Abstract: There are provided a method and device for correcting a camera position, and a dummy component for use in camera position correction. A board-sensing camera for sensing a position of a circuit board is caused to take an image of a dummy component in an attitude-fixed state in a first coordinate system peculiar to a board-sensing camera. A component-sensing camera for sensing a position of an electronic component to be mounted on the circuit board is caused to take an image of the dummy component in an attitude-fixed state in a second coordinate system peculiar to a component-sensing camera. An amount of deviation of a center of the dummy component from a sensing center of the board-sensing camera and an amount of deviation of the center of the dummy component from a sensing center of the component-sensing camera are calculated from results of the taking of the image of the dummy component by the board-sensing camera and results of the taking of the image of the dummy component by the component-sensing camera.

Abstract: A component-mounting block of an electronic component-mounting apparatus has mounting heads installed thereon. Each mounting head has a nozzle-replacing device for replacing at least one selected sucking nozzle by at least one other sucking nozzle to be newly selected. The replacement is possible during travel of the component-mounting block between a mounting position and a sucking position effected by a X-Y moving stage. At least one mounting head carries at least one sucking nozzle rotatable about a vertical axis of a nozzle holder. The mounting head has the nozzle holder, and an engaging member holder. Sucking nozzles are circumferentially arranged about the vertical axis of the nozzle holder and vertically retractably held by the nozzle holder. The engaging member holder holds engaging members which engageably face the nozzles.

Abstract: An automatic electronic parts-mounting apparatus mounts chip-like electronic parts supplied from a parts feeder at predetermined positions on a printed substrate. The parts-mounting apparatus accurately and quickly determines angular positions of the electronic parts by rotating adsorptive nozzles. The adsorptive nozzles are capable of adsorbing the electronic parts one by one, and each nozzle is connected to a rotor of a nozzle-rotating motor for rotating the adsorptive nozzle within a plane that is perpendicular to an axis of the adsorptive nozzle. The rotor is rotated in accordance with the adsorbed state of the electronic parts to make fine adjustment for determining the angular position.

Abstract: A parts feeder, comprising a feed table, a plurality of parts feed units arranged on the feed table, each parts feed unit including a carrying tape carrying parts, a cover tape covering the parts, a device peeling the cover tape, a tape dispenser, and a shutter shutting a space above the position of the dispensation of the parts, a sucker sucking the parts at a position of a suction of the parts, each of the parts feed units including a tape feed drive driving the tape dispenser and shutter drive separate from the tape feed drive, the shutter drive driving the shutter, a tape feed drive provided outside the parts feed units and driving the tape feed drive of the parts feed unit positioned at a position other than the position of the suction of the parts so that the parts feed unit at the position other than the position of the suction of the parts feeds a part forward before the sucker sucks the part at the position of the suction of the parts, and a shutter drive positioned outside the parts feed units drivi

Abstract: An improved apparatus for automatically mounting electronic components includes a take-out nozzle which is rotated by a nozzle rotating unit based on data on an angular position assumed by each chip-shaped electronic component firmly held on the take-out nozzle, in order to perform a correcting operation so as to allow the electronic component to assume an adequate angular position and, after completion of the correction operation, the respective electronic components are mounted on a printed-circuit board.

Abstract: An electronic parts mounting apparatus, which on the basis of a recognition result of an attitude of a tipped electronic part held on a removing nozzle obtained by a recognition device, rotates the nozzle to change the attitude of the rotational direction of the electronic part. The apparatus comprises a removing nozzle formed in its upper portion with a groove to be fitted to attract and hold the electronic part recognized by the recognition device, a vertically movable and rotatable nozzle rotating means for changing the attitude of the electronic parts in a rotational direction, a cushion means mounted on the nozzle rotating means or the removing nozzle for pressing the fitting portion against the groove to be fitted, and a sliding means for for fitting the fitting portion into the groove to be fitted while sliding the fitting portion.

Abstract: Disclosed is an apparatus for detecting a position of an electronic part, the apparatus comprising first and second light source arranged so that an electronic part attracted by attraction means is sandwiched therebetween, a diffusion plate provided between the attraction means and the second light sources, and an imaging means provided below the diffusion plate. The light from the first light sources is irradiated on the electronic part and the transmission light from the electronic part is applied to the imaging means, or the light from the second light sources is irradiated on the electronic part and the reflected light is selectively applied to the imaging means through a through-hole of the diffusion plate to detect a position of the electronic part.