Abstract: There is provided a method for improving heat dissipation in systems that use LEDs with high power density mounted on a printed circuit board, the LEDs each being provided, on a face thereof, with a plurality of electrical contacts for connecting electrically the LEDs to conducting tracks made on the board, and with a heat dissipating element, the board including a substrate made of heat-conducting material, covered by a layer of electrically insulating material, on which the conducting tracks are made, the LEDs being mounted on the board in such a manner that the face with the heat dissipating element faces the layer of electrically insulating material, the method including the steps of removing the material of the electrically insulating layer at a contact zone between the heat dissipating element of each LED and the electrically insulating layer; and making a heat-conducting connection between the heat dissipating element and substrate.

Abstract: A printing apparatus for printing discrete sheets includes a plurality of offset printing units arranged in sequence along an advancing direction of the discrete sheets, a screen-printing unit for supporting the discrete sheets, and a device for applying a flowable material to the discrete sheets. Each screen-printing unit includes a shifting device for shifting the applying device between an operating position in which the applying device interacts with the discrete sheets and a disengagement position in which the applying device is distanced from the screen printing supporting device. The printing apparatus also comprises a lamination unit for applying a film of plastic material to the discrete sheets.