Patents by Inventor Masayuki Shimura
Masayuki Shimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240018295Abstract: A thermosetting resin composition includes a hydroxy group-containing fluorocarbon resin, an isocyanate compound having two or more isocyanate groups, and a rutile titanium oxide, in which the mass ratio of the fluorocarbon resin to the isocyanate compound is 1 or more and 20 or less, and the mass ratio of the rutile titanium oxide to the fluorocarbon resin is 1.4 or more and 4 or less. In addition, when elemental analysis by the combustion method is performed on a cured product obtained by curing the thermosetting resin composition, ashes at a content of 45% by mass or more, fluorine atoms at a content of 3% by mass or more, and nitrogen atoms at a content of 0.1% by mass or more are detected when the total is defined as 100% by mass.Type: ApplicationFiled: November 16, 2021Publication date: January 18, 2024Applicant: TAIYO INK MFG. CO., LTD.Inventors: Meiten KOH, Haruka ONODA, Masayuki SHIMURA, Kosuke NAKAJIMA
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Patent number: 11535766Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering.Type: GrantFiled: March 26, 2019Date of Patent: December 27, 2022Assignee: TAIYO INK MFG. CO., LTD.Inventors: Masayuki Shimura, Hideyuki Ito, Hiroshi Matsumoto, Xiaozhu Wei, Rina Yoshikawa
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Publication number: 20210032483Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering.Type: ApplicationFiled: March 26, 2019Publication date: February 4, 2021Applicant: TAIYO INK MFG. CO., LTD.Inventors: Masayuki SHIMURA, Hideyuki ITO, Hiroshi MATSUMOTO, Xiaozhu WEI, Rina YOSHIKAWA
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Publication number: 20210032486Abstract: [Problem to be Solved] Provided are a curable composition free from prior art shortcomings, having an excellent reflectance, yellowing properties, solder heat resistance, and crack resistance; a cured product of the curable composition and an electronic component having the cured product. [Solution] A curable composition including (A) a white colorant, (B) a photopolymerization initiator, (C) a di- or higher functional (meth)acrylate monomer having a heterocycle, and (D) a thermosetting compound; a cured product thereof; and an electronic component having the cured product were obtained.Type: ApplicationFiled: March 26, 2019Publication date: February 4, 2021Applicant: TAIYO INK MFG. CO., LTD.Inventors: Rina YOSHIKAWA, Hideyuki ITO, Hiroshi MATSUMOTO, Xiaozhu WEI, Masayuki SHIMURA
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Patent number: 10907066Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.Type: GrantFiled: February 9, 2017Date of Patent: February 2, 2021Assignee: TAIYO INK MFG. CO., LTD.Inventors: Rina Yoshikawa, Masato Yoshida, Masayuki Shimura, Hiroshi Matsumoto
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Publication number: 20210017410Abstract: Provided is a curable composition for inkjet printing that has an excellent curing performance at surface point and an excellent curing performance at deep point. The curable composition for inkjet contains (A) an oxime ester-based photopolymerization initiator and (B) an amino group-containing (meth)acrylate compound.Type: ApplicationFiled: March 26, 2019Publication date: January 21, 2021Applicant: TAIYO INK MFG. CO., LTD.Inventors: Hideyuki ITO, Masayuki SHIMURA, Hiroshi MATSUMOTO, Xiaozhu WEI, Rina YOSHIKAWA
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Publication number: 20210017412Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing for obtaining a cured product excellent in heat resistance, adhesion to a substrate, and hardness. [Solution] The curable composition for inkjet printing comprises (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.Type: ApplicationFiled: March 26, 2019Publication date: January 21, 2021Applicant: TAIYO INK MFG. CO., LTD.Inventors: Xiaozhu WEI, Rina YOSHIKAWA, Hideyuki ITO, Hiroshi MATSUMOTO, Masayuki SHIMURA
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Patent number: 10759890Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.Type: GrantFiled: September 30, 2014Date of Patent: September 1, 2020Assignee: TAIYO INK MFG. CO., LTD.Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
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Publication number: 20190071581Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.Type: ApplicationFiled: February 9, 2017Publication date: March 7, 2019Applicant: TAIYO INK MFG. CO., LTD.Inventors: Rina YOSHIKAWA, Masato YOSHIDA, Masayuki SHIMURA, Hiroshi MATSUMOTO
