Patents by Inventor Masayuki Shimura

Masayuki Shimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210032486
    Abstract: [Problem to be Solved] Provided are a curable composition free from prior art shortcomings, having an excellent reflectance, yellowing properties, solder heat resistance, and crack resistance; a cured product of the curable composition and an electronic component having the cured product. [Solution] A curable composition including (A) a white colorant, (B) a photopolymerization initiator, (C) a di- or higher functional (meth)acrylate monomer having a heterocycle, and (D) a thermosetting compound; a cured product thereof; and an electronic component having the cured product were obtained.
    Type: Application
    Filed: March 26, 2019
    Publication date: February 4, 2021
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Rina YOSHIKAWA, Hideyuki ITO, Hiroshi MATSUMOTO, Xiaozhu WEI, Masayuki SHIMURA
  • Publication number: 20210032483
    Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing, a coating film obtained from which has higher heat resistance than conventional coating films. [Solution] It is a curable composition for inkjet printing, comprising (A) a (meth)acrylate monomer having a cyclic skeleton and having a number of alkylene oxide modifications of one or more and six or less, (B1) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having two or more alkylene glycol structures, (B2) a bifunctional (meth)acrylate monomer having no cyclic skeleton and having a monoalkylene glycol structure, and (C) a photopolymerization initiator. Accordingly, an obtained coating film does not crack, has excellent adhesion to a conductor, and maintains sufficient hardness even after a thermal history that corresponds to a plurality of times of soldering.
    Type: Application
    Filed: March 26, 2019
    Publication date: February 4, 2021
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Hideyuki ITO, Hiroshi MATSUMOTO, Xiaozhu WEI, Rina YOSHIKAWA
  • Patent number: 10907066
    Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: February 2, 2021
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Rina Yoshikawa, Masato Yoshida, Masayuki Shimura, Hiroshi Matsumoto
  • Publication number: 20210017412
    Abstract: [Problem to be Solved] Provided is a curable composition for inkjet printing for obtaining a cured product excellent in heat resistance, adhesion to a substrate, and hardness. [Solution] The curable composition for inkjet printing comprises (A) a multi-branched oligomer or polymer having an ethylenically unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.
    Type: Application
    Filed: March 26, 2019
    Publication date: January 21, 2021
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Xiaozhu WEI, Rina YOSHIKAWA, Hideyuki ITO, Hiroshi MATSUMOTO, Masayuki SHIMURA
  • Publication number: 20210017410
    Abstract: Provided is a curable composition for inkjet printing that has an excellent curing performance at surface point and an excellent curing performance at deep point. The curable composition for inkjet contains (A) an oxime ester-based photopolymerization initiator and (B) an amino group-containing (meth)acrylate compound.
    Type: Application
    Filed: March 26, 2019
    Publication date: January 21, 2021
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Hideyuki ITO, Masayuki SHIMURA, Hiroshi MATSUMOTO, Xiaozhu WEI, Rina YOSHIKAWA
  • Patent number: 10759890
    Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: September 1, 2020
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Publication number: 20190071581
    Abstract: Provided are a curable composition for inkjet, which not only allows surface curability in formation of a coating film by an inkjet system to be enhanced, but also is not reduced in characteristics conventionally provided, such as solder heat resistance and gold plating resistance, and a cured product and a printed wiring board using the curable composition. The curable composition for inkjet of the present invention includes (A) an alkylene chain-containing bifunctional (meth)acrylate compound, (B) an ?-aminoalkylphenone-based photopolymerization initiator, and (C) an acylphosphine oxide-based photopolymerization initiator, wherein, when the thickness is 10 ?m, the absorbance at a wavelength of 365 nm is 0.08 to 0.8 and the absorbance at a wavelength of 385 nm is 0.05 to 0.3.
    Type: Application
    Filed: February 9, 2017
    Publication date: March 7, 2019
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Rina YOSHIKAWA, Masato YOSHIDA, Masayuki SHIMURA, Hiroshi MATSUMOTO
  • Patent number: 10113066
    Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: October 30, 2018
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 10005911
    Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: June 26, 2018
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Patent number: 9797298
    Abstract: An engine air intake structure includes a partition plate and a valve. The plate partitions an air intake passage communicating with an intake port into first and second paths. The valve is disposed in the passage and secured to the shaft. A first path opening is changed variable by the valve. The structure also includes an opposing surface, a stepped surface, an extending surface and a measurement groove. The opposing surface is an inner wall surface of the passage and opposes an end away from the shaft when the opening becomes minimal. The stepped surface is located on the intake port side of the end of the valve at the minimal opening and stands erect from the opposing surface. The extending surface extends from the stepped surface toward the intake port. The measurement groove is formed in the extending surface and extends from the stepped surface toward the intake port.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: October 24, 2017
    Assignee: SUBARU CORPORATION
    Inventors: Yosuke Suzuki, Hirofumi Imanishi, Masayuki Shimura
  • Publication number: 20170067392
    Abstract: An engine air intake structure includes a partition plate and a valve. The plate partitions an air intake passage communicating with an intake port into first and second paths. The valve is disposed in the passage and secured to the shaft. A first path opening is changed variable by the valve. The structure also includes an opposing surface, a stepped surface, an extending surface and a measurement groove. The opposing surface is an inner wall surface of the passage and opposes an end away from the shaft when the opening becomes minimal. The stepped surface is located on the intake port side of the end of the valve at the minimal opening and stands erect from the opposing surface. The extending surface extends from the stepped surface toward the intake port. The measurement groove is formed in the extending surface and extends from the stepped surface toward the intake port.
