Abstract: A printed board, to which cream solders are applied on lands at the position where leads of electronic parts are to be soldered and the leads of the electronic parts are provided to the lands, is fed to a soldering position and, the cream solders of the fed printed board are spot heated and melted to solder the leads of the electronic parts to the lands. The molten solders are solidified by forced cooling to fix the leads of the electronic parts to the lands, and the printed board on which the leads of the electronic parts are fixed to the lands with the solidified solders is discharged from the soldering position.