between the maximum and minimum values for the height among all the measurement points is ?o? ?o?? ???? 0.5 ?m is selected.Type: GrantFiled: July 23, 2004Date of Patent: February 12, 2008Assignees: Shin-Estu Chemical Co., Ltd., Kabushiki Kaisha Toshiba, Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Patent number: 7195846Abstract: A photomask blank having a film of at least one layer formed on a substrate is manufactured by forming a film on a substrate and irradiating the film with light from a flash lamp. A photomask is manufactured from the thus manufactured photomask blank by forming a patterned resist on the film on the blank by photolithography, etching away those portions of the film which are not covered with the resist, and removing the resist. The photomask blank and photomask have minimized warpage and improved chemical resistance.Type: GrantFiled: December 2, 2003Date of Patent: March 27, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hideo Kaneko, Yukio Inazuki, Tetsushi Tsukamoto, Masayuki Mogi, Katsuya Okumura
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Patent number: 7070888Abstract: A photomask blank substrate is selected for use in a process where at least a masking film or a phase shift film is deposited on a top surface of a photomask blank substrate to form a photomask blank, the deposited film is patterned to form a photomask, and the photomask is mounted in an exposure tool. The substrate is selected by simulating a change in shape in the top surface of the substrate, from prior to film deposition thereon to when the photomask is mounted in the exposure tool; determining the shape of the substrate top surface prior to the change that will impart to the top surface a flat shape when the photomask is mounted in the exposure tool; and selecting, as an acceptable substrate, a substrate having this top surface shape. The selected substrate has an optimized top surface shape that improves productivity in photomask fabrication.Type: GrantFiled: July 23, 2004Date of Patent: July 4, 2006Assignees: Shin-Etsu Chemical Co., Ltd., Nikon CorporationInventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019676Abstract: Provided that a pair of strip-like regions extend from 2 mm to 10 mm inside each of a pair of opposing sides along an outer periphery of a top surface of a substrate on which a mask pattern is to be formed, with a 2 mm edge portion excluded at each end in a lengthwise direction thereof, the height from a least squares plane for the strip-like regions on the substrate top surface to the strip-like regions is measured at intervals of 0.05-0.35 mm in horizontal and vertical directions, and a substrate in which the difference between the maximum and minimum values for the height among all the measurement points is ?o? ?o?? ???? 0.5 ?m is selected.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050020083Abstract: A photomask blank substrate is made by polishing a starting substrate to a specific flatness in a principal surface region on a top surface of the substrate so as to form a polished intermediate product, then additionally polishing the intermediate product. Substrates made in this way exhibit a good surface flatness at the time of wafer exposure. When a photomask fabricated from a blank obtained from such a substrate is held on the mask stage of a wafer exposure system with a vacuum chuck, the substrate surface undergoes minimal warping, enabling exposure patterns of small geometry to be written onto wafers to good position and linewidth accuracies.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Tsuneo Numanami, Masayuki Nakatsu, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019677Abstract: In a quadrangular photomask blank substrate with a length on each side of at least 6 inches, which has a pair of strip-like regions that extend from 2 to 10 mm inside each of a pair of opposing sides along an outer periphery of a substrate top surface, with a 2 mm edge portion excluded at each end, each strip-like region is inclined downward toward the outer periphery of the substrate, and a difference between maximum and minimum values for height from a least squares plane for the strip-like region to the strip-like region is at most 0.5 ?m. The substrate exhibits a good surface flatness at the time of wafer exposure.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Masamitsu Itoh, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20050019678Abstract: A photomask blank substrate is selected for use in a process where at least a masking film or a phase shift film is deposited on a top surface of a photomask blank substrate to form a photomask blank, the deposited film is patterned to form a photomask, and the photomask is mounted in an exposure tool. The substrate is selected by simulating a change in shape in the top surface of the substrate, from prior to film deposition thereon to when the photomask is mounted in the exposure tool; determining the shape of the substrate top surface prior to the change that will impart to the top surface a flat shape when the photomask is mounted in the exposure tool; and selecting, as an acceptable substrate, a substrate having this top surface shape. The selected substrate has an optimized top surface shape that improves productivity in photomask fabrication.Type: ApplicationFiled: July 23, 2004Publication date: January 27, 2005Inventors: Masayuki Nakatsu, Tsuneo Numanami, Masayuki Mogi, Tsuneyuki Hagiwara, Naoto Kondo
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Publication number: 20040110073Abstract: A photomask blank having a film of at least one layer formed on a substrate is manufactured by forming a film on a substrate and irradiating the film with light from a flash lamp. A photomask is manufactured from the thus manufactured photomask blank by forming a patterned resist on the film on the blank by photolithography, etching away those portions of the film which are not covered with the resist, and removing the resist. The photomask blank and photomask have minimized warpage and improved chemical resistance.Type: ApplicationFiled: December 2, 2003Publication date: June 10, 2004Inventors: Hideo Kaneko, Yukio Inazuki, Tetsushi Tsukamoto, Masayuki Mogi, Katsuya Okumura