Patents by Inventor Masayuki Morishima

Masayuki Morishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210001588
    Abstract: A composite material is capable of suppressing decrease in the strength, which is caused by bending of fibers of a skin material during the time when the composite material is cured. A composite material is provided with a honeycomb core, a first skin material, a second skin material, a thunder-resistant mesh and a resin material; and the resin material is not arranged in a neighborhood portion which is the region corresponding to the region at the front end of the honeycomb core. A first film adhesive is arranged between the first skin material and the honeycomb core; a second film adhesive is arranged between the second skin material and the honeycomb core; and a fourth film adhesive is arranged in the neighborhood portion of the resin material in a weight per square meter, which is lower than those of the first film adhesive and the second film adhesive.
    Type: Application
    Filed: February 26, 2019
    Publication date: January 7, 2021
    Inventors: Kazuki NOMA, Hiromichi AKIYAMA, Toshio KOZASA, Masayuki KANEMASU, Shunichi MORISHIMA
  • Publication number: 20210001572
    Abstract: The present invention addresses the problem of providing a composite material that can prevent a strength reduction when fibers of a skin material are bent during curing of the composite material. In a composite material, a filler is arranged between a honeycomb core and a first skin material and/or between the honeycomb core and a second skin material so as to overlap the tip of an end of the honeycomb core. In a horizontal view, the filler arranged between the honeycomb core and the second skin material protrudes outside the composite material by a length equal to or less than a length of a portion thereof overlapping the tip of the end of the honeycomb core.
    Type: Application
    Filed: February 26, 2019
    Publication date: January 7, 2021
    Inventors: Kazuki NOMA, Hiromichi AKIYAMA, Toshio KOZASA, Masayuki KANEMASU, Shunichi MORISHIMA
  • Publication number: 20200391453
    Abstract: A device for producing a pultruded article is provided with: a mold in which an intermediate molded article comprising reinforcing fibers impregnated with a thermosetting resin is heated and hardened; and a pultrusion device that causes a pultruded article generated by heating and hardening the intermediate molded article in the mold to be pultruded from the mold. The mold comprises a pressing member that is elastically deformable and that presses the intermediate molded article.
    Type: Application
    Filed: June 26, 2017
    Publication date: December 17, 2020
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20200307127
    Abstract: A method for producing a pultruded article includes: a step in which an activation sheet having a sliding surface capable of sliding with the inner surface of a mold is arranged on the surface of an intermediate molded article comprising reinforcing fibers that are impregnated with a thermosetting resin and the intermediate molded article and the activation sheet are introduced into a mold together; and a step in which a pultruded article generated by heating and hardening the intermediate molded article in the mold is pultruded together with the activation sheet from the mold.
    Type: Application
    Filed: June 26, 2017
    Publication date: October 1, 2020
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20200282673
    Abstract: Provided are a method and a device for producing a pultruded material that improve the homogeneity of a thermosetting resin. The device for producing a pultruded material comprises a first opening section, a second opening section, a closing section, a tension-applying section, an impregnating section, and a mold. The first opening section and the second opening section open a bundle of reinforcing fibers and thereby obtain a bundle of reinforcing fibers. The closing section closes the bundle of opened reinforcing fibers and thereby obtains a bundle of reinforcing fibers. The tension-applying section applies tension along the direction in which the reinforcing fibers extend to the bundle of reinforcing fibers that pass through the closing section. The impregnating section impregnates the bundle of reinforcing fibers with a thermosetting resin. The mold pultrudes the bundle of reinforcing fibers that have been impregnated with the thermosetting resin.
    Type: Application
    Filed: June 23, 2017
    Publication date: September 10, 2020
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20200282672
    Abstract: A pultrusion material serves as a composite material having a reinforced part that is a part reinforced against a load acting in a load direction. The reinforced part includes: a core material that comprises bundled reinforcing fibers and that is provided so as to extend along the load direction; and a cover section obtained by covering the circumference of the core material with a fiber sheet. The fiber direction of the reinforcing fibers in the core material is oriented along the load direction.
    Type: Application
    Filed: July 4, 2017
    Publication date: September 10, 2020
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20190308379
    Abstract: This device for producing a pultrusion molded article is provided with: a mold member that heats and cures an intermediate molded article as a result of the mold member contacting an intermediate molded article in which reinforcing fibers are impregnated with a thermosetting resin; a pultrusion device for extracting, in the pultruding direction, the pultrusion molded article formed by heating and curing the intermediate molded article; and a moving device for moving the mold member in the pultruding direction in synchronization with the pultrusion device.
    Type: Application
    Filed: June 16, 2017
    Publication date: October 10, 2019
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20190240927
    Abstract: Provided are: a fiber-containing material which has improved strength in an out-of-plane direction without a decrease in strength in an in-plane direction; a method for inserting out-of-plane reinforcement threads; and a method for producing the fiber-containing material. The fiber-containing material contains a base material and out-of-plane reinforcement threads. The base material contains reinforcement fibers extending in a direction along a plane. The out-of-plane reinforcement threads are formed in the base material so as to extend in a direction intersecting the direction along the plane.
