Abstract: A magnetic particle carrying device includes a magnetic field generator and a hollow cylindrical structure. The magnetic field generator generates a magnetic field. The hollow cylindrical structure encases the magnetic field generator and attracts magnetic particles on an external surface of the hollow structure using the magnetic field. The external surface of the hollow cylindrical structure is provided with a plurality of elliptical depressions. The depressions include first type depressions and second type depressions. A long axis of a first type of elliptical depression is substantially extending in an axial direction of the hollow cylindrical structure, and a long axis of a second type of elliptical depression is substantially extending in a circumferential direction of the hollow cylindrical structure. The external surface of the hollow cylindrical structure has more elliptical depressions of the second type than elliptical depressions of the first type.

Abstract: A developer holding member includes a magnetic field generating device and a hollow body including the magnetic field generating device thereinside, and attracting a developer to an external surface thereof with magnetic force of the magnetic field generating device. The external surface of the hollow body is randomly provided with a large number of depressions, and a peak intensity of a spectrum within a range of wavelengths not more than 1 mm, which is figured out by performing a frequency analysis using a profile curve in a circumferential direction of the external surface, is not more than 12.

Abstract: A method of making a microelectronic assembly includes providing a conductive metal layer having a first surface and a second surface, and etching the first surface of the conductive metal layer to form conductive protrusions, whereby after the etching step, the second surface of the conductive metal layer defines a substantially flat, continuous surface. The method includes juxtaposing a layer of an insulating material with tips of the conductive protrusions, and pressing the conductive protrusions through the layer of an insulating material so that the tips of the conductive protrusions are accessible at a first surface of the layer of an insulating material. In certain embodiments, the method may include after the pressing step, etching the second surface of the conductive metal layer to form conductive traces that are electrically interconnected with the conductive protrusions.

Abstract: A developing device includes a developer carrier opposed to an image carrier for carrying an electrostatic latent image, and a rotatable developer transferring screw for transferring developer to the developer carrier while agitating; the developer carrier includes a magnet roller and a developing sleeve comprising a rotatable non-electromagnetic cylinder body disposed coaxially with an axis of the magnet roller to contain the magnet roller, and an axis diameter of a center portion of the developer transferring screw is set larger than an axis diameter of each of both end portions of the developer transferring screw.

Abstract: A development device including a developer carrier including a cylindrical magnetic field-generation member having a surface portion provided with a plurality of magnetic poles and a rotatable hollow member which is disposed inside the magnetic field-generation member and formed of a non-magnetic material, a developer control member configured to control an amount of a developer which is carried on the developer carrier and fed to an image supporter disposed to office the developer carrier, and an agitator provided upstream the developer control member in a rotating direction of the developer carrier and configured to feed the developer contained in a developer-containing tank in an axial direction of the hollow member, a developer conveying pole being provided on the surface portion of the magnetic field-generation member to form a developer separation area for separating the developed developer which has thin toner density from the hollow member into the developer-containing tank on the surface portion of t

Abstract: A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top surface of the metal layer and forming openings in the dielectric layer to expose portions of the top surface of the metal layer. The method includes providing conductive elements atop the dielectric layer, at least some of the conductive elements extending through the openings in the dielectric layer and being in contact with the metal layer, and plating first conductive protrusions atop the at least some of the conductive elements extending through the openings in the dielectric layer, the first conductive protrusions extending away from the metal layer. The method includes selectively removing portions of the metal layer from the bottom surface of the metal layer to form second conductive protrusions that extend away from the first conductive protrusions.

Abstract: A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas and to form protrusions in other areas which extend above the etched areas. An interlayer-insulating layer is formed to overlie the etched areas of the first metal layer. The interlayer-insulating layer has an inner surface which confronts the etched first areas and an outer surface remote from the inner surface, such that the protrusions extend through the interlayer-insulating layer and have ends exposed at the outer surface. A second metal layer is then provided in conductive communication with the exposed ends of the protrusions, and the first and second metal layers are selectively patterned from surfaces remote from the interlayer-insulating layer.

Abstract: A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil formed on a protrusion-forming copper layer via an etching-barrier layer formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil by using etchant that does not etch the etching-barrier layer, and protrusions are thereby formed. Then, the etching-barrier layer is removed using etchant that does not etch the copper foil and using the protrusions as masks. An interlayer-insulating layer is formed on a surface of the copper foil, on which the protrusions are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil 23 formed on a protrusion-forming copper layer 21 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a potrusion-forming copper foil 21 formed on a conductor-circuit-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil 21 formed on a protrusion-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil 21 formed on a protrusion-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: The present invention prepares a member having a conductor-circuit-forming copper foil 21 formed on a protrusion-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

Abstract: A drive control integrated circuit for controlling a motor, such as a stepping motor, a servo motor, or the like, which is operated by pulse signals, comprising: a memory circuit which stores parameters determining an operating pattern of said motor; a pulse generation circuit for generating said pulse signals for driving said motor based on the parameters stored in said memory circuit; a frequency variation circuit for continuously varying a frequency of said pulse signals of said pulse generation circuit based on said parameters stored in said memory circuit; a preset down counter circuit for controlling the number of pulses outputted from said pulse generation circuit based on said parameters stored in said memory circuit; a data selector circuit for selecting said parameters stored in said memory circuit; and a control circuit for monitoring the operational state of said motor for controlling the output of said pulse signals based on operational commands.

Abstract: A label printing device is disclosed, which comprises a keyboard having a plurality of numeral keys for inputting an article code, a data generator for generating data necessary for the formation of bar code data according to the article code, a printer and a control unit for forming bar code data having an arrangement predetermined by a bar code format read out from the memory according to data from said data generator and causing the printer to print the bar code data on label. In the memory are stored different bar code formats corresponding to a plurality of operation modes including registration and training. The control unit reads out, according to the input article code and the operation mode selected by the operation mode selection unit, a corresponding bar code format from the memory.

Abstract: A multilayer circuit board provided with multilayer wiring patterns as upper and lower multilayers is provided, in which on a first circuit board 24 with a first wiring pattern 23 formed thereon a copper foil 27 is bonded through an insulating resin layer 25, the patterning is carried out so as to form a second wiring pattern 33, and the upper and lower patterns 23 and 33 are connected to each other by conductive substance 34 filled within an opening portion 32 of the second wiring pattern 33. In accordance with this multilayer circuit board, the quality thereof is improved, the manufacturing thereof is carried out at low cost, and in addition, it becomes possible to form a circuit of high density integration.

Abstract: A novel conductive paste and a method of making the same in which metallic gallium is combined with a metal or alloy which forms a eutectic with gallium in an amount in excess of its limit of solubility in gallium at a specific temperature. This melt is then treated with a metal powder of a second metal or alloy which alloys with gallium to produce a higher melting alloy, the second metal powder being coated on its surface with the eutectic-forming metal.