Patents by Inventor Masayuki Sumita
Masayuki Sumita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11721828Abstract: An apparatus for manufacturing a laminated electrode body that includes a laminating unit having a rotatable cross arm, a first transport head and a third transport head at a first distance from a rotation center of the cross arm and a second transport head and a fourth transport head at a second distance shorter than the first distance from the rotation center; a positive electrode supply stage that includes a first positive electrode mounting table at the first distance and a second positive electrode mounting table at the second distance from the rotation center; a negative electrode supply stage that includes a first negative electrode mounting table at the first distance and a second negative electrode mounting table at the second distance from the rotation center; a first laminating stage at the first distance from the rotation center; and a second laminating stage at the second distance.Type: GrantFiled: August 10, 2020Date of Patent: August 8, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideyasu Kamigawa, Takeshi Yamamoto, Masayuki Sumita
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Patent number: 11476491Abstract: An electrode pressure-bonding device that includes a feeding device that feeds a separator material in a strip shape in a feeding direction; a support stage under the separator material and configured to support an electrode on the separator material with the separator material interposed between the electrode and the support stage; and a pressure-bonding device that holds the separator material and the electrode together and pressure-bonds at least part of the separator material to the electrode.Type: GrantFiled: January 15, 2020Date of Patent: October 18, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Masayuki Sumita, Hideyasu Kamigawa, Takeshi Yamamoto
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Patent number: 11090827Abstract: A cutting device includes a guide extending in a vertical direction, a cutting mechanism that includes a cutting blade and that moves in the vertical direction along the guide, a drive device that moves the cutting mechanism in a horizontal direction by moving the guide in the horizontal direction, a pressing device that presses the cutting mechanism from above, and a reception base on which a cutting object is placed and that receives the cutting blade during the cutting movement. During cutting of the cutting object, the cutting mechanism pressed by the pressing device is moved downward along the guide and cuts the cutting object placed on the reception base with the cutting blade.Type: GrantFiled: January 23, 2020Date of Patent: August 17, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takeshi Yamamoto, Hideyasu Kamigawa, Masayuki Sumita
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Patent number: 10991968Abstract: A conveying device includes a flat plate member including a through-hole and a first conveying head that sucks a conveyance object via the through-hole in a state of holding the flat plate member and conveys the flat plate member and the conveyance object to an accommodation case. Moreover, the flat plate member has a shape that prevents an end of the conveyance object from abutting an inner side surface of the accommodation case during placement into the accommodation case.Type: GrantFiled: January 23, 2020Date of Patent: April 27, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Hideyasu Kamigawa, Koichiro Fujiwake, Masayuki Sumita
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Publication number: 20200373606Abstract: An apparatus for manufacturing a laminated electrode body that includes a laminating unit having a rotatable cross arm, a first transport head and a third transport head at a first distance from a rotation center of the cross arm and a second transport head and a fourth transport head at a second distance shorter than the first distance from the rotation center; a positive electrode supply stage that includes a first positive electrode mounting table at the first distance and a second positive electrode mounting table at the second distance from the rotation center; a negative electrode supply stage that includes a first negative electrode mounting table at the first distance and a second negative electrode mounting table at the second distance from the rotation center; a first laminating stage at the first distance from the rotation center; and a second laminating stage at the second distance.Type: ApplicationFiled: August 10, 2020Publication date: November 26, 2020Inventors: Hideyasu Kamigawa, Takeshi Yamamoto, Masayuki Sumita
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Publication number: 20200156276Abstract: A cutting device includes a guide extending in a vertical direction, a cutting mechanism that includes a cutting blade and that moves in the vertical direction along the guide, a drive device that moves the cutting mechanism in a horizontal direction by moving the guide in the horizontal direction, a pressing device that presses the cutting mechanism from above, and a reception base on which a cutting object is placed and that receives the cutting blade during the cutting movement. During cutting of the cutting object, the cutting mechanism pressed by the pressing device is moved downward along the guide and cuts the cutting object placed on the reception base with the cutting blade.Type: ApplicationFiled: January 23, 2020Publication date: May 21, 2020Inventors: Takeshi Yamamoto, Hideyasu Kamigawa, Masayuki Sumita
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Publication number: 20200161693Abstract: A conveying device includes a flat plate member including a through-hole and a first conveying head that sucks a conveyance object via the through-hole in a state of holding the flat plate member and conveys the flat plate member and the conveyance object to an accommodation case. Moreover, the flat plate member has a shape that prevents an end of the conveyance object from abutting an inner side surface of the accommodation case during placement into the accommodation case.Type: ApplicationFiled: January 23, 2020Publication date: May 21, 2020Inventors: HIDEYASU Kamigawa, Koichiro Fujiwake, Masayuki Sumita
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Publication number: 20200152944Abstract: A manufacturing device for manufacturing an electrode assembly by laminating unit electrode assemblies in each of which an electrode is placed on a separator. The device includes a transferring device that includes a sucking plate and transfers, onto the positional adjustment stage, each of the unit electrode assemblies sucked up by the sucking plate. Moreover, an image capturing device captures an image of the electrode of each of the unit electrode assemblies placed on the positional adjustment stage. A positional adjustment device positionally adjusts the positional adjustment stage based on the image of the electrode captured, and a transferring and laminating device picks up each unit electrode assembly and transfers each to a lamination stage and performs a lamination process. At least part of the sucking plate is transparent and the image capturing device captures an image of the electrode from above the transparent portion of the sucking plate.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: MASAYUKI Sumita, Makoto Ooike, Hideyasu Kamigawa
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Publication number: 20200153027Abstract: An electrode pressure-bonding device that includes a feeding device that feeds a separator material in a strip shape in a feeding direction; a support stage under the separator material and configured to support an electrode on the separator material with the separator material interposed between the electrode and the support stage; and a pressure-bonding device that holds the separator material and the electrode together and pressure-bonds at least part of the separator material to the electrode.Type: ApplicationFiled: January 15, 2020Publication date: May 14, 2020Inventors: MASAYUKI SUMITA, Hideyasu Kamigawa, Takeshi Yamamoto
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Patent number: 7508495Abstract: A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.Type: GrantFiled: November 19, 2007Date of Patent: March 24, 2009Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoya Adachi, Masayuki Sumita, Masaki Sekino
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Publication number: 20080068581Abstract: A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.Type: ApplicationFiled: November 19, 2007Publication date: March 20, 2008Inventors: Naoya Adachi, Masayuki Sumita, Masaki Sekino