Abstract: A micro light-emitting element includes: a micro light-emitting diode (LED) element configured to emit excitation light; and a wavelength conversion portion containing a nano particle configured to absorb the excitation light to emit light having a longer wavelength than the excitation light. The wavelength conversion portion has, on at least a light emitting surface of the wavelength conversion portion, a stack of one or more layers including an oxygen absorption film.

Abstract: In an image display device, a scattering unit has a size that covers a surface of a red conversion unit on a side that emits light having a second wavelength and a surface of a green conversion unit on a side that emits light having a third wavelength, and faces at most a part of a micro LED element.

Abstract: An image display device includes: a plurality of micro light emitting elements arranged in an array shape; a driving circuit substrate including a driving circuit that supplies electric current to the plurality of micro light emitting elements and that causes the plurality of micro light emitting elements to emit light; a plurality of micro lenses in contact with light emitting surfaces of the plurality of micro light emitting elements; and a plurality of partition walls disposed around the plurality of micro lenses in a direction parallel to the light emitting surfaces.

Abstract: An N electrode and a P electrode formed on the same surface are respectively bonded to a cathode electrode and an anode electrode of a drive circuit board through a connection step performed once. An LED unit includes a first wiring (21) that is disposed inside a groove formed in a nitride semiconductor (13) to penetrate between an N-type layer (10) and a P-type layer (12) and is electrically connected to the N-type layer (10), and a second wiring that includes a P electrode (30) connected to the P-type layer (12) and an N electrode (31) connected to the first wiring (21), in which the N electrode (31) and the P electrode (30) are formed on the same surface.

Abstract: A manufacturing method includes: a step of forming a light-emitting element layer by forming a semiconductor layer, a light-emitting layer, and a semiconductor layer in this order from a side with a first substrate on a surface, of the first substrate, on one side; a step of forming a separation trench in the light-emitting element layer to form a plurality of island shape light-emitting element layers; a step of forming a light shielding layer made of a material different from a material of the light-emitting element layer, in the separation trench; and a step of forming a plurality of light-emitting elements each including a corresponding one of the plurality of island shape light-emitting element layers having a height less than a height of the light shielding layer by etching a portion of the semiconductor layers of each of the plurality of island shape light-emitting element layers.

Abstract: A semiconductor module comprises an underlayer substrate on which a drive circuit is formed; a light-emitting element electrically coupled to the drive circuit; and a color conversion layer formed on the light-emitting element and containing a color conversion material that absorbs light emitted from the light-emitting element and converts a luminescent color of the light-emitting element to another luminescent color, wherein the color conversion material contained in the color conversion layer is present more on a light-emitting element side of the color conversion layer than on a side opposite to the light-emitting element side of the color conversion layer.

Abstract: In a micro light emitting element, a first metal film electrically connected to a second conductive layer is disposed on a surface on an opposite side of a light emitting surface side. The first metal film covers the second conductive layer. A first inclined angle of a first conductive layer side surface from a slope formed around a light emission layer to the light emitting surface is larger than a second inclined angle of the slope. The slope and the first conductive layer side surface are covered together by a second metal film. A first transparent insulating film is disposed between the slope and the second metal film.

Abstract: An image display device includes: a plurality of LED elements that are mounted on a drive circuit substrate and emit light source light; a wavelength conversion layer that is stacked on a side of the LED elements opposite to the drive circuit substrate, converts the light source light emitted by the LED elements into long wavelength light, and emits the long wavelength light to a side opposite to the drive circuit substrate; and a first functional layer that is disposed on a light emitting surface side of the long wavelength light of the wavelength conversion layer, reflects the light source light, and transmits the long wavelength light.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Abstract: In an image display device, a scattering unit has a size that covers a surface of a red conversion unit on a side that emits light having a second wavelength and a surface of a green conversion unit on a side that emits light having a third wavelength, and faces at most a part of a micro LED element.

Abstract: An image display device includes: a plurality of micro light emitting elements arranged in an array shape; a driving circuit substrate including a driving circuit that supplies electric current to the plurality of micro light emitting elements and that causes the plurality of micro light emitting elements to emit light; a plurality of micro lenses in contact with light emitting surfaces of the plurality of micro light emitting elements; and a plurality of partition walls disposed around the plurality of micro lenses in a direction parallel to the light emitting surfaces.

Abstract: An image display device includes: a plurality of LED elements that are mounted on a drive circuit substrate and emit light source light; a wavelength conversion layer that is stacked on a side of the LED elements opposite to the drive circuit substrate, converts the light source light emitted by the LED elements into long wavelength light, and emits the long wavelength light to a side opposite to the drive circuit substrate; and a first functional layer that is disposed on a light emitting surface side of the long wavelength light of the wavelength conversion layer, reflects the light source light, and transmits the long wavelength light.

Abstract: An N electrode and a P electrode formed on the same surface are respectively bonded to a cathode electrode and an anode electrode of a drive circuit board through a connection step performed once. An LED unit includes a first wiring (21) that is disposed inside a groove formed in a nitride semiconductor (13) to penetrate between an N-type layer (10) and a P-type layer (12) and is electrically connected to the N-type layer (10), and a second wiring that includes a P electrode (30) connected to the P-type layer (12) and an N electrode (31) connected to the first wiring (21), in which the N electrode (31) and the P electrode (30) are formed on the same surface.

Abstract: In a micro light emitting element, a first metal film electrically connected to a second conductive layer is disposed on a surface on an opposite side of a light emitting surface side. The first metal film covers the second conductive layer. A first inclined angle of a first conductive layer side surface from a slope formed around a light emission layer to the light emitting surface is larger than a second inclined angle of the slope. The slope and the first conductive layer side surface are covered together by a second metal film. A first transparent insulating film is disposed between the slope and the second metal film.

Abstract: Light can be radiated onto a desired region of skin in a reliable and simple manner while preventing the radiation of light onto regions other than the desired region. A light radiator is provided with: a light source that radiates light onto skin; a light shielding member that is arranged between the skin and the light source; and a flexible base on which the light source and the light shielding member are mounted, in which an opening that corresponds to a specific region of the skin can be formed in the light shielding member, and the light is radiated onto the specific region through the opening.

Abstract: Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.