Abstract: It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.

Abstract: It is aimed to provide a press-fit terminal connection structure in which a board connecting portion of a press-fit terminal is press-fit into a through hole provided in a printed circuit board and which can combine the suppression of scraping of a surface layer and a reduction of a necessary load when the press-fit terminal is inserted into and withdrawn from the through hole and an improvement of a holding force for keeping the press-fit terminal inserted in the through hole. In the press-fit terminal connection structure, the press-fit terminal includes, at least on a surface of the contact point portion, an alloy containing layer mainly containing tin and palladium, and the through hole includes a tin layer on an outermost surface of an inner peripheral surface including at least the contact point portion.

Abstract: A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.

Abstract: The present invention aims to provide a plated terminal for connector which requires a smaller insertion force by reducing a friction coefficient and a terminal pair formed using such a plated terminal for connector. An alloy containing layer (1) made of tin and palladium and containing a tin-palladium alloy is formed on a surface of a terminal base material (2) made of copper or copper alloy. Here, the alloy containing layer (1) is preferably such that domain structures of a first metal phase (11) made of an alloy of tin and palladium are formed in a second metal phase (12) made of pure tin or an alloy having a higher ratio of tin to palladium than in the first metal phase (11).

Abstract: A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.

Abstract: The present invention aims to provide a plated terminal for connector which requires a smaller insertion force by reducing a friction coefficient and a terminal pair formed using such a plated terminal for connector. An alloy containing layer (1) made of tin and palladium and containing a tin-palladium alloy is formed on a surface of a terminal base material (2) made of copper or copper alloy. Here, the alloy containing layer (1) is preferably such that domain structures of a first metal phase (11) made of an alloy of tin and palladium are formed in a second metal phase (12) made of pure tin or an alloy having a higher ratio of tin to palladium than in the first metal phase (11).