Abstract: A process for producing a semiconductor memory device comprises the steps of: (a) forming a floating gate on a semiconductor substrate having a dielectric film; (b) forming a side wall spacer comprising an insulating film on a side wall of the floating gate; (c) forming a groove by etching the semiconductor substrate using the side wall spacer as a mask; and (d) forming a low concentration impurity layer from one side wall to a bottom surface of the groove by an oblique ion implantation to the semiconductor substrate thus resulting, and forming a high concentration impurity layer from the other side wall to the bottom surface of the groove by in inverse oblique ion implantation.

Abstract: A process for producing a semiconductor memory device comprises the steps of: (a) forming a floating gate on a semiconductor substrate having a dielectric film; (b) forming a side wall spacer comprising an insulating film on a side wall of the floating gate; (c) forming a groove by etching the semiconductor substrate using the side wall spacer as a mask; and (d) forming a low concentration impurity layer from one side wall to a bottom surface of the groove by an oblique ion implantation to the semiconductor substrate thus resulting, and forming a high concentration impurity layer from the other side wall to the bottom surface of the groove by in inverse oblique ion implantation.

Abstract: Memory cells are divided into a plurality of series circuit units arranged in matrix fashion and comprising some memory cells connected in series. The memory cells each consist of non-volatile transistors provided with a control gate electrode, a floating gate electrode and an erase gate electrode. Bit lines to which one end of each of the series circuit units of the plurality of series circuit units arranged in one row are connected in common. Column lines are provided in common for the series circuit units that are arranged in one column and that are respectively connected to each control gate electrode of the memory cells constituting each of the series circuit unit. A voltage by which the selected non-volatile transistor works in a saturation state is applied to the control gate electrode of the selected transistor of a series circuit unit by a column line, thereby injecting hot electrons from the semiconductor substrate into the floating gate electrode.