Patents by Inventor Masayuki SUGANUMATA

Masayuki SUGANUMATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Strain inducing body for suppressing displacement of sensor chip mounting site and force sensor device including the same
    Patent number: 11835403
    Abstract: A strain inducing body includes a strain inducing portion including a movable portion that deforms in response to force or moment in a predetermined axial direction and a non-movable portion that does not deform in response to the force or moment, and an input transmitter that is connected to the non-movable portion and does not deform in response to the force or moment, wherein the input transmitter includes, a first frame portion, a plurality of first beam structures each of which has one end thereof connected to the first frame portion and extends from the first frame portion to an inside of the first frame portion, a first coupling portion that connects other ends of the first beam structures, an accommodating portion that is provided inside the first coupling portion and that is capable of housing a sensor chip to detect the force or the moment.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: December 5, 2023
    Assignee: MINEBEA MITSUMI Inc.
    Inventor: Masayuki Suganumata
  • STRAIN INDUCING BODY AND FORCE SENSOR DEVICE
    Publication number: 20220299384
    Abstract: A strain inducing body includes a strain inducing portion including a movable portion that deforms in response to force or moment in a predetermined axial direction and a non-movable portion that does not deform in response to the force or moment, and an input transmitter that is connected to the non-movable portion and does not deform in response to the force or moment, wherein the input transmitter includes, a first frame portion, a plurality of first beam structures each of which has one end thereof connected to the first frame portion and extends from the first frame portion to an inside of the first frame portion, a first coupling portion that connects other ends of the first beam structures, an accommodating portion that is provided inside the first coupling portion and that is capable of housing a sensor chip to detect the force or the moment.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 22, 2022
    Inventor: Masayuki SUGANUMATA
  • Semiconductor sensor device and electronic apparatus including the semiconductor device
    Patent number: 9056761
    Abstract: Disclosed is a semiconductor sensor device, including a substrate, a sensor element mounted on the substrate, a hollow member configured to surround a periphery of the sensor element, a sealing material configured to fill in the hollow member and cover the sensor element, and a recess formed on the substrate, the recess being configured to position the hollow member.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: June 16, 2015
    Assignee: MITSUMI ELECTRIC CO., LTD.
    Inventor: Masayuki Suganumata
  • SEMICONDUCTOR SENSOR DEVICE AND ELECTRONIC APPARATUS
    Publication number: 20130234264
    Abstract: Disclosed is a semiconductor sensor device, including a substrate, a sensor element mounted on the substrate, a hollow member configured to surround a periphery of the sensor element, a sealing material configured to fill in the hollow member and cover the sensor element, and a recess formed on the substrate, the recess being configured to position the hollow member.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 12, 2013
    Applicant: MITSUMI ELECTRIC CO., LTD.
    Inventor: Masayuki SUGANUMATA