Abstract: Method for producing wafer half-shells including the operations of: providing a wafer including a plurality of half-shells connected to each other by an interconnecting wall, where the interconnecting wall is connected to each half-shell by an annular region surrounding the half-shell having a thickness smaller than the thickness of the interconnecting wall, and separating the half-shells from the interconnecting wall along a cutting profile corresponding to the half-shell contour at the annular region with a reduced thickness, wherein, in the separation operation the interconnecting wall is supported by a plastic material support, and the separation operation is carried out by a cutting member having a serrated cutting profile.