Patents by Inventor Masayuki Takenaka

Masayuki Takenaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200295696
    Abstract: A rotary electric machine control device that performs drive control on an AC rotary electric machine using an inverter that converts power between DC power and AC power through pulse width modulation based on a carrier frequency, the rotary electric machine control device including: an electronic control unit that is configured to vary the carrier frequency such that the carrier frequency becomes higher as a rotational speed of the rotary electric machine becomes higher so that carrier sideband frequencies, which are frequencies of sideband waves that appear on higher and lower sides of a center frequency that is set in accordance with the carrier frequency, are not included in a frequency band prescribed in advance.
    Type: Application
    Filed: March 27, 2018
    Publication date: September 17, 2020
    Applicant: AISIN AW CO., LTD.
    Inventors: Masayuki TAKENAKA, Takuro IWASE, Akiya KUME, Shoji NAGATA, Yasuyuki SATO
  • Patent number: 10725401
    Abstract: A developing device includes a housing having an opening in a wall, a developing roller having a hollow interior portion, a magnetic pole structure disposed within the hollow interior portion of the roller, a gap forming member, and a blocking member. The gap forming member is located within, and spaced from, the housing at a location downstream, in the rotation direction of the developing roller, of the opening in the wall of the housing, forms a first gap with respect to the developing roller and forms a second gap with respect to the housing. The gap forming member has a first side facing the opening in the wall of the housing and a second side spaced inwardly of the housing, from the first wall. The blocking member is located in the first gap and at one of the first and second sides of the gap forming member.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: July 28, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Masato Ogasawara, Masayuki Kasukawa, Koji Imamiya, Sunao Takenaka
  • Publication number: 20200190106
    Abstract: A chromene compound having at least one indenonaphthopyran moiety which has a group forming a spiro ring together with the 13-position carbon atom and further an oligomer chain group selected from a polyalkylene oxide oligomer chain group having at least three recurring units and a polyester oligomer chain group having at least three recurring units, represented by the following formula and having reduced matrix dependence: wherein R1 and R2 are each a group which may have an oligomer chain group, the ring Z bonded to the 13-position carbon atom of the chromene compound is a Spiro ring group, and R3 and R4 are each an aryl group or heteroaryl group which may have an oligomer chain group. Preferably, the chromene compound has at least one oligomer chain group in the molecule.
    Type: Application
    Filed: July 11, 2018
    Publication date: June 18, 2020
    Applicant: TOKUYAMA CORPORATION
    Inventors: Masayuki MIYAZAKI, Junji TAKENAKA
  • Publication number: 20200172681
    Abstract: A photochromic polyrotaxane compound which comprises an axial molecule and a plurality of cyclic molecules clathrating the axial molecule, wherein at least one side chain containing a photochromic moiety is bonded to at least one of the cyclic molecules, and a curable composition comprising the photochromic polyrotaxane compound and a polymerizable compound.
    Type: Application
    Filed: June 18, 2018
    Publication date: June 4, 2020
    Applicant: TOKUYAMA CORPORATION
    Inventors: Junji TAKENAKA, Junji MOMODA, Takayoshi KAWASAKI, Takao NOGUCHI, Yasutomo SHIMIZU, Masayuki MIYAZAKI
  • Patent number: 10109557
    Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: October 23, 2018
    Assignee: DENSO CORPORATION
    Inventors: Tetsuto Yamagishi, Toshihiro Nagaya, Masayuki Takenaka, Shinji Hiramitsu
  • Patent number: 9941182
    Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 10, 2018
    Assignee: DENSO CORPORATION
    Inventors: Norihisa Imaizumi, Yuuki Sanada, Masayuki Takenaka, Shinya Uchibori, Kengo Oka, Tasuke Fukuda, Keitarou Nakama
  • Patent number: 9832872
    Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: November 28, 2017
    Assignee: DENSO CORPORATION
    Inventors: Tetsuto Yamagishi, Masayuki Takenaka, Toshihiro Nagaya, Shinji Hiramitsu
  • Publication number: 20170330818
    Abstract: An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation element that is a circuit element mounted on a first surface of the resin substrate, and is operated to generate heat; and a sealing resin that is provided on the first surface, and seals the heat-generation element. An opposite surface of the sealing resin opposite to a surface of the sealing resin in contact with the first surface is thermally connected to a heat radiation member and mounted on the heat radiation member. Each of the resin substrate and the sealing resin has a bend shape convex toward the opposite surface when each of surrounding temperatures is a normal temperature and has a linear expansion coefficient for maintaining a bend shape convex toward the opposite surface when each of the surrounding temperatures is a high temperature.
    Type: Application
    Filed: December 11, 2015
    Publication date: November 16, 2017
    Inventors: Tetsuto YAMAGISHI, Toshihiro NAGAYA, Masayuki TAKENAKA, Shinji HIRAMITSU
  • Patent number: 9686854
    Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: June 20, 2017
    Assignee: DENSO CORPORATION
    Inventors: Yuuki Sanada, Norihisa Imaizumi, Shinya Uchibori, Masaji Imada, Toshihiro Nakamura, Eiji Yabuta, Masayuki Takenaka
  • Publication number: 20170135210
    Abstract: A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.
