Abstract: Provided is an adjustable lighting system, configured to emit light at any of various bi-directional light-emission ratios. The adjustable lighting system includes a light source, and a reflective component positioned adjacent the light source. The adjustable lighting system also includes a movable positioning apparatus connected to the light source or the reflective component and configured to, when moved, change a relative positioning between the light source and the reflective component.

Abstract: Provided is an adjustable lighting system, configured to emit light at any of various bi-directional light-emission ratios. The adjustable lighting system includes a light source, and a reflective component positioned adjacent the light source. The adjustable lighting system also includes a movable positioning apparatus connected to the light source or the reflective component and configured to, when moved, change a relative positioning between the light source and the reflective component.

Abstract: A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

Abstract: A system for converting light from a first range of wavelengths to a second range of wavelengths includes a semiconductor die and a phosphor embedded epoxy contacting a first end of the semiconductor die. A frame contacts the phosphor embedded epoxy. The first and second ranges of wavelengths include blue/ultraviolet light and visible light, respectively.

Abstract: An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).

Abstract: A light emitting diode (LED) device (A) and processes for its manufacture are provided. The LED device (A) includes a light emitting chip or die (10) and an encapsulant (22) surrounding the same. The encapsulant (22) is substantially spherical in shape, and the die (10) is preferably located at a substantial center of the encapsulant (22). An electrically conductive path extends from the chip or die (10) to a periphery of the encapsulant (22) such that the chip/die (10) can be selectively energized to produce light by applying electricity to the electrically conductive path at the periphery of the encapsulant (22). Preferably, the encapsulant (22) is chosen to have an index of refraction as close as possible to the higher of an index of refraction of the die's semiconductor material and an index of refraction of the die's substrate (12).

Abstract: A decorative lamp (10, 100) is disclosed for producing a diffuse or scattered lighting. A container (12, 102, 116) includes a light transmissive portion (18). A light source (20, 104, 118, 120, 150) includes a housing (32, 122, 152) arranged inside the light transmissive container (12, 102). The housing (32, 122, 152) includes a battery compartment (52, 130, 162) electrically and mechanically adapted to receive at least one associated battery. At least one LED (36,38, 126, 128, 158) is disposed on a first side (34) of the housing (32, 122, 150) and cooperates with the container (12, 102) to emit diffuse or scattered light from the light transmissive portion (18). A fastening means (62, 134) is arranged on a second side (60) of the housing (32, 122). The fastening means (62, 134) is provided to fasten the housing (32, 122, 150) to an inner side (76) of the container (12, 102) wherein the at least one LED (36, 38, 126, 128, 158) illuminates the interior of the container (12, 102).

Abstract: A flashlight includes a housing, an electrical power source in the housing, a semiconductor light source, a reflector well in which the semiconductor light source is seated, and a lens over the reflector. The housing has a closed end and an open end. The semiconductor light source is electrically connected to the power source. The semiconductor light source, reflector, and lens are secured to the housing. Light produced by the semiconductor light source is reflected by the reflector and focussed by the lens in a predetermined direction.

Abstract: A system for converting light from a first range of wavelengths to a second range of wavelengths includes a semiconductor die and a phosphor embedded epoxy contacting a first end of the semiconductor die. A frame contacts the phosphor embedded epoxy. The first and second ranges of wavelengths include blue/ultraviolet light and visible light, respectively.

Abstract: An LED package (10) includes LED die (12) mounted onto lead frame (14) and electrically connected thereto whereby LED die (12) is electrically energized through leads (16, 18). An encapsulant (20), preferably an epoxy resin, encapsulates and preferably hermetically seals LED die (12). Encapsulant (20) includes depression (24) defined by preselected curved surfaces (28), at least a portion of which are coated by reflective coating (26). Encapsulant (20) preferably also includes sides (22) with preselected curvature. In operation, LED die (12) emits light (32) directed approximately along LED die surface normal (36). Light rays (32) reflect from reflective surface (26) and reflected rays (38) are subsequently refracted by refracting surface (22) so that refracted rays (40) exit the capsule. The reflecting surface (26) and refracting surface (22) cooperate to convert LED die light distribution (32) into light distribution (40) which appears to emanate from an approximate point source (42).

Abstract: A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages are disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

Abstract: A flashlight includes a housing, an electrical power source in the housing, a semiconductor light source, a reflector well in which the semiconductor light source is seated, and a lens over the reflector. The housing has a closed end and an open end. The semiconductor light source is electrically connected to the power source. The semiconductor light source, reflector, and lens are secured to the housing. Light produced by the semiconductor light source is reflected by the reflector and focussed by the lens in a predetermined direction.

Abstract: A light emitting diode (LED) device (A) and processes for its manufacture are provided. The LED device (A) includes a light emitting chip or die (10) and an encapsulant (22) surrounding the same. The encapsulant (22) is substantially spherical in shape, and the die (10) is preferably located at a substantial center of the encapsulant (22). An electrically conductive path extends from the chip or die (10) to a periphery of the encapsulant (22) such that the chip/die (10) can be selectively energized to produce light by applying electricity to the electrically conductive path at the periphery of the encapsulant (22). Preferably, the encapsulant (22) is chosen to have an index of refraction as close as possible to the higher of an index of refraction of the die's semiconductor material and an index of refraction of the die's substrate (12).