Abstract: A solid electrolytic capacitor (1) includes an anode foil (2a) having formed thereon an oxide film, a cathode foil (2c), and a separator (2d), and is equipped with a solid electrolyte (20) formed of an electroconductive polymer compound in a fine particle form, and a water-soluble compound solution (30) introduced to surround the solid electrolyte (20), the solid electrolyte (20) contains a polyol compound having a molecular weight of less than 200 and a number of hydroxy groups of 4 or more as a first water-soluble compound (2f1), the water-soluble compound solution (30) contains one kind or multiple kinds of a glycol compound in a liquid form as a second water-soluble compound (2f2), and the second water-soluble compound (2f2) has an average molecular weight of less than 400.

Abstract: A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.

Abstract: Provided is a packaging film including: a substrate layer that includes polyethylene; and a coating layer that includes a resin and is provided in contact with one surface of the substrate layer or is provided over one surface of the substrate layer through an anchor coat layer. In one preferable aspect of the packaging film, when a glass transition temperature of the coating layer is represented by Tgc and a glass transition temperature of the substrate layer is represented by Tgs, a value of Tgc is ?25° C. to 120° C. and a value of Tgc-Tgs is 90° C. to 245° C.

Abstract: For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate.

Abstract: For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate.

Abstract: An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.

Abstract: An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7′), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc.

Abstract: An electronic device, comprising: a substrate of insulating resin having at least a pair of interior terminal portions for connection upon an upper surface thereof; an electronic element mounted on the terminal portions on the upper surface of said substrate, having at least a pair of electrode terminals thereof; a frame member of insulating resin, bonded on the upper surface of said substrate, and having a cavity formed for storing said electronic element therein; and a cover member of insulating material, for hermetically sealing over the cavity of said frame member, in which said electronic element is stored, wherein electrodes are formed at or in vicinity of positions of the terminals of said electronic element stored within said cavity, for electrically conducting said interior terminal portions for connection to an outside, or wherein roughened surfaces are formed on metal electrode portions, which are formed on the upper surface of said substrate for electrically conducting said interior terminal porti

Abstract: An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7′), in particular within a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc.

Abstract: An electrical junction block for an automobile which can be used in an atmosphere at temperatures equal to or higher than 70.degree. C. and in which metal bus bars formed in preset circuit patterns are used as a wiring connection inside a case body. The case body of the electrical junction block is molded by using a nylon polymer alloy. A method for manufacturing an electrical junction block for automobiles. The electrical junction block having upper and lower case bodies which are engaged with each other. The upper and lower case bodies are molded by using a nylon polymer alloy, and functional parts are mounted without incurring a moisture absorbing process.

Abstract: A process for treating an aqueous solution containing organic compounds and having a high chemical oxygen demand (COD) by distilling the aqueous solution at a pH not lower than 9, and recovering the water of low chemical oxygen demand (COD) from said aqueous solution. The aqueous solution containing the organic compounds to be treated is derived from the reaction mixture of the oxidation system of methyl-substituted aromatic compound in the liquid phase with molecular oxygen or a molecular oxygen-containing gas, in the presence of a heavy metal catalyst but in the substantial absence of a lower aliphatic acid solvent, to form the corresponding aromatic acid.