Patents by Inventor Mashiro Otsuka

Mashiro Otsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120326559
    Abstract: Provided is a laminated ceramic electronic component having excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and internal electrodes at a plurality of specific interfaces between the ceramic layers and having an Al/Ni alloy as a component; and an external electrode formed on the outer surface of the laminate, wherein the Al/Ni ratio of the Al/Ni alloy is 85/15 or more.
    Type: Application
    Filed: September 10, 2012
    Publication date: December 27, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Mashiro Otsuka, Koichi Banno, Akihiro Shiota, Shoichiro Suzuki, Taisuke Kanzaki, Masanori Nakamura
  • Publication number: 20070135294
    Abstract: A dielectric ceramic material comprising the composition: 100(Ba1-xCax)mTiO3+aMnO+bCuO+cSiO2+dMgO+eRO (wherein coefficients 100, a, b, c, d, and e each represent mols; m represents the molar ratio of (Ba1-xCax) to Ti; and RO represents at least one rare-earth element oxide selected from Y2O3, La2O3, 2CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb2O3, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3 and Lu2O3), wherein m, x, a, b, c, d, and e satisfy the relationships: 0.998?m?1.030, 0.04?x?0.15, 0.01?a?5, 0.05?b?5, 0.2?c?8, 0.05?d?3.0, and 0.05?e?2.5, and the dielectric ceramic material has an average grain size of 0.3 ?m to 0.7 ?m, is used to make reliable multilayer ceramic capacitors including dielectric ceramic layers each having a small thickness of about 1 ?m.
    Type: Application
    Filed: January 4, 2007
    Publication date: June 14, 2007
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takashi Hiramatsu, Teppei Akiyoshi, Mashiro Otsuka