Patents by Inventor Mathias Bruendel

Mathias Bruendel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120024396
    Abstract: A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system.
    Type: Application
    Filed: July 20, 2011
    Publication date: February 2, 2012
    Applicant: Robert Bosch GmbH
    Inventors: Ricardo Ehrenpfordt, Mathias Bruendel, Frieder Haag, Jochen Rupp, Ulrike Scholz
  • Publication number: 20110291301
    Abstract: A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.
    Type: Application
    Filed: May 27, 2011
    Publication date: December 1, 2011
    Applicant: Robert Bosch GmbH
    Inventors: Mathias Bruendel, Frieder Haag, Ulrike Scholz
  • Publication number: 20110229375
    Abstract: A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.
    Type: Application
    Filed: March 17, 2011
    Publication date: September 22, 2011
    Applicant: Robert Bosch GmbH
    Inventors: Ricardo Ehrenpfordt, Mathias Bruendel, Frieder Haag, Jochen Rupp, Ulrike Scholz