Abstract: A sensor element for detecting at least one property of a measuring gas in a measuring gas chamber, in particular for detecting a portion of a gas component in the measuring gas or a temperature of the measuring gas. The sensor element includes a first substrate, a second substrate, and a sensor chip. The sensor chip includes at least one solid electrolyte diaphragm, a first electrode, and a second electrode. The first substrate and the second substrate are connected to each other via at least one glass ceramic. The glass ceramic is manufactured from a material which includes at least SiO2, MgO, Al2O3, as well as ZnO and/or B2O3.

Abstract: A method of bonding a first substrate to a second substrate includes providing a glass, applying the glass in a layer between the first and second substrates to form an assembly, and heating the assembly to a bonding temperature above a glass transition temperature of the devitrifying glass, selected to cause the glass to bond the first substrate to the second substrate. The devitrifying glass has constituents that include various amounts of group A in a molar concentration of 70-95%, group B in a molar concentration of 5-20%, group C in a molar concentration of 1-20%, group D in a molar concentration of 0-6%; and group E in a molar concentration of 0-10%. The group A, B, C, D and E groups are disclosed herein.

Abstract: A method of bonding a first substrate to a second substrate includes providing a glass, applying the glass in a layer between the first and second substrates to form an assembly, and heating the assembly to a bonding temperature above a glass transition temperature of the devitrifying glass, selected to cause the glass to bond the first substrate to the second substrate. The devitrifying glass has constituents that include various amounts of group A in a molar concentration of 70-95%, group B in a molar concentration of 5-20%, group C in a molar concentration of 1-20%, group D in a molar concentration of 0-6%; and group E in a molar concentration of 0-10%. The group A, B, C, D and E groups are disclosed herein.

Abstract: The method for bonding a first substrate to a second substrate includes dispensing a paste directly onto a first substrate, the paste including a glass powder, a thermoplastic, and a first solvent, evaporating the first solvent to form a thickened paste, placing a second substrate on the thickened paste to form a stack, applying to the stack a force sufficient to cause deformation of the thickened paste, and heating the stack to a bonding temperature above a glass transition temperature of the glass powder so as to cause removal of the thermoplastic from the thickened paste and to form a glass joint between the first and second substrates.

Abstract: A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.

Abstract: A sealing glass composition suitable for bonding ceramic surfaces at low temperatures and which includes in weight percent 5-50% thallium oxide, 10-40% vanadium oxide, 5-30% tellurium oxide, 1.5-15% arsenic oxide and 1-5% phosphorous oxide. Other additives may be included, such as bismuth oxide. A paste formulated from said glass and a filler for the purpose of adjusting the fluidity and/or dielectric constant of the paste.

Abstract: A silver-glass paste comprising silver flake, lead vanadium telluride glass, resin, surfactant and a mixture of solvents, said mixture comprising at least two solvents selected from the group consisting of glycol ether, isoparaffin, and terpineol, each of said solvents having a boiling point of from about 170.degree. C. to about 230.degree. C. and a surface tension of from about 20 to about 30 dynes/cm.sup.2.

Abstract: Described is a sealing glass composition comprising, in wt. %, 13-50% lead oxide, 20-50% vanadium oxide, 2-40% tellurium oxide, up to 40% selenium oxide, up to 10% phosphorous oxide, up to 5% niobium oxide, up to 20% bismuth oxide, up to 5% copper oxide and up to 10% boron oxide and an electrically conductive formulation comprising, in wt. %, 50-77% silver, 8-34% of a sealing glass composition as described previously, 0.2-1.5% resin and thixotrope and 10-20% organic solvent.

Abstract: A sealing glass composition comprising, in wt. %, 30-70% lead oxide, 30-60% vanadium oxide, 1-10% phosphorous oxide, 0-30% bismuth oxide, 0.5 to 5% niobium oxide, and 1-15% of at least one oxide from the group consisting of tellurium oxide and selenium oxide.