Patents by Inventor Masuji Honjo

Masuji Honjo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMORY CELLS HAVING INCREASED STRUCTURAL STABILITY
    Publication number: 20220263019
    Abstract: A memory cell can include a top lamina layer, a bottom lamina layer, and a phase change material (PCM) layer between the top lamina layer and the bottom lamina layer. The PCM layer can have a top surface in direct contact with the top lamina layer and a bottom surface in direct contact with the bottom lamina layer. The top surface of the PCM layer and the bottom surface of the PCM layer can have a structurally stabilizing width ratio.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Applicant: Intel Corporation
    Inventors: Pavan Kumar Reddy Aella, Kolya Yastrebenetsky, Masuji Honjo
  • Memory cells having increased structural stability
    Patent number: 11367833
    Abstract: A memory cell can include a top lamina layer, a bottom lamina layer, and a phase change material (PCM) layer between the top lamina layer and the bottom lamina layer. The PCM layer can have a top surface in direct contact with the top lamina layer and a bottom surface in direct contact with the bottom lamina layer. The top surface of the PCM layer and the bottom surface of the PCM layer can have a structurally stabilizing width ratio.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 21, 2022
    Assignee: Intel Corporation
    Inventors: Pavan Kumar Reddy Aella, Kolya Yastrebenetsky, Masuji Honjo
  • MEMORY CELLS HAVING INCREASED STRUCTURAL STABILITY
    Publication number: 20190044061
    Abstract: A memory cell can include a top lamina layer, a bottom lamina layer, and a phase change material (PCM) layer between the top lamina layer and the bottom lamina layer. The PCM layer can have a top surface in direct contact with the top lamina layer and a bottom surface in direct contact with the bottom lamina layer. The top surface of the PCM layer and the bottom surface of the PCM layer can have a structurally stabilizing width ratio.
    Type: Application
    Filed: September 28, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Pavan Kumar Reddy Aella, Kolya Yastrebenetsky, Masuji Honjo