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Patent number: 10113066Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).Type: GrantFiled: November 4, 2014Date of Patent: October 30, 2018Assignee: TAIYO INK MFG. CO., LTD.Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
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Patent number: 10005911Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.Type: GrantFiled: September 30, 2014Date of Patent: June 26, 2018Assignee: TAIYO INK MFG. CO., LTD.Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
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Patent number: 9797298Abstract: An engine air intake structure includes a partition plate and a valve. The plate partitions an air intake passage communicating with an intake port into first and second paths. The valve is disposed in the passage and secured to the shaft. A first path opening is changed variable by the valve. The structure also includes an opposing surface, a stepped surface, an extending surface and a measurement groove. The opposing surface is an inner wall surface of the passage and opposes an end away from the shaft when the opening becomes minimal. The stepped surface is located on the intake port side of the end of the valve at the minimal opening and stands erect from the opposing surface. The extending surface extends from the stepped surface toward the intake port. The measurement groove is formed in the extending surface and extends from the stepped surface toward the intake port.Type: GrantFiled: August 18, 2016Date of Patent: October 24, 2017Assignee: SUBARU CORPORATIONInventors: Yosuke Suzuki, Hirofumi Imanishi, Masayuki Shimura
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Publication number: 20170067392Abstract: An engine air intake structure includes a partition plate and a valve. The plate partitions an air intake passage communicating with an intake port into first and second paths. The valve is disposed in the passage and secured to the shaft. A first path opening is changed variable by the valve. The structure also includes an opposing surface, a stepped surface, an extending surface and a measurement groove. The opposing surface is an inner wall surface of the passage and opposes an end away from the shaft when the opening becomes minimal. The stepped surface is located on the intake port side of the end of the valve at the minimal opening and stands erect from the opposing surface. The extending surface extends from the stepped surface toward the intake port. The measurement groove is formed in the extending surface and extends from the stepped surface toward the intake port.Type: ApplicationFiled: August 18, 2016Publication date: March 9, 2017Inventors: Yosuke SUZUKI, Hirofumi IMANISHI, Masayuki SHIMURA
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Patent number: 9453137Abstract: A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.Type: GrantFiled: March 25, 2013Date of Patent: September 27, 2016Assignee: Taiyo Holdings Co., Ltd.Inventors: Sungho Choi, Masayuki Shimura, Takeshi Yoda, Shigeru Ushiki
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Publication number: 20160251520Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.Type: ApplicationFiled: September 30, 2014Publication date: September 1, 2016Applicant: TAIYO INK MFG. CO. LTD.Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
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Publication number: 20160237282Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).Type: ApplicationFiled: November 4, 2014Publication date: August 18, 2016Applicant: TAIYO INK MFG. CO., LTD.Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
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Publication number: 20160215084Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.Type: ApplicationFiled: September 30, 2014Publication date: July 28, 2016Applicant: TAIYO INK MFG CO., LTD.Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
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Patent number: 9265156Abstract: A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.Type: GrantFiled: March 27, 2014Date of Patent: February 16, 2016Assignee: Taiyo Ink Mfg. Co., Ltd.Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto, Shoji Minegishi
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Patent number: 9182665Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.Type: GrantFiled: September 30, 2014Date of Patent: November 10, 2015Assignee: TAIYO INK MFG. CO., LTD.Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
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Publication number: 20150093690Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.Type: ApplicationFiled: September 30, 2014Publication date: April 2, 2015Applicant: TAIYO INK MFG. CO., LTD.Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO