Patents by Inventor Masayuki Noda

Masayuki Noda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6756869
    Abstract: The object of this invention is to provide a relay unit and a housing for that unit to be used when a number of relay switches are installed side by side in a circuit to switch a power supply circuit on and off. A number of compartments are provided in a case with an open top such that one relay fits into each compartment. The relays are placed into these compartments, and a cover is fitted onto the open top of the case. Slits are provided along the upper edge of the case and/or in the cover, through which the connectors attached to the terminals of the various relays can pass. The cover is placed on top of the case with the connectors attached to the terminals of the various relays running through the various slits. With this invention, a number of relay switches are put into a single package (housing), thus making the relays easier to handle. The package makes it easier to mount and wire multiple relay switches.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: June 29, 2004
    Assignee: Omron Corporation
    Inventors: Koji Takami, Yasuyuki Masui, Masayuki Noda, Takashi Suzuki, Toshihiko Seki
  • Patent number: 6686023
    Abstract: A polished-piece holder is provided that does not easily stick or adsorb to a polishing pad of a polishing apparatus and reduces occurrences of production line troubles and therefore the number of failed polished pieces. A single sheet of a thermosetting resin impregnated fiber substrate or a laminated sheet formed by laminating a plurality of sheets of the thermosetting resin impregnated fiber substrate is formed under heat and pressure into a plate. The thermosetting resin impregnated fiber plate is then processed to form a polished-piece holder for holding pieces to be polished. The evaluation portion has a certain length in a direction of the average line. The thermosetting resin impregnated fiber plate has a surface roughness with a maximum wave height Ry of 10 &mgr;m or greater over an almost entire area of the surface layer.
    Type: Grant
    Filed: February 25, 2002
    Date of Patent: February 3, 2004
    Assignee: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Katsuji Takahashi, Hirokazu Hiraoka, Masayuki Noda
  • Publication number: 20030157858
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: March 5, 2003
    Publication date: August 21, 2003
    Applicant: OJI PAPER CO., LTD.
    Inventors: Hiroyoshi Ueno, Yoshihisa Koto, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Patent number: 6595670
    Abstract: A mirror assembly particularly adopted as a side view mirror for a vehicle, the assembly being provided a mirror, a mounting plate for supporting the mirror, a light assembly having a lens at one end, a visor for accommodating the mirror and the light assembly. A joint element pivotally mounts a side of the light assembly to the mounting plate. The visor has a visor opening into which the lens is fitted, and a connection element for movably connecting an end of the visor opening and an end of the lens. A bias element in the form of a spring pivotally biases the end of the light assembly having the lens such that the connection element substantially closes any gap between the visor opening and the lens.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: July 22, 2003
    Assignee: Kabushiki Kaisha Tokai-Rika-Denki Seisakusho
    Inventors: Masato Sakamoto, Yoshihiro Fujikawa, Masayuki Noda, Kikuhiro Ohsawa
  • Patent number: 6566288
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: May 20, 2003
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6558512
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: May 6, 2003
    Assignees: Oji Paper Co., Ltd., Shin-Kobe Electric Machinery Co., Ltd
    Inventors: Hiroyoshi Ueno, Yoshihisa Kato, Isao Ichioka, Takekazu Adachi, Mamoru Murata, Hirokazu Hiraoka, Manabu Ochida, Masayuki Noda
  • Publication number: 20020197466
    Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
    Type: Application
    Filed: November 17, 1999
    Publication date: December 26, 2002
    Inventors: HIROYOSHI UENO, YOSHIHISA KATO, ISAO ICHIOKA, TAKEKAZU ADACHI, MAMORU MURATA, HIROKAZU HIRAOKA, MANABU OCHIDA, MASAYUKI NODA
  • Patent number: 6489013
    Abstract: A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300° C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: December 3, 2002
    Assignees: Hitachi, Ltd., Shin-Kobe Electric Machinery
    Inventors: Akira Nagai, Masayuki Noda
  • Publication number: 20020160150
    Abstract: A polished-piece holder is provided that does not easily stick or adsorb to a polishing pad of a polishing apparatus and reduces occurrences of production line troubles and therefore the number of failed polished pieces. A single sheet of a thermosetting resin impregnated fiber substrate or a laminated sheet formed by laminating a plurality of sheets of the thermosetting resin impregnated fiber substrate is formed under heat and pressure into a plate. The thermosetting resin impregnated fiber plate is then processed to form a polished-piece holder for holding pieces to be polished. The evaluation portion has a certain length in a direction of the average line. The thermosetting resin impregnated fiber plate has a surface roughness with a maximum wave height Ry of 10 &mgr;m or greater over an almost entire area of the surface layer.
    Type: Application
    Filed: February 25, 2002
    Publication date: October 31, 2002
    Applicant: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Katsuji Takahashi, Hirokazu Hiraoka, Masayuki Noda
  • Patent number: 6426310
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: July 30, 2002
    Assignees: Shin-Kobe Electric Machinery Co., Ltd., Oji Paper Co., Ltd.
