Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.

Abstract: A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.

Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

Abstract: A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Abstract: A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

Abstract: A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.

Abstract: A service receiving device (1) is provided for a production facility (151, 108, 108a, 108b, 100) such as a component mounting apparatus on the user side, whereas a service providing device (2) is provided for the manufacturer side providing the production facility. These service receiving device (1) and service providing device (2) communicate with each other in a mutual manner or from a necessary side to the other side through various communication systems including the Internet line owing to a software (161, 161a), so that a service relating to response to a trouble or production including the productivity or the quality maintenance is derived or transmitted according to need.

Abstract: In a printing device in which a printing material is printed on or applied to a to-be-printed surface of a circuit board through a screen mask for printing having openings formed therein in a predetermined pattern, it is intended to reliably remove cream solder remaining in the openings in the screen mask. After an air suction mechanism (19) has its flow rate controlled by a flow rate controller (20). An air suction section (15) is lifted until its front end contacts with the screen mask (5), the air suction mechanism (19) starts cleaning by sucking air from the openings (6) in the screen mask (5). An inspecting camera (2) is used to observe the cream solder (4) remaining in the openings (6) after cleaning, and the air suction flow rate is controlled according to the results thereof to effect cleaning again.

Abstract: A reflow soldering device extracts a vaporized component of a contaminative material, such as flux, from exhaust gas from a reflow furnace. The device includes a conveyor for transferring a circuit substrate, a heater for heating the transferred circuit substrate, a cooler for cooling the circuit substrate which has been reflow soldered by heater, discharge pipes and a discharge blower for discharging an exhaust gas at high temperature from the heater to the outside of the device, and a flux remover mounted in the discharge pipes which cools the exhaust gas to 70.degree. C. and below, preferably 60.degree. C. and below, so as to cause a vaporized component, such as flux contained in the exhaust gas, to become liquid or solid and to be removed.