    Type: Application
    Filed: August 18, 2016
    Publication date: March 9, 2017
    Inventors: Yosuke SUZUKI, Hirofumi IMANISHI, Masayuki SHIMURA
  • Patent number: 9453137
    Abstract: A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: September 27, 2016
    Assignee: Taiyo Holdings Co., Ltd.
    Inventors: Sungho Choi, Masayuki Shimura, Takeshi Yoda, Shigeru Ushiki
  • Publication number: 20160251520
    Abstract: Provided is a curable composition for a printed wiring board, which composition exhibits high physical strength as a coating film in terms of solder heat resistance, pencil hardness and the like and in which the components contained therein are not likely to precipitate in long-term storage even when the composition is configured to have a low viscosity and thereby made applicable to ink-jet printing, spin-coating and the like. The curable composition for a printed wiring board is characterized by comprising (A) a filler having a specific gravity of 3 or less, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator. The (A) filler having a specific gravity of 3 or less is preferably an inorganic filler.
    Type: Application
    Filed: September 30, 2014
    Publication date: September 1, 2016
    Applicant: TAIYO INK MFG. CO. LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20160237282
    Abstract: Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).
    Type: Application
    Filed: November 4, 2014
    Publication date: August 18, 2016
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20160215084
    Abstract: Provided are: a curable composition that has excellent flexibility and shows excellent adhesion to both a plastic substrate and a conductor layer; a coating film of the curable composition; and a printed circuit board comprising a pattern-cured coating film obtained from the coating film. The present invention relates to: a curable composition for a printed circuit board, which is characterized by comprising (A) a block copolymer, (B) a hydroxyl group-containing (meth)acrylate compound and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed from the coating film.
    Type: Application
    Filed: September 30, 2014
    Publication date: July 28, 2016
    Applicant: TAIYO INK MFG CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Patent number: 9265156
    Abstract: A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: February 16, 2016
    Assignee: Taiyo Ink Mfg. Co., Ltd.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto, Shoji Minegishi
  • Patent number: 9182665
    Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: November 10, 2015
    Assignee: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki Shimura, Yoshiyuki Furuta, Masao Yumoto
  • Publication number: 20150090482
    Abstract: Provided are: a curable composition which can attain both good adhesion to a printed circuit board, particularly to a flexible substrate or the like; a resist coating film of the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition. By the present invention, a curable composition for a printed circuit board comprising (A) a compound having a triazine ring, (B) a (meth)acrylate compound having a hydroxyl group and (C) a photopolymerization initiator; a coating film obtained by photo-curing the curable composition; and a printed circuit board comprising a resist pattern formed by the curable composition, are obtained.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 2, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20150093690
    Abstract: An object of the present invention is to obtain a white curable composition that can yield a highly reflective cured coating film without requiring a complicated step and show good dispersion even without being subjected to an extended dispersion treatment. Provided is a white curable composition for a printed circuit board comprising: (A) a white pigment; (B) a (meth)acrylate compound having a hydroxyl group; (C) a photopolymerization initiator; and (D) a wetting dispersant. The above-described (A) white pigment is preferably titanium oxide. Further, it is also preferred that the above-described titanium oxide be a rutile-type titanium oxide and have a maximum particle size of 1 ?m or smaller.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 2, 2015
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Masayuki SHIMURA, Yoshiyuki FURUTA, Masao YUMOTO
  • Publication number: 20150064417
    Abstract: A photocurable and thermally curable composition having a viscosity suitable for application to an inkjet printer is prepared. By the composition, it is made possible to directly draw a pattern on a substrate for a printed wiring board. The composition is cured at a relatively low temperature, having excellent adhesion, chemical resistance, heat resistance, and insulating properties after curing. The photocurable and thermally curable composition includes a (meth)acryloyl group-containing monomer, a block isocyanate, and a photo-polymerization initiator, wherein the composition is applicable to inkjet printing.
    Type: Application
    Filed: March 25, 2013
    Publication date: March 5, 2015
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Sungho Choi, Masayuki Shimura, Takeshi Yoda, Shigeru Ushiki