Patents by Inventor Masayuki OSADA
Masayuki OSADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11505692Abstract: In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.Type: GrantFiled: August 24, 2017Date of Patent: November 22, 2022Assignee: THREEBOND CO., LTD.Inventors: Soichi Ota, Yusuke Kuwahara, Hitoshi Mafune, Tomoya Kodama, Makoto Kato, Masayuki Osada
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Patent number: 11421133Abstract: A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time.Type: GrantFiled: June 23, 2017Date of Patent: August 23, 2022Assignee: THREEBOND CO., LTD.Inventors: Soichi Ota, Makoto Kato, Hitoshi Mafune, Masayuki Osada
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Patent number: 11359116Abstract: Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.Type: GrantFiled: August 17, 2017Date of Patent: June 14, 2022Assignee: THREEBOND CO., LTD.Inventors: Tomoya Kodama, Soichi Ota, Masayuki Osada, Hitoshi Mafune, Makoto Kato, Kanako Morii
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Publication number: 20210277289Abstract: Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.Type: ApplicationFiled: August 17, 2017Publication date: September 9, 2021Applicant: THREEBOND CO., LTD.Inventors: Tomoya KODAMA, Soichi OTA, Masayuki OSADA, Hitoshi MAFUNE, Makoto KATO, Kanako MORII
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Patent number: 10995245Abstract: An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.Type: GrantFiled: July 28, 2017Date of Patent: May 4, 2021Assignee: THREEBOND CO., LTD.Inventors: Soichi Ota, Takashi Suzuki, Makoto Kato, Hitoshi Mafune, Masayuki Osada
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Publication number: 20190194443Abstract: In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25° C. and low temperature curability in an atmosphere at 60 to 140° C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.Type: ApplicationFiled: August 24, 2017Publication date: June 27, 2019Applicant: THREEBOND CO., LTD.Inventors: Soichi OTA, Yusuke KUWAHARA, Hitoshi MAFUNE, Tomoya KODAMA, Makoto KATO, Masayuki OSADA
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Publication number: 20190177579Abstract: A thermosetting conductive adhesive that can exhibit high conductivity (low connection resistance) when cured at a high temperature in a short time. The present invention also provides a thermosetting conductive adhesive that has excellent adhesive strength when cured at a high temperature in a short time.Type: ApplicationFiled: June 23, 2017Publication date: June 13, 2019Applicant: THREEBOND CO., LTD.Inventors: Soichi OTA, Makoto KATO, Hitoshi MAFUNE, Masayuki OSADA
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Publication number: 20190177582Abstract: An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.Type: ApplicationFiled: July 28, 2017Publication date: June 13, 2019Applicant: THREEBOND CO., LTD.Inventors: Soichi OTA, Takashi SUZUKI, Makoto KATO, Hitoshi MAFUNE, Masayuki OSADA
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Patent number: 10266729Abstract: Conventional electroconductive adhesives had difficulty to have simultaneously storage stability and low temperature curability, and to have at the same time exhibition of adhesion strength and electric conductivity for poorly-adhesive metal adherends such as gold and nickel. The present invention accordingly provides an isotropic electroconductive adhesive that has low temperature curability in an atmosphere of 80 to 130° C.Type: GrantFiled: February 29, 2016Date of Patent: April 23, 2019Assignee: THREE BOND CO., LTD.Inventors: Soichi Ota, Hitoshi Mafune, Makoto Kato, Masayuki Osada, Takashi Suzuki
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Publication number: 20180079935Abstract: Conventional electroconductive adhesives had difficulty to have simultaneously storage stability and low temperature curability, and to have at the same time exhibition of adhesion strength and electric conductivity for poorly-adhesive metal adherends such as gold and nickel, the present invention accordingly provides an isotropic electroconductive adhesive that has low temperature curability in an atmosphere of 80 to 130° C.Type: ApplicationFiled: February 29, 2016Publication date: March 22, 2018Inventors: Soichi OTA, Hitoshi MAFUNE, Makoto KATO, Masayuki OSADA, Takashi SUZUKI