Patents by Inventor MasayukiTobita Tobita

MasayukiTobita Tobita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion method and electronic component
    Publication number: 20040041257
    Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.
    Type: Application
    Filed: September 4, 2003
    Publication date: March 4, 2004
    Applicant: Polymatech Co., Ltd.
    Inventors: MasayukiTobita Tobita, Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato