Patents by Inventor Masayuki Yamamoto

Masayuki Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
    Publication number: 20110056615
    Abstract: A nipper formed of a pair of nip blocks in an open state suction-holds on nip surfaces thereof a front end of the adhesive tape that is folded back with an edge member and separated from a separator. Then, the nip block on a front end side pivots to unite the nip surfaces of the nip blocks to each other. As a result, the adhesive tape is bent inwardly and adhesive layers thereof are adhered to each other to form a tab. The nip block on a rear end side suction-holds a rear end of the cut adhesive tape. Then, the nip block on the rear end side pivots to bend the adhesive tape inwardly for forming a tab.
    Type: Application
    Filed: August 23, 2010
    Publication date: March 10, 2011
    Inventors: Saburo Miyamoto, Yukitoshi Hase, Masayuki Yamamoto
  • PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS
    Publication number: 20110048630
    Abstract: A chuck table adhesively holds a rear face of a mount frame subject to a dicing process with a protective tape joined thereto, and a suction plate having a heater embedded therein contacts and heats the protective tape. Consequently, an adhesion layer of the protective tape reduces its adhesive force due to foaming and expansion. Thereafter, the suction plate moves upward while keeping its suction force to separate the protective tape from all of chips.
    Type: Application
    Filed: July 30, 2010
    Publication date: March 3, 2011
    Inventors: Yukitoshi Hase, Masayuki Yamamoto
  • ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
    Publication number: 20110048609
    Abstract: A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
    Type: Application
    Filed: August 2, 2010
    Publication date: March 3, 2011
    Inventors: Saburo Miyamoto, Yukitoshi Hase, Masayuki Yamamoto
  • Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
    Patent number: 7896049
    Abstract: On a back face of a semiconductor wafer, an annular convex portion is formed at an outer periphery so as to surround a flat concave portion formed by back grinding. The back face of the semiconductor wafer is pressed against an adhesive surface of a supporting adhesive tape joined to a ring frame. Thus, the annular convex portion is joined to the adhesive tape. Further, the adhesive tape is deformed while being pressed from a side of its non-adhesive surface. As a result, the adhesive tape is pushed into and joined to the flat concave portion of the back face of the semiconductor wafer.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: March 1, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Yamamoto
  • Method for producing non-foamed molded body
    Patent number: 7897092
    Abstract: Provided are a process for efficiently producing a non-foamed molded body by impregnating an amorphous thermoplastic resin with 0.3 to 3.0% by mass of carbon dioxide and/or 0.05 to 1.0% by mass of nitrogen and then supplying the amorphous thermoplastic resin thus obtained which is impregnated with carbon dioxide and/or nitrogen to an uppermost stream part of a cylinder in an injection molding machine and molding it and a non-foamed molded body produced thereby.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: March 1, 2011
    Assignee: Shinsei Kagaku Co., Ltd.
    Inventors: Haruo Shikuma, Masayuki Yamamoto, Naoto Kubo
  • Apparatus for cutting the protective tape of semiconductor wafer
    Patent number: 7896050
    Abstract: An outer edge of a protective tape projected from a semiconductor wafer is fixed and held by a tape holding section. In the condition, a part of the projected protective tape is caught and supported with a tape supporting section with a face having lower adhesive property provided in the outside of the traveling groove for the cutter. Furthermore, the part of the protective tape having the outer edge fixed and held with the tape holding section is compulsorily deformed and inserted into a depression provided between the tape holding section and the tape supporting section. Thereby, the part of the protective tape located in a traveling groove for the cutter is tensioned outward. A cutter blade is stuck into this tensioned part, and cuts the protective tape all over the peripheries of the wafer.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: March 1, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Yasuji Kaneshima
  • Method and computer for determining storage device
    Patent number: 7900013
