Abstract: The present invention provides a conductive copper composition comprising metal powder, a binder, a dispersant, and a solvent, characterized by containing 100 parts by weight of copper powder in the form of spherical or granule particles coated with silver as the metal powder, 6 to 18 parts by weight of resol resin satisfying the following conditions (a) to (c) as the binder, 0.05 to 1 part by weight of the dispersant, and 2 to 15 parts of the solvent:(a) Dimethylene-ether bonds in the skeletal structure or alkyl-ether bonds are contained 5% more of the bonded formaldehyde;(b) The molar ratio of preparation between formaldehyde and phenol (formaldehyde/phenol) is within the range of 1.0 to 3.

Abstract: A copper conductive composition comprising 100 parts by weight of spherical copper powder coated with silver as metal powder, 6 to 18 parts by weight of resol type phenolic resin containing a dimethylene ether bond in bonded formaldehyde by 5% or more, the molar ratio between the formaldehyde thereof and phenol thereof (formaldehyde/phenol) being 1.0 to 3.0, 0.05 to 1 parts by weight of dispersant, and 2 to 15 parts by weight of solvent. Therefore, an excellent conductivity and solderability of the cured film can be obtained.

Abstract: An electrically conductive powder having good stability against oxidation, good storage stability, good in anti-migratory action and capable of constituting electrically conductive composition having high electrical conductivity and good resistance to heat and the wet, may be constituted by copper particles, a silver coating material coating a part or the total of the copper particles and a titanate coupling agent combined to the copper particles and/or the silver coating material.