    Type: Application
    Filed: September 14, 2015
    Publication date: May 11, 2017
    Inventors: Tetsuto YAMAGISHI, Masayuki TAKENAKA, Toshihiro NAGAYA, Shinji HIRAMITSU
  • Patent number: 9646907
    Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: May 9, 2017
    Assignee: DENSO CORPORATION
    Inventors: Kengo Oka, Yuki Sanada, Masayuki Takenaka, Shinya Uchibori, Tasuke Fukuda
  • Publication number: 20160163613
    Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.
    Type: Application
    Filed: June 24, 2014
    Publication date: June 9, 2016
    Inventors: Shinya UCHIBORI, Norihisa IMAIZUMI, Masayuki TAKENAKA
  • Publication number: 20160150655
    Abstract: An electronic apparatus includes a board, an electronic component, a mold resin a rod-like connection terminal and a case. The board includes: a first surface; a second surface, which is opposite to the first surface; a wire pattern; and a through-hole having a metal member connected to the wire pattern. The electronic component mounted on the first surface of the board. The mold resin seals the electronic component on the first surface of the board. The rod-like connection terminal inserted into the through-hole from a distal end of the through-hole and electrically connected to the metal member. The case having a surface on which the connection terminal stands and accommodating the board on which the electronic component is mounted. The board is arranged such that the first surface on which the electronic component and the mold resin are arranged faces the surface of the case on which the connection terminal stands.
    Type: Application
    Filed: June 17, 2014
    Publication date: May 26, 2016
    Inventors: Masayuki TAKENAKA, Norihisa IMAIZUMI, Toshihiro NAKAMURA
  • Publication number: 20160133539
    Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.
    Type: Application
    Filed: May 29, 2014
    Publication date: May 12, 2016
    Inventors: Kengo OKA, Yuki SANADA, Masayuki TAKENAKA, Shinya UCHIBORI, Tasuke FUKUDA
  • Publication number: 20160104653
    Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.
    Type: Application
    Filed: June 3, 2014
    Publication date: April 14, 2016
    Inventors: Norihisa IMAIZUMI, Yuuki SANADA, Masayuki TAKENAKA, Shinya UCHIBORI, Kengo OKA, Tasuke FUKUDA, Keitarou NAKAMA
  • Publication number: 20150319840
    Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.
    Type: Application
    Filed: September 24, 2013
    Publication date: November 5, 2015
    Inventors: Yuuki SANADA, Norihisa IMAIZUMI, Shinya UCHIBORI, Masaji IMADA, Toshihiro NAKAMURA, Eiji YABUTA, Masayuki TAKENAKA
  • Patent number: 8678118
    Abstract: A vehicle drive device having two independent systems provided for two driving wheels, respectively, each system including a rotating electrical machine, an output member to be connected to a corresponding driving wheel, and a drive transmission system. The transmission also includes a counter deceleration mechanism, which connects the rotating electrical machine and the output member to each other. A case integrally accommodates the rotating electrical machines, the output members, and the drive transmission systems of the two systems. The rotation axes are provided so that their respective rotation axes are parallel to each other, and are positioned so as to overlap each other in the rotation axis direction. The rotating electrical machine of each system is provided with an output portion located on one side of the rotating electrical machine which is distal from the corresponding driving wheel in the rotation axis direction of the rotating electrical machine.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: March 25, 2014
    Assignees: Aisin Aw Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Masayuki Takenaka, Atsushi Teshima, Ryuta Ishida, Tomohiko Miyamoto
  • Patent number: 8415027
    Abstract: A laser welding structure includes a lead, a conductive member, and a welding part. The lead has a nickel plating layer and is made of copper or copper alloy. The conductive member is joined with the lead and is made of copper or copper alloy. The welding part is formed by a laser welding so as to join the lead and the conductive member. An end portion of the welding part has a rounded convex shape.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: April 9, 2013
    Assignee: DENSO CORPORATION
    Inventors: Hiromasa Hayashi, Masayuki Takenaka, Hiroshi Kasugai, Masaji Imada
  • Publication number: 20110139522
    Abstract: A vehicle drive device having two independent systems provided for two driving wheels, respectively, each system including a rotating electrical machine, an output member to be connected to a corresponding driving wheel, and a drive transmission system. The transmission also includes a counter deceleration mechanism, which connects the rotating electrical machine and the output member to each other. A case integrally accommodates the rotating electrical machines, the output members, and the drive transmission systems of the two systems. The rotation axes are provided so that their respective rotation axes are parallel to each other, and are positioned so as to overlap each other in the rotation axis direction. The rotating electrical machine of each system is provided with an output portion located on one side of the rotating electrical machine which is distal from the corresponding driving wheel in the rotation axis direction of the rotating electrical machine.
    Type: Application
    Filed: August 20, 2009
    Publication date: June 16, 2011
    Applicants: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masayuki Takenaka, Atsushi Teshima, Ryuta Ishida, Tomohiko Miyamoto
  • Patent number: 7952240
    Abstract: A rotary electric machine having a stator including a coil; and a cooling unit that cools a coil end of the coil, which projects in an axial direction of the stator, wherein the cooling unit includes: an outer periphery cooling portion that is disposed along an outer peripheral surface of the coil end and includes a plurality of injection holes that inject a cooling medium onto the outer peripheral surface; and an end surface cooling portion that is disposed along an axial end surface of the coil end and includes a plurality of injection holes that inject the cooling medium onto the axial end surface.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: May 31, 2011
    Assignee: Aisin AW Co., Ltd.
    Inventors: Masayuki Takenaka, Yasunari Furuta