Abstract: A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.

Abstract: A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.

Abstract: A multi-layer circuit wiring board comprising a laminate of films, each film having a wiring pattern formed on at least one surface thereof, wherein the wiring pattern formed on each film is electrically connected with the wiring pattern formed on another film which is disposed neighboring thereto through a via-contact layer provided on any one of the neighboring films.

Abstract: An optical-electric printed wiring board includes an electric wiring substrate having electric interconnects, and an optical wiring layer stacked on the electric wiring substrate and having a surface on which an optical part is mounted. The optical wiring layer includes a core for propagating light, a clad for sandwiching the core, and a mirror for reflecting light propagating in the core toward an optical part mounted on the optical wiring layer, or reflecting light from an optical part into the core. The electric wiring substrate includes conductive setting portions each of which extends through the optical wiring layer in the direction of stacking and has an end face on which an optical part is set. These conductive setting portions obtain electrical conduction between the optical part and the electric interconnects.

Abstract: A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.

Abstract: An optical-electric printed wiring board includes an electric wiring substrate having electric interconnects, and an optical wiring layer stacked on the electric wiring substrate and having a surface on which an optical part is mounted. The optical wiring layer includes a core for propagating light, a clad for sandwiching the core, and a mirror for reflecting light propagating in the core toward an optical part mounted on the optical wiring layer, or reflecting light from an optical part into the core. The electric wiring substrate includes conductive setting portions each of which extends through the optical wiring layer in the direction of stacking and has an end face on which an optical part is set. These conductive setting portions obtain electrical conduction between the optical part and the electric interconnects.