    Abstract: A computer specifies the configuration of a first storage device by referencing first configuration information relating to the configuration of a first storage system including the first storage device, specifies one or more storage medium access performances corresponding to the first storage device by referencing the storage medium performance information, and calculates a first access performance index of the first storage device based on one or more specified storage medium access performances. The computer then references storage medium performance information and second configuration information relating to the configuration of a second storage system including a second storage device, and determines a second storage device having an access performance index that is at least equal to the calculated first access performance index.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: March 1, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Nobumitsu Takaoka, Yuichi Taguchi, Masayuki Yamamoto, Takashige Iwamura
  • Semiconductor wafer mount apparatus
    Patent number: 7896047
    Abstract: A grinding unit grinds an annular convex portion formed at an outer periphery of a back face of a wafer such that the wafer has a uniform thickness. After such process, a robot arm of a transport unit transports the wafer to an inspection unit for inspecting occurrence of damage at the wafer. Then, the robot arm transports the wafer without damage to a mount frame preparation unit. Herein, the wafer is joined to a ring frame through a dicing tape, and then a protective tape is separated from a front face of the wafer. Thus, a mount frame is prepared.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: March 1, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Yamamoto
  • STORAGE PERFORMANCE MANAGEMENT METHOD
    Publication number: 20110047321
    Abstract: The computer system having a storage subsystem for storing data in a logical storage extent created in a physical storage device constituted of a physical storage medium, a host computer for reading/writing data from/to the logical storage extent via a network, and a management computer for managing the storage subsystem. The management computer records components of the storage subsystem, a connection relation between the components included in a network path, a correlation between the logical storage extent and the components, and a load of each component, specifies components included in a leading path from an interface through which the storage subsystem is connected with the network to the physical storage medium, measures loads of the specified components to improve performance.
    Type: Application
    Filed: July 20, 2010
    Publication date: February 24, 2011
    Inventors: Yuichi TAGUCHI, Fumi Fujita, Masayuki Yamamoto
  • METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL
    Publication number: 20110045234
    Abstract: A joining roller rolls while pressing on a separator on a surface of a double-faced adhesive tape with through holes in rectangular shapes regularly formed therein in a longitudinal tape direction, and the double-faced adhesive tape is joined to a building panel. Thereafter, the separator is separated and the reinforcing member is joined to an adhesive layer of the double-faced adhesive tape while being pressed with the reinforcing member being kept parallel to the double-faced adhesive tape.
    Type: Application
    Filed: July 12, 2010
    Publication date: February 24, 2011
    Inventors: Saburo Miyamoto, Yukitoshi Hase, Masayuki Yamamoto
  • Computer system, management computer, and volume allocation change method of management computer
    Patent number: 7882303
    Abstract: A computer system to prevent intervention and falsification by setting encrypted transfer between a host computer and a first storage device that provides a virtual volume and between the first storage device and second and third storage devices that provide a real volume corresponding to the virtual volume. A management computer specifies the second and third storage device that provide the real volume corresponding to the virtual volume by providing a volume corresponding to the virtual volume used by a host computer in which encrypted transfer becomes necessary, and setting the encrypted transfer to communication between the first storage device and the second and third storage devices, makes a reconnection thereof, and also sets the encrypted transfer to an I/O port used for the communication with the host computer in the first storage device.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: February 1, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Atsushi Ueoka, Takeshi Ishizaki, Yasunori Kaneda, Masayuki Yamamoto
  • ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
    Publication number: 20110017391
    Abstract: A wafer holding table that suction-holds a wafer of a mount frame moves downward below a frame holding table when a joining roller passes over an exposed portion of an adhesive tape between the wafer W and the ring frame f. Here, the exposed portion of the adhesive tape inclines obliquely downward, thereby joining the adhesive tape to the mount frame.
