Patents by Inventor Mathias E. Liistro

Mathias E. Liistro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicone-Containing Hot-Melt Compositions
    Publication number: 20080241407
    Abstract: Moisture curable compositions having hard and soft segments are disclosed. Also disclosed are dual cure compositions capable of both moisture and radiation cure. The present invention provides compositions which have increased tolerances for high temperatures, and compositions which have increased rheological control.
    Type: Application
    Filed: September 1, 2005
    Publication date: October 2, 2008
    Inventors: Hsien-Kun Chu, Thomas Fay-Oy Lim, Mathias E. Liistro
  • Injection Molding Process, Apparatus and Material for Forming Cured-In-Place Gaskets
    Publication number: 20080128955
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Application
    Filed: February 8, 2006
    Publication date: June 5, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsien-Kun Chu, Deboral E. Duch, Mathias E. Liistro, Alfred A. DeCato, Anthony R. Horelik, James E. Lioberber