Abstract: A composite material is capable of suppressing decrease in the strength, which is caused by bending of fibers of a skin material during the time when the composite material is cured. A composite material is provided with a honeycomb core, a first skin material, a second skin material, a thunder-resistant mesh and a resin material; and the resin material is not arranged in a neighborhood portion which is the region corresponding to the region at the front end of the honeycomb core. A first film adhesive is arranged between the first skin material and the honeycomb core; a second film adhesive is arranged between the second skin material and the honeycomb core; and a fourth film adhesive is arranged in the neighborhood portion of the resin material in a weight per square meter, which is lower than those of the first film adhesive and the second film adhesive.

Abstract: The present invention addresses the problem of providing a composite material that can prevent a strength reduction when fibers of a skin material are bent during curing of the composite material. In a composite material, a filler is arranged between a honeycomb core and a first skin material and/or between the honeycomb core and a second skin material so as to overlap the tip of an end of the honeycomb core. In a horizontal view, the filler arranged between the honeycomb core and the second skin material protrudes outside the composite material by a length equal to or less than a length of a portion thereof overlapping the tip of the end of the honeycomb core.

Abstract: A device for producing a pultruded article is provided with: a mold in which an intermediate molded article comprising reinforcing fibers impregnated with a thermosetting resin is heated and hardened; and a pultrusion device that causes a pultruded article generated by heating and hardening the intermediate molded article in the mold to be pultruded from the mold. The mold comprises a pressing member that is elastically deformable and that presses the intermediate molded article.

Abstract: A method for producing a pultruded article includes: a step in which an activation sheet having a sliding surface capable of sliding with the inner surface of a mold is arranged on the surface of an intermediate molded article comprising reinforcing fibers that are impregnated with a thermosetting resin and the intermediate molded article and the activation sheet are introduced into a mold together; and a step in which a pultruded article generated by heating and hardening the intermediate molded article in the mold is pultruded together with the activation sheet from the mold.

Abstract: Provided are a method and a device for producing a pultruded material that improve the homogeneity of a thermosetting resin. The device for producing a pultruded material comprises a first opening section, a second opening section, a closing section, a tension-applying section, an impregnating section, and a mold. The first opening section and the second opening section open a bundle of reinforcing fibers and thereby obtain a bundle of reinforcing fibers. The closing section closes the bundle of opened reinforcing fibers and thereby obtains a bundle of reinforcing fibers. The tension-applying section applies tension along the direction in which the reinforcing fibers extend to the bundle of reinforcing fibers that pass through the closing section. The impregnating section impregnates the bundle of reinforcing fibers with a thermosetting resin. The mold pultrudes the bundle of reinforcing fibers that have been impregnated with the thermosetting resin.

Abstract: A pultrusion material serves as a composite material having a reinforced part that is a part reinforced against a load acting in a load direction. The reinforced part includes: a core material that comprises bundled reinforcing fibers and that is provided so as to extend along the load direction; and a cover section obtained by covering the circumference of the core material with a fiber sheet. The fiber direction of the reinforcing fibers in the core material is oriented along the load direction.

Abstract: This device for producing a pultrusion molded article is provided with: a mold member that heats and cures an intermediate molded article as a result of the mold member contacting an intermediate molded article in which reinforcing fibers are impregnated with a thermosetting resin; a pultrusion device for extracting, in the pultruding direction, the pultrusion molded article formed by heating and curing the intermediate molded article; and a moving device for moving the mold member in the pultruding direction in synchronization with the pultrusion device.

Abstract: Provided are: a fiber-containing material which has improved strength in an out-of-plane direction without a decrease in strength in an in-plane direction; a method for inserting out-of-plane reinforcement threads; and a method for producing the fiber-containing material. The fiber-containing material contains a base material and out-of-plane reinforcement threads. The base material contains reinforcement fibers extending in a direction along a plane. The out-of-plane reinforcement threads are formed in the base material so as to extend in a direction intersecting the direction along the plane.

Abstract: A pultrusion material that is a composite material member comprises: a plurality of fiber sheets that extend along a lengthwise direction; and a reinforcement material that is provided to an interior of a corner section formed by the plurality of fiber sheets, wherein the thickness of the corner section where the reinforcement material is provided is comparatively thicker than the thickness of flat sections that are continuous with the corner section. A fiber sheet that is provided to an inner surface of the corner section is provided continuously within the inner surface, and a fiber sheet that is provided to an outer surface of the corner section is provided continuously within the outer surface.

Abstract: Provided are: a fiber-containing material which has improved strength in an out-of-plane direction without a decrease in strength in an in-plane direction; a method for inserting out-of-plane reinforcement threads; and a method for producing the fiber-containing material. The fiber-containing material contains a base material and out-of-plane reinforcement threads. The base material contains reinforcement fibers extending in a direction along a plane. The out-of-plane reinforcement threads are formed in the base material so as to extend in a direction intersecting the direction along the plane.

Abstract: This pultrusion material that is a composite material member comprises: a plurality of fiber sheets that extend along a lengthwise direction; and a gap material that is provided to a gap formed by the plurality of fiber sheets, wherein the gap material has a gap fiber sheet including reinforcement fibers that are oriented in a different fiber direction than the lengthwise direction, and has gap reinforcement fibers that are oriented in the same fiber direction as the lengthwise direction. Additionally, the gap reinforcement fibers are provided evenly distributed in a cross-section of the gap material, said cross-section being perpendicular to the lengthwise direction.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A sealing resin for flip chip mounting. It permits a semiconductor chip to be mounted on a printed circuit board with high reliability. It contributes to high productivity and cost reduction in flip chip mounting. When in use for flip chip mounting, it fills the gap between a semiconductor chip and a printed circuit board, thereby sealing solder connections between them. It comprises an epoxy resin, an acid anhydride hardener to cure said epoxy resin, a flux to remove oxide film from solder bumps or solder balls on the semiconductor chip and printed circuit board, and an inorganic particulate filler with an average diameter ranging from 10 &mgr;m to 20 &mgr;m.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: An order receiving and order system is provided in which, even if a number of products increases, a user can easily search for a desired product without an operational load on the user increasing. A control section of a main server displays category images of category numbers 1, 2, . . . 6 for six seconds on a category selection screen of a communication terminal. Then, category images of category numbers 3, 4, . . . 8 are displayed for one second on the category selection screen. From thereon, category images are displayed for one second while shifting category numbers two-by-two.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.

Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.

Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.