    Type: Application
    Filed: July 2, 2010
    Publication date: January 27, 2011
    Inventors: Masayuki Yamamoto, Chouhei Okuno
  • Method and apparatus for configuration management of computer system
    Patent number: 7877782
    Abstract: A management computer collects, from a storage subsystem via a management network, path definition information including the contents of a security setting made to a path accessible to a volume in the storage subsystem, and when the volume in the storage subsystem is an original volume having a replica volume, replica definition information of the original volume. Based on the replica configuration information thus collected from the storage subsystem, the replica relationship between the volumes is to be grasped. Then, based on the path definition information also collected from the storage subsystem, the contents of the path security setting are verified for the volumes under the same replica relationship, and the verification result is output. In such a structure, consistency verification can be easily done for the security setting of the original and replica volumes.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: January 25, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Masayuki Yamamoto, Yasuyuki Mimatsu, Yasunori Kaneda
  • Method for detecting position of defect on semiconductor wafer
    Patent number: 7876432
    Abstract: A method of this invention involves: detecting a shape of an outer periphery of a semiconductor wafer with a first detecting device; determining a center position of the semiconductor wafer based on a detected result by the first detecting device; receiving a light beam reflected from a surface of the semiconductor wafer with a second detecting device; detecting an alignment part based on a detected result by the second detecting device to determine a position of the alignment part; and detecting a defect based on the detected result by the second detecting device to determine a position of the defect.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: January 25, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Satoshi Ikeda
  • Method and apparatus for joining adhesive tape
    Patent number: 7875145
    Abstract: An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: January 25, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Yamamoto, Naoki Ishii
  • Management device and method for storage device executing CDP-based recovery
    Patent number: 7877361
    Abstract: A management device of a storage device that executes CDP-based recovery comprises: a data protection term acquisition section that acquires a data protection term which is a term in which recovery of a data volume is ensured from a predetermined duration for which a predetermined time is a reference point; and a control section that executes control using the data protection term.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: January 25, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Masayuki Yamamoto, Wataru Okada
  • Apparatus and method for controlling data recovery
    Patent number: 7873865
    Abstract: A control apparatus comprises a priority determination unit for determining the priority of each of a plurality of applications that use data in different logical volumes constituting a volume group, and a restoration instruction unit for issuing a restoration instruction to a storage system to execute restoration on the plurality of logical volumes constituting the volume group in sequence from a logical volume used by an application having a high priority.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: January 18, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Wataru Okada, Masayuki Yamamoto
  • Configuration management apparatus and method
    Patent number: 7865687
    Abstract: To migrate a configuration that an old storage device has to a new storage device. A new storage device obtains a configuration of an old storage device, by using a migration manager, and prepares a logical volume definition of the new storage device based on a logical volume definition in the configuration. Also, based a cache allocation definition in the configuration and cache capacity of the new storage device, a cache allocation definition of the new storage device is prepared. Further, based on a port bandwidth allocation definition in the configuration and bandwidth capacity of a port of the new storage device, a port bandwidth allocation definition of the new storage device is prepared. The prepared logical volume definition, cache allocation definition and port bandwidth allocation definition are set up in a configuration of the new storage device.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: January 4, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Masayuki Yamamoto, Yasunori Kaneda, Yasuyuki Mimatsu
  • Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods
    Patent number: 7857029
    Abstract: An annular convex portion is formed along an outer periphery of a back face of a wafer so as to surround a ground area in the back face. The wafer is placed on a holding table with its front face directed upward. A locking member of the holding table supports and contacts the outer periphery of the annular convex portion, thereby securing the wafer. In this state, a separating adhesive tape is supplied toward a surface of a protective tape joined to the front face of the wafer. Then, a joining member presses the adhesive tape against the wafer, thereby joining the adhesive tape to the surface of the protective tape. Further, a guide member guides the adhesive tape joined to the protective tape in a reverse direction, Thus, the adhesive tape and the protective tape are simultaneously separated from the front face of the wafer.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: December 28, 2010
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Yamamoto
  • DATA MIGRATING METHOD TAKING END TIME INTO CONSIDERATION
    Publication number: 20100325378
    Abstract: There is provided a data migrating method including the steps of: calculating, in a case where data stored in a volume is migrated to another volume, a required period of time for migrating the data based on a size of data to be migrated and volume configuration information on the volume in which the migrated data is stored and the volume to which the data is to be migrated; determining a start time at which the data migration starts to generate a volume migration plan; setting a priority of the generated volume migration plan; prioritizing, in a case where a periods of time during which the generated volume migration plan is executed and a period of time during which an existing volume migration plan is executed are overlapped with each other, and changing the start time of at least one of those volume migration plans having a lower priority.
    Type: Application
    Filed: August 31, 2010
    Publication date: December 23, 2010
    Inventors: Tetsuya Maruyama, Yuichi Taguchi, Masayasu Asano, Masayuki Yamamoto