Patents by Inventor Mathias E. Liistro, Jr.

Mathias E. Liistro, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110133366
    Abstract: The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process.
    Type: Application
    Filed: August 5, 2010
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsie-Kun Chu, Debora E. Duch, Mathias E. Liistro, JR., Alfred A. DeCato, Anthony R. Horelik, James E. Lionberger, Gregory A. Krueger
  • Patent number: 7837824
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: November 23, 2010
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Douglas N. Horner
  • Patent number: 7790094
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: September 7, 2010
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Anthony R. Horelik, Robert P. Cross, Debora E. Duch, Alfred A. DeCato, James E. Lionberger
  • Patent number: 7625978
    Abstract: The present invention provides curable hot melt compositions including reactive polymers, which are reinforced by organic polymers to impart higher tensile strength and elongation to the compositions upon cure. In particular, the present invention provides curable hot melt compositions including a silicone urea based polymer and a reinforcement polymer. In some embodiments, the compositions cure upon exposure to moisture and/or radiation. The compositions may be used, for example, as sealants or adhesives.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 1, 2009
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, David P. Dworak, Mathias E. Liistro, Jr., Hsien-Kun Chu
  • Publication number: 20080306208
    Abstract: The present invention relates to a method of preparing fast curing silicone RTV compositions by reacting an amino endcapped silicone with an isocyanato functionalized silane, and to compositions formed thereby. In particular, the present invention provides compositions which include silicones endcapped with silanes which contain ?-ureas.
    Type: Application
    Filed: November 16, 2006
    Publication date: December 11, 2008
    Applicants: Henkel Corporation, Henkel KGaA
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Robert P. Cross, Mathias E. Liistro, JR., David P. Dworak, Paul Borucki, Scott Senuta, Daniela Bathelt, Thomas Bachon
  • Patent number: 7452937
    Abstract: A room temperature vulcanizing silicone polymer composition including: a) as part of the silicone polymer, a segment including a silicone polymer of Formula (I): b) a finely-divided inorganic filler present in an amount of at least about 25% by weight of the total composition. Enhanced elongation ability is possessed by these compositions.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: November 18, 2008
    Assignee: Henkel Corporation
    Inventors: Robert P. Cross, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Alfred A. DeCato, Debora E. Duch, Bahram Issari