Abstract: An integrated circuit includes a sub-system and a reference sub-system. The reference sub-system is substantially identical to the sub-system but is non-operating by default. The integrated circuit includes a test circuit that obtains a parameter value of the sub-system and a reference parameter from the reference sub-system. The integrated circuit detects deterioration of the sub-system based on the parameter value and the reference parameter. The integrated circuit deactivates the sub-system and activates the reference sub-system responsive to detecting deterioration of the sub-system.

Abstract: A detection device includes a pressure sensor, which provides a pressure signal indicative of an ambient pressure in an operating environment. An electrostatic-charge-variation sensor provides a charge-variation signal indicative of a variation of electrostatic charge associated with the operating environment, and processing circuitry is coupled to the pressure sensor and to the electrostatic-charge-variation sensor so as to receive the pressure signal and the charge-variation signal, and jointly processes the pressure signal and the charge-variation signal for detecting a variation between a first operating environment and a second operating environment for the detection device. The second operating environment is different from the first operating environment.

Abstract: An integrated circuit includes a sub-system and a reference sub-system. The reference sub-system is substantially identical to the sub-system but is non-operating by default. The integrated circuit includes a test circuit that obtains a parameter value of the sub-system and a reference parameter from the reference sub-system. The integrated circuit detects deterioration of the sub-system based on the parameter value and the reference parameter. The integrated circuit deactivates the sub-system and activates the reference sub-system responsive to detecting deterioration of the sub-system.

Abstract: A substrate has a plurality of microdots positioned thereon. Each microdot contains one or more primers for gene amplification for a particular target gene. The microdots are placed on the substrate and the substrate is positioned in a housing. The housing has a sample fluid to be tested introduced therein covering the microdot array. While the sample fluid is overlying the substrate, the amplification of the target gene is carried out if it is present within the sample. If the target gene that matches the primers is not present, then amplification will not take place. The fluid also contains fluorophores which will be fixed into the gene as it increases in size as it clearly detects if gene amplification has occurred by detecting the amount of light detected for a particular microdot. In a preferred embodiment, the sample fluid is placed on top of a sealing layer that is less dense then water, such as wax or mineral oil.

Abstract: A chip for biochemical reactions comprising: a first body including a plurality of first through openings arranged according to an arrangement pattern; a second body, having a hydrophilic surface, coupled to the first body on the hydrophilic surface; and an intermediate layer, which extends over the hydrophilic surface and forms a coupling interface between the first and the second bodies. The intermediate layer is of hydrophobic material, extends continuously over the hydrophilic surface, and has a plurality of second through openings through which respective regions of the hydrophilic surface are exposed. The hydrophilic regions may be functionalized for carrying out a PCR.

Abstract: Tray for containing electronic components formed by a bearing body, substantially planar, having a first and a second face. First holding structures extend from the first face of the bearing body and second holding structures extend from the second face of the bearing body. Each second holding structure is aligned with a respective first holding structure in a vertical direction perpendicular to the first and the second faces of the bearing body. Each first holding structure is formed by first protrusions mutually spaced by first spaces and arranged along a first closed line; each second holding structure is formed by second protrusions mutually spaced by second spaces and arranged along a second closed line. Each second protrusion is aligned, in parallel with the vertical direction, with the first spaces and each first protrusion is aligned, in parallel with the vertical direction, with the second spaces.

Abstract: A detection device includes a pressure sensor, which provides a pressure signal indicative of an ambient pressure in an operating environment. An electrostatic-charge-variation sensor provides a charge-variation signal indicative of a variation of electrostatic charge associated with the operating environment, and processing circuitry is coupled to the pressure sensor and to the electrostatic-charge-variation sensor so as to receive the pressure signal and the charge-variation signal, and jointly processes the pressure signal and the charge-variation signal for detecting a variation between a first operating environment and a second operating environment for the detection device. The second operating environment is different from the first operating environment.

Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

Abstract: An ambient temperature sensor is provided that may be coupled to a PCB. The ambient temperature sensor includes a package including a first cap and an insulating structure. The insulating structure is formed of thermally insulating material, and the first cap and the insulating structure delimit a first cavity. A semiconductor device is included and generates an electrical signal indicative of a temperature. The semiconductor device is fixed on top of the insulating structure and arranged within the first cavity. The package may be coupled to the PCB so that the insulating structure is interposed between the semiconductor device and the PCB. The insulating structure delimits a second cavity, which extends below the semiconductor device and is open laterally.

Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

Abstract: A micro device includes a substrate and a structure configured to bind to an object or a material, or not to bind to an object or material. The structure has a roughness based on a roughness of the object or material. For example, a microarray includes a substrate and a well positioned in the substrate and configured to bind to a type of bead. The well has a roughness based on a roughness of the type of bead to which the well is configured to bind. The roughness of the well is controlled by controlling a position and number of striations in the side of the well. In another example, a moveable component of a micro device may have a roughness different from a roughness of an adjacent component, to reduce the likelihood of the moveable component sticking to the adjacent component.

Abstract: A micro device includes a substrate and a structure configured to bind to an object or a material, or not to bind to an object or material. The structure has a roughness based on a roughness of the object or material. For example, a microarray includes a substrate and a well positioned in the substrate and configured to bind to a type of bead. The well has a roughness based on a roughness of the type of bead to which the well is configured to bind. The roughness of the well is controlled by controlling a position and number of striations in the side of the well. In another example, a moveable component of a micro device may have a roughness different from a roughness of an adjacent component, to reduce the likelihood of the moveable component sticking to the adjacent component.

Abstract: A micro device includes a substrate and a structure configured to bind to an object or a material, or not to bind to an object or material. The structure has a roughness based on a roughness of the object or material. For example, a microarray includes a substrate and a well positioned in the substrate and configured to bind to a type of bead. The well has a roughness based on a roughness of the type of bead to which the well is configured to bind. The roughness of the well is controlled by controlling a position and number of striations in the side of the well. In another example, a moveable component of a micro device may have a roughness different from a roughness of an adjacent component, to reduce the likelihood of the moveable component sticking to the adjacent component.