Patents by Inventor Masumi Nobata

Masumi Nobata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7491986
    Abstract: A different electric power supply electric power source cell is proposed which includes paths by which electric power source voltages, the electric potentials of which are different from each other, are respectively taken in from the area pad and the probing pad and by which the voltages are supplied to the blocks requiring these electric power source voltages.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: February 17, 2009
    Assignee: Panasonic Corporation
    Inventors: Takaaki Kumagae, Yasuyuki Okada, Masumi Nobata
  • Publication number: 20060292713
    Abstract: To provide a semiconductor device which can be down-sized and integrated to a high degree. A semiconductor device including a rewiring mixedly includes an input/output (I/O) cell connected to a probing pad; and another input/output (I/O) cell having no probing pad.
    Type: Application
    Filed: August 29, 2006
    Publication date: December 28, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akinori Haza, Yasuyuki Okada, Masumi Nobata
  • Patent number: 7105933
    Abstract: To provide a semiconductor device which can be down-sized and integrated to a high degree. A semiconductor device including a rewiring mixedly includes an input/output (I/O) cell connected to a probing pad; and another input/output (I/O) cell having no probing pad.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akinori Haza, Yasuyuki Okada, Masumi Nobata
  • Publication number: 20050139987
    Abstract: A semiconductor integrated circuit device comprises: a semiconductor integrated circuit chip mounted on a semiconductor base, the semiconductor integrated circuit chip having a plurality of circuit systems mounted being separated and driven by different electric power source systems and also having at least one electrostatic protection circuit; and an outer connecting terminal 5 connected to the circuit systems of the semiconductor integrated circuit chip via a wiring member 4 having at least one wiring layer, wherein electric power source lines and ground lines of the plurality of circuit systems of the semiconductor integrated circuit chip 1 are respectively commonly connected on a conductive plane 43, which is provided in the wiring member, via an electrostatic protection circuit 2.
    Type: Application
    Filed: November 12, 2004
    Publication date: June 30, 2005
    Inventors: Yasuyuki Okada, Hiroyuki Miyazaki, Masumi Nobata
  • Publication number: 20040245656
    Abstract: To provide a semiconductor device which can be down-sized and integrated to a high degree.
    Type: Application
    Filed: March 26, 2004
    Publication date: December 9, 2004
    Inventors: Akinori Haza, Yasuyuki Okada, Masumi Nobata
  • Publication number: 20040150007
    Abstract: A different electric power supply electric power source cell is proposed which includes paths by which electric power source voltages, the electric potentials of which are different from each other, are respectively taken in from the area pad and the probing pad and by which the voltages are supplied to the blocks requiring these electric power source voltages.
    Type: Application
    Filed: December 22, 2003
    Publication date: August 5, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Takaaki Kumagae, Yasuyuki Okada, Masumi Nobata