Patents by Inventor Masazumi Iwase

Masazumi Iwase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5516484
    Abstract: A copper-nickel based alloy, having reduced break-out during casting and reduced cracking during processing in solid state, which consists essentially of 3.1 to 25 wt. % of Ni, 0.1 to 1.5 wt. % of Mn, 0.0001 to 0.0093 wt. % of B, 0.01 to 0.7 wt. % of Si, and from 3 to 10 wt. % of Sn and the remainder being Cu and unavoidable elements.
    Type: Grant
    Filed: February 7, 1995
    Date of Patent: May 14, 1996
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita
  • Patent number: 5441696
    Abstract: A copper-nickel based alloy, which comprises 3 to 25 wt % of Ni, 0.1 to 1.5 t % of Mn, 0.0001 to 0.01 wt % of B and the rest being Cu and an unavoidable element.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: August 15, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenji Kubosono, Iwao Asamizu, Masazumi Iwase, Toshihiro Kurita