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6412964
    Abstract: A door mirror structure is provided which can improve assembly workability of a door mirror. A cord is pulled out from a base end portion of a door mirror body. In an overhanging portion of a door mirror base, a slot is formed in place of a conventional cord insertion hole. Therefore, at a door mirror assembly line, the cord can easily be inserted into the slot from an arrow A direction. As a result, the assembly workability of the door mirror can be improved.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: July 2, 2002
    Assignee: Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
    Inventors: Yasunori Hattori, Hiroki Iwasa, Yoshihiro Fujikawa, Masayuki Noda
  • Patent number: 6411189
    Abstract: An inward surface of a flange 12 is formed with at least two coil guide grooves 14, 15 for start-up of coil winding, which grooves are in point symmetrical with respect to the central axis of a body 11 so that they are individually positioned between coil terminal holes 12a, 12b.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: June 25, 2002
    Assignee: Omron Corporation
    Inventors: Masayuki Noda, Hiroshi Iketani
  • Publication number: 20020023768
    Abstract: The object of this invention is to provide a relay unit and a housing for that unit to be used when a number of relay switches are installed side by side in a circuit to switch a power supply circuit on and off. A number of compartments are provided in a case with an open top such that one relay fits into each compartment. The relays are placed into these compartments, and a cover is fitted onto the open top of the case. Slits are provided along the upper edge of the case and/or in the cover, through which the connectors attached to the terminals of the various relays can pass. The cover is placed on top of the case with the connectors attached to the terminals of the various relays running through the various slits. With this invention, a number of relay switches are put into a single package (housing), thus making the relays easier to handle. The package makes it easier to mount and wire multiple relay switches.
    Type: Application
    Filed: February 22, 2001
    Publication date: February 28, 2002
    Inventors: Koji Takami, Yasuyuki Masui, Masayuki Noda, Takashi Suzuki, Toshihiko Seki
  • Publication number: 20010030819
    Abstract: A door mirror structure is provided which can improve assembly workability of a door mirror. A cord is pulled out from a base end portion of a door mirror body. In an overhanging portion of a door mirror base, a slot is formed in place of a conventional cord insertion hole. Therefore, at a door mirror assembly line, the cord can easily be inserted into the slot from an arrow A direction. As a result, the assembly workability of the door mirror can be improved.
    Type: Application
    Filed: April 4, 2001
    Publication date: October 18, 2001
    Inventors: Yasunori Hattori, Hiroki Iwasa, Yoshihiro Fujikawa, Masayuki Noda
  • Publication number: 20010030872
    Abstract: A mirror assembly for a vehicle, the assembly being provided a mirror, a light assembly having a lens, a visor for accommodating the mirror and the light assembly, with the visor having a visor opening into which the lens is fitted, a connection element for movably connecting an end of the visor opening and an end of the lens, and a bias element for biasing the light assembly such that the visor opening is substantially closed with the lens.
    Type: Application
    Filed: April 5, 2001
    Publication date: October 18, 2001
    Inventors: Masato Sakamoto, Yoshihiro Fujikawa, Masayuki Noda, Kikuhiro Ohsawa
  • Publication number: 20010018986
    Abstract: The present invention provides a resin compound, which causes very little thermal stress even when a flip chip is mounted, is of low elastic modulus, and has high heat resistance enough for solder floating at 300° C., and also an adhesive film, metal-clad adhesive film, circuit board, and assembly structure using the resin compound.
    Type: Application
    Filed: February 21, 2001
    Publication date: September 6, 2001
    Inventors: Akira Nagai, Masayuki Noda
  • Publication number: 20010006868
    Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.
    Type: Application
    Filed: February 6, 2001
    Publication date: July 5, 2001
    Inventors: Shigeru Kurumatani, Hirokazu Hiraoka, Masayuki Noda, Tomoyuki Terao, Setsuo Toyoshima, Yoshihisa Kato, Hiroyoshi Ueno
  • Patent number: 6140259
    Abstract: Glass fiber non-woven fabric for base material of laminate comprising binder binding glass fibers to each other and having glass transition temperature of higher than 120.degree. C.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: October 31, 2000
    Assignee: Shin-Kobe Electric Machinery Co., Ltd.
    Inventors: Masayuki Ushida, Masayuki Noda, Masaru Ogata
  • Patent number: 6040252
    Abstract: A laminate base material of aromatic polyamide fiber non-woven fabric which comprises a combined non-woven fabric of para-aramid fibers and meta-aramid fibers bonded with each other by a resin binder such as an epoxy resin binder and meta-aramid fibers being thermally adhered to each other and meta-aramid fibers being thermally adhered to para-aramid fibers while they are passing through a pair of thermal rolls and heated and pressed by them and the meta-aramid fibers being included preferably by 5 through 30 weight %.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: March 21, 2000
    Assignees: Shin-Kobe Electric Machinery Co., Teijin Limited, Oji Paper Co., Ltd.
    Inventors: Minoru Ootuka, Hirokazu Hiraoka, Toru Shimadu, Masayuki Noda
  • Patent number: 5969586
    Abstract: In an electromagnetic relay in which a contact mechanism 50 provided on a base 10 is driven by a card 60 which slides and moves in parallel to the axis of an electromagnet block 20 provided in the base 10 as the electromagnet block 20 is magnetized and demagnetized, the base 10 comprises a guide portion 17 for restricting the card 60 in its position. This prevents variations in the performance characteristics so that high productivity and long service life of contacts can be obtained.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: October 19, 1999
    Assignee: OMRON Corporation
    Inventors: Masayuki Noda, Takeshi Suzuki, Takashi Noguchi, Tatsuo Shinoura, Takashi Asao