Abstract: The present invention provides a surface treatment apparatus which can treat a surface with high speed and high quality. A casing of a surface treatment apparatus is defined into two chambers, a plasma generation chamber provided with a plasma generation electrode and a substrate treatment chamber provided with a substrate support table. A plasma nozzle is formed on an anode electrode constituting a partition wall of the both chambers. A recess is formed on an upper cathode electrode. Further, the plasma nozzle is used as a hollow anode discharge generation area, and the recess as a hollow cathode discharge generation area.

Abstract: The present invention has an object to provide a surface treatment apparatus, which can form a high-quality film at a high speed while preventing deterioration of the film due to collisions of charged particles. The surface treatment apparatus (1) of the present invention comprises a casing (2) partitioned to two chambers, that is, a plasma generating chamber (3) provided with plasma generating electrodes (5, 5?) and a substrate processing chamber (4) provided with a substrate supporting table (8). A plasma vent (6) is formed in the electrode (5?) that composes the partition between the chambers (3, 4). A conductive mesh-shaped sheet (9) is disposed in a direction across the plasma between the plasma vent (6) and a substrate (S) on the substrate supporting table (8). The sheet (9), to which a variable bias is applied, captures charged particles in the plasma so that the charged particles can be excluded from the plasma.

Abstract: The present invention has an object to provide a surface treatment apparatus, which can form a high-quality film at a high speed while preventing deterioration of the film due to collisions of charged particles. The surface treatment apparatus (1) of the present invention comprises a casing (2) partitioned to two chambers, that is, a plasma generating chamber (3) provided with plasma generating electrodes (5, 5?) and a substrate processing chamber (4) provided with a substrate supporting table (8). A plasma vent (6) is formed in the electrode (5?) that composes the partition between the chambers (3, 4). A conductive mesh-shaped sheet (9) is disposed in a direction across the plasma between the plasma vent (6) and a substrate (S) on the substrate supporting table (8). The sheet (9), to which a variable bias is applied, captures charged particles in the plasma so that the charged particles can be excluded from the plasma.

Abstract: The present invention provides a surface treatment apparatus which can treat a surface with high speed and high quality. A casing of a surface treatment apparatus is defined into two chambers, a plasma generation chamber provided with a plasma generation electrode and a substrate treatment chamber provided with a substrate support table. A plasma nozzle is formed on an anode electrode constituting a partition wall of the both chambers. A recess is formed on an upper cathode electrode. Further, the plasma nozzle is used as a hollow anode discharge generation area, and the recess as a hollow cathode discharge generation area.

Abstract: The present invention provides a surface treatment apparatus which can treat a surface with high speed and high quality. A casing of a surface treatment apparatus is defined into two chambers, a plasma generation chamber provided with a plasma generation electrode and a substrate treatment chamber provided with a substrate support table. A plasma nozzle is formed on an anode electrode constituting a partition wall of the both chambers. A recess is formed on an upper cathode electrode. Further, the plasma nozzle is used as a hollow anode discharge generation area, and the recess as a hollow cathode discharge generation area.

Abstract: The present invention provides a surface treatment apparatus which can treat a surface with high speed and high quality. A casing of a surface treatment apparatus is defined into two chambers, a plasma generation chamber provided with a plasma generation electrode and a substrate treatment chamber provided with a substrate support table. A plasma nozzle is formed on an anode electrode constituting a partition wall of the both chambers. A recess is formed on an upper cathode electrode. Further, the plasma nozzle is used as a hollow anode discharge generation area, and the recess as a hollow cathode discharge generation area.