Patents by Inventor Mathias Bottcher

Mathias Bottcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220095450
    Abstract: The invention relates to a carrier arrangement (100; 500; 600; 700; 800; 900; 1000), and a method for producing a carrier arrangement. The method comprises: producing a layer (130; 530; 630; 730; 830; 930; 1030) on a surface (120; 520; 620; 720; 820; 920; 1020) of a carrier (110; 510; 610; 710; 810; 910; 1010), the layer comprising a first region (131; 531; 631; 731; 831; 931; 1031) and a second region (132; 532; 632; 732; 832; 932; 1032) connected to the first region, the first region covering a first surface region (121; 521; 621; 721; 821; 921; 1021) of the carrier and the second region covering a second surface region (122; 722; 922) of the carrier, detaching the second region of the layer from the carrier, the first region of the layer remaining on the first surface region of the carrier and not being separated from the second region, the layer being flexible in the detached second region.
    Type: Application
    Filed: January 31, 2020
    Publication date: March 24, 2022
    Inventors: Mathias Bottcher, Frank Windrich, Kai Zoschke, M. Jürgen Wolf
  • Patent number: 6894390
    Abstract: A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for stopping the alpha particles are compatible with standard back-end processing and do not degrade adhesion of the solder bump to the remaining substrate. Moreover, a low electrical resistance is maintained and heat dissipation may be improved.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: May 17, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Gisela Schammler, Mathias Böttcher, Frank Kuechenmeister, Daniel Gehre, Ehrenfried Zschech
  • Patent number: 6867610
    Abstract: The present invention allows testing of bump connections under predefined conditions. To this end, a test structure including two substrates, each substrate having bond pads that are provided for flip-chip connecting both substrates. These bond pads may have electrical contact to other bond pads and/or special probe pads which are provided for making electrical connections to external devices. Electrically conductive bumps are formed on at least some of the bond pads of one of the substrates, and the bumps are electrically and mechanically connected to the bond pads in the other substrate.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: March 15, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Mathias Böttcher, Thomas Werner
  • Publication number: 20040164409
    Abstract: A semiconductor device comprises a material layer adapted to efficiently stop alpha particles that are substantially generated within a solder bump of a flip chip device. The materials used for stopping the alpha particles are compatible with standard back-end processing and do not degrade adhesion of the solder bump to the remaining substrate. Moreover, a low electrical resistance is maintained and heat dissipation may be improved.
    Type: Application
    Filed: August 27, 2003
    Publication date: August 26, 2004
    Inventors: Gisela Schammler, Mathias Bottcher, Frank Kuechenmeister, Daniel Gehre, Ehrenfried Zschech
  • Publication number: 20040100293
    Abstract: The present invention allows testing of bump connections under predefined conditions. To this end, a test structure comprises two substrates comprising bond pads being provided for flip-chip connecting both substrates. These bond pads may have electrical contact to other bond pads and/or special probe pads which are provided for making electrical connections to external devices. Electrically conductive bumps are formed on at least some of the bond pads of one of the substrates, and the bumps are electrically and mechanically connected to the bond pads in the other substrate.
    Type: Application
    Filed: May 20, 2003
    Publication date: May 27, 2004
    Inventors: Mathias Bottcher, Thomas Werner