Abstract: The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.

Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): (ii) a polymerization unit represented by the formula (II): and (iii) at least one polymerization unit selected from the group consisting of a polymerization unit represented by the formula (III): and a polymerization unit represented by the formula (IV): and (B) at least one acid generator.

Abstract: The present invention provides a salt represented by the formula (I): wherein X represents a C3-C30 divalent group containing at least one divalent alicyclic hydrocarbon group, and at least one —CH2— in the C3-C30 divalent group may be substituted with —O— or —CO—, Y represents a C3-C30 cyclic hydrocarbon group which may be substituted with at least one group selected from a C1-C6 alkoxy group, a C1-C4 perfluoroalkyl group, a C1-C6 hydroxyalkyl group, a hydroxyl group and a cyano group, and at least one —CH2— in the C3-C30 cyclic hydrocarbon group may be substituted with —O— or —CO—, Q1 and Q2 each independently represent a fluorine atom or a C1-C6 perfluoroalkyl group, and A+ represents an organic counter ion.

Abstract: A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): (ii) a polymerization unit represented by the formula (II): and (iii) at least one polymerization unit selected from the group consisting of a polymerization unit represented by the formula (III): and a polymerization unit represented by the formula (IV): and (B) at least one acid generator.

Abstract: The present invention provides a chemically amplified positive resist composition comprising (A) a resin obtainable by reacting a novolak resin, a poly(hydroxystyrene) and a compound having at least two vinyl ether structures, and (B) an acid generator.

Abstract: The present invention provides a salt represented by the formula (I): wherein X represents a C3-C30 divalent group containing at least one divalent alicyclic hydrocarbon group, and at least one —CH2— in the C3-C30 divalent group may be substituted with —O— or —CO—, Y represents a C3-C30 cyclic hydrocarbon group which may be substituted with at least one group selected from a C1-C6 alkoxy group, a C1-C4 perfluoroalkyl group, a C1-C6 hydroxyalkyl group, a hydroxyl group and a cyano group, and at least one —CH2— in the C3-C30 cyclic hydrocarbon group may be substituted with —O— or —CO—, Q1 and Q2 each independently represent a fluorine atom or a C1-C6 perfluoroalkyl group, and A+ represents an organic counter ion.

Abstract: A chemical amplification type positive resist composition, which can reduce cost steeply without significantly decreasing basic abilities, is provided, and the chemical amplification type positive resist composition includes (A) a resin having a polymerization unit derived from p-hydroxystyrene and a polymerization unit of the formula (1) or formula (2) which is insoluble or poorly soluble itself in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, (B) a resin obtained by protecting a portion of the hydroxyl groups in poly(p-hydroxystyrene) with a protective group not dissociating by the action of an acid or a resin obtained by substituting a portion of the hydroxyl groups in poly(p-hydroxystyrene) with hydrogen, and (C) an acid generating agent.

Abstract: The present invention provides a positive resist composition comprising (A) at least one resin selected from the group consisting of {circle around (1)} resin which is itself insoluble or poorly soluble in an alkali aqueous solution but cause a chemical change by the action of an acid to become soluble in an alkali aqueous solution with a proviso that the resin is not novolak resin and {circle around (2)} alkali-soluble resin, (B) novolak resin containing protective group which can be dissociated by the action of an acid and (C) an acid generator.

Abstract: A chemical amplification type positive resist composition comprising a novolak resin, a resin insoluble or poorly soluble itself in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, and an acid generator, wherein when the novolak resin is measured by gel permeation chromatography (GPC) using a 254 nm UV detector using polystyrene as a standard, the area ratio of components having molecular weights of 1000 or less is 25% or less based on the total pattern area excepting unreacted monomers; and the chemical amplification type positive resist composition can reduce cost without deteriorating basic abilities such as sensitivity, resolution and the like, and shows small unevenness due to standing wave, and can improved pattern profile, particularly, line edge roughness.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising resin which itself is insoluble or poorly soluble in an alkali aqueous solution but becomes soluble in an alkali aqueous solution by the action of an acid, an acid generator and a compound having an aromatic ring, having a molecular weight of 1000 or less and showing light absorption of a 1000 liter/(mol*cm) or more in terms of molar extinction coefficient in a wavelength range from 190 nm to 260 nm, wherein the ratio of said compound is 0.01 to 20% by weight based on the resin.

