Abstract: A substantially cuboidal cooling body includes a first cooling contact surface incorporated in a first outer side surface of a first wall of the cuboid and a second cooling contact surface incorporated in a second outer side surface of a second wall of the cuboid, wherein the second wall is arranged perpendicularly to the first wall such that a first edge is formed, a third wall is arranged perpendicularly to the second wall such that a second edge is formed, a fourth wall is arranged perpendicularly to the third wall such that a third edge is formed, and the first wall is arranged perpendicularly to the fourth wall such that a fourth edge is formed, where the four walls are arranged such that an internal space having a medium inlet opening and a medium outlet opening forms a flow channel for a cooling medium.

Abstract: An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.

Abstract: An automation device configured for an automation environment and for automating an industrial process includes a basic housing, a front hood, a primary heatsink for dissipating heat from a microprocessor, wherein the front hood is slottable onto the basic housing and assembles to form a closed housing which encloses the primary heatsink, the primary heatsink is rigidly connected to the basic housing on a bottom side of the basic housing via a locating bearing, the front hood includes a projecting retaining element on an inner side, a recess is arranged on a top side of the primary heatsink and into which the retaining element engages when the housing is closed, an elastic shaped element is arranged between the projecting retaining element and the recess, and the elastic shaped element absorbs oscillating forces of the primary heatsink in three spatial axes (x,y,z).

Abstract: An automation device configured for an automation environment and for automating an industrial process includes a basic housing, a front hood, a primary heatsink for dissipating heat from a microprocessor, wherein the front hood is slottable onto the basic housing and assembles to form a closed housing which encloses the primary heatsink, the primary heatsink is rigidly connected to the basic housing on a bottom side of the basic housing via a locating bearing, the front hood includes a projecting retaining element on an inner side, a recess is arranged on a top side of the primary heatsink and into which the retaining element engages when the housing is closed, an elastic shaped element is arranged between the projecting retaining element and the recess, and the elastic shaped element absorbs oscillating forces of the primary heatsink in three spatial axes (x,y,z).

Abstract: An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.