    Type: Application
    Filed: June 2, 2017
    Publication date: August 8, 2019
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20190217558
    Abstract: A pultrusion material that is a composite material member comprises: a plurality of fiber sheets that extend along a lengthwise direction; and a reinforcement material that is provided to an interior of a corner section formed by the plurality of fiber sheets, wherein the thickness of the corner section where the reinforcement material is provided is comparatively thicker than the thickness of flat sections that are continuous with the corner section. A fiber sheet that is provided to an inner surface of the corner section is provided continuously within the inner surface, and a fiber sheet that is provided to an outer surface of the corner section is provided continuously within the outer surface.
    Type: Application
    Filed: July 14, 2017
    Publication date: July 18, 2019
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20190184605
    Abstract: Provided are: a fiber-containing material which has improved strength in an out-of-plane direction without a decrease in strength in an in-plane direction; a method for inserting out-of-plane reinforcement threads; and a method for producing the fiber-containing material. The fiber-containing material contains a base material and out-of-plane reinforcement threads. The base material contains reinforcement fibers extending in a direction along a plane. The out-of-plane reinforcement threads are formed in the base material so as to extend in a direction intersecting the direction along the plane.
    Type: Application
    Filed: June 2, 2017
    Publication date: June 20, 2019
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Publication number: 20190160763
    Abstract: This pultrusion material that is a composite material member comprises: a plurality of fiber sheets that extend along a lengthwise direction; and a gap material that is provided to a gap formed by the plurality of fiber sheets, wherein the gap material has a gap fiber sheet including reinforcement fibers that are oriented in a different fiber direction than the lengthwise direction, and has gap reinforcement fibers that are oriented in the same fiber direction as the lengthwise direction. Additionally, the gap reinforcement fibers are provided evenly distributed in a cross-section of the gap material, said cross-section being perpendicular to the lengthwise direction.
    Type: Application
    Filed: July 14, 2017
    Publication date: May 30, 2019
    Inventors: Shunichi MORISHIMA, Toshio KOZASA, Masatake HATANO, Kazuaki KISHIMOTO, Yukio TAKEUCHI, Masayuki YAMASHITA, Hitoshi OJIKA
  • Patent number: 6869008
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: May 28, 2002
    Date of Patent: March 22, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Publication number: 20030011077
    Abstract: A sealing resin for flip chip mounting. It permits a semiconductor chip to be mounted on a printed circuit board with high reliability. It contributes to high productivity and cost reduction in flip chip mounting. When in use for flip chip mounting, it fills the gap between a semiconductor chip and a printed circuit board, thereby sealing solder connections between them. It comprises an epoxy resin, an acid anhydride hardener to cure said epoxy resin, a flux to remove oxide film from solder bumps or solder balls on the semiconductor chip and printed circuit board, and an inorganic particulate filler with an average diameter ranging from 10 &mgr;m to 20 &mgr;m.
    Type: Application
    Filed: August 21, 2002
    Publication date: January 16, 2003
    Inventors: Masayuki Morishima, Kaoru Iwabuchi, Masakazu Nakada
  • Publication number: 20020166886
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Application
    Filed: May 28, 2002
    Publication date: November 14, 2002
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Publication number: 20020087431
    Abstract: An order receiving and order system is provided in which, even if a number of products increases, a user can easily search for a desired product without an operational load on the user increasing. A control section of a main server displays category images of category numbers 1, 2, . . . 6 for six seconds on a category selection screen of a communication terminal. Then, category images of category numbers 3, 4, . . . 8 are displayed for one second on the category selection screen. From thereon, category images are displayed for one second while shifting category numbers two-by-two.
    Type: Application
    Filed: August 27, 2001
    Publication date: July 4, 2002
    Inventor: Masayuki Morishima
  • Patent number: 6402014
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: June 11, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 6213386
    Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
  • Patent number: 4556770
    Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.
    Type: Grant
    Filed: November 3, 1983
    Date of Patent: December 3, 1985
    Assignees: Sanyo Electric Co., Ltd., Tokyo Sanyo Electric Co., Ltd.
    Inventors: Yoshihisa Tazima, Masayuki Morishima, Hiroshi Okumura, Shin-ichi Kasahara
  • Patent number: 4536631
    Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.
    Type: Grant
    Filed: November 3, 1983
    Date of Patent: August 20, 1985
    Assignees: Sanyo Electric Co., Ltd., Tokyo Sanyo Electric Co., Ltd.
    Inventors: Yoshihisa Tazima, Masayuki Morishima, Hiroshi Okumura, Shin-ichi Kasahara
  • Patent number: 4438311
    Abstract: An induction heating coil and a self-excited inverter are connected to a ripple voltage source. The self-excited inverter comprises a transistor as a switching element and the transistor is rendered conductive responsive to a drive voltage applied for each cycle of the ripple voltage source, whereby the self-excited inverter is started at each cycle of the ripple voltage source. The self-excited inverter stops the oscillation when the voltage of the ripple voltage source becomes lower than a predetermined value. During the non-oscillation period of the intermittent oscillation, the oscillation output of the self-excited inverter is detected. If and when the oscillation output is detected at that time, the oscillation of the inverter is stopped. Furthermore, the pulses of the attenuating oscillation of the self-excited inverter during the oscillation rest period are counted.
    Type: Grant
    Filed: June 26, 1980
    Date of Patent: March 20, 1984
    Assignees: Sanyo Electric Co., Ltd., Tokyo Sanyo Electric Co., Ltd.
    Inventors: Yoshihisa Tazima, Masayuki Morishima, Hiroshi Okumura, Shin-ichi Kasahara