Abstract: The present invention provides a chemical amplification type positive resist composition comprising (A) resin having a phenol skeleton wherein the phenol skeleton has protective group which can be dissociated by the action of an acid, the phenol skeleton itself is insoluble or poorly soluble in an alkali aqueous solution and the phenol skeleton becomes soluble in an alkali aqueous solution after dissociation of the protective group, (B) resin obtained by protecting a part of hydroxyl group in poly(p-hydroxystyrene) with pivaloyl group and (C) an acid generator.

Abstract: A chemical amplification type positive resist composition that enables a resist pattern free from deformation in a side wall thereof and excellent in evenness and is excellent in sensitivity as well as resolution is provided and the chemical amplification type positive resist composition comprises a resin which has a polymerization unit derived from p-hydroxystyrene and a polymerization unit having a group unstable against acid, and is insoluble or hardly soluble in an alkaline medium itself but becoming alkaline-soluble after the acid-unstable group being cleaved by the action of the generated acid; an acid generating agent; and a compound represented by the following formula (I): wherein R1 and R2 each independently represents an alkyl group having 1 to 15 carbon atoms, an alkyl group having 1 to 8 carbon atoms wherein at least 3 hydrogen atoms are substituted by fluorine atoms, or an aryl group having 6 to 10 carbon atoms.

Abstract: A resist composition showing excellent close adherence at the interface of a substrate and a resist, improving problems in wet etching, having excellent sensitivity and resolution, and also showing excellent resist performances, and comprising a compound of the general formula (I): wherein, R1 and R2 represent each independently a hydrogen atom or an alkyl group, R3 represents a hydrogen atom, alkyl group, aryl group, aralkyl group, alkenyl group, alkylcarbonyl group, arylcarbonyl group or aralkylcarbonyl group, n represents an integer of 1 to 40, m represents an integer of 1 to 5, and l represents an integer of 1 to 5, is provided.

Abstract: The present invention provides a positive resist composition comprising

Abstract: The present invention provides a chemical amplification type positive resist composition comprising

Abstract: A resist composition showing excellent close adherence at the interface of a substrate and a resist, improving problems in wet etching, having excellent sensitivity and resolution, and also showing excellent resist performances, and comprising a compound of the general formula (I): 1

Abstract: A chemical amplification type positive resist composition comprising a novolak resin, a resin insoluble or poorly soluble itself in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, and an acid generator, wherein when the novolak resin is measured by gel permeation chromatography (GPC) using a 254 nm UV detector using polystyrene as a standard, the area ratio of components having molecular weights of 1000 or less is 25% or less based on the total pattern area excepting unreacted monomers; and the chemical amplification type positive resist composition can reduce cost without deteriorating basic abilities such as sensitivity, resolution and the like, and shows small unevenness due to standing wave, and can improved pattern profile, particularly, line edge roughness.

Abstract: A chemical amplification type positive resist composition, which can reduce cost steeply without significantly decreasing basic abilities, is provided, and the chemical amplification type positive resist composition comprises (A) a resin having a polymerization unit derived from p-hydroxystyrene and a polymerization unit of the formula (1) or formula (2) 1

Abstract: A chemical amplification type positive resist composition that enables a resist pattern free from deformation in a side wall thereof and excellent in evenness and is excellent in sensitivity as well as resolution is provided and the chemical amplification type positive resist composition comprises a resin which has a polymerization unit derived from p-hydroxystyrene and a polymerization unit having a group unstable against acid, and is insoluble or hardly soluble in an alkaline medium itself but becoming alkaline-soluble after the acid-unstable group being cleaved by the action of the generated acid; an acid generating agent; and a compound represented by the following formula (I): 1

Abstract: A negative type resist composition is provided, which provides excellent resolution, satisfactory profile and outstanding process stability; is suitable for exposure using deep ultra violet ray; and comprises alkali soluble resin, acid generator, crosslinking agent, and a basic compound represented by the following formula (I) wherein, A represents sulfide group, disulfide group or bivalent aliphatic hydrocarbon residue which may be optionally interrupted by imino group, sulfide group, or disulfide group, X represents nitrogen atom or C(NH2), and R1 and R2 independently represent hydrogen or alkyl.