Abstract: A hot-melt glue composition, including a) at least one atactic poly-?-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.

Abstract: A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.

Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-?-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between ?10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.

Abstract: The invention relates to hot-melt adhesive compositions having at least one thermoplastic poly-a-olefin that is solid at 25° C. and that contains silane groups, at least one soft resin having a melting point or softening point between ?10 and 40° C., and at least one silane that is liquid at 25° C. The hot-melt adhesive compositions are characterized by an improved open time and reduced viscosity compared to the prior art that cannot be achieved by means of other low-molecular-weight components that are normally added to reduce the viscosity, because the components escape from the adhesive formulation over time. The hot-melt adhesives according to the invention are suitable in particular as laminating adhesives and have a desirable low viscosity during the application, while good cross-linking density can be achieved by the addition of silane that is liquid at room temperature.

Abstract: The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-?-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between ?10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.