Abstract: An integrated circuit is disclosed. In one embodiment, the integrated circuit includes a first interface layer on a first substrate, the first interface layer including a first signal path, a second interface layer on the first interface layer, the second interface layer including a second signal path, the second signal path being coupled to the first signal path, and a second substrate on the second interface layer. In one embodiment, the second substrate includes an electronic device, the electronic device being coupled to the second signal path of the second interface layer.

Abstract: A module has on a front side a coupling socket for holding an optical fiber end, and at a rear side has a holding region for an electro optical component. The component is firstly prefixed in a position of maximum optical coupling by optical irradiation of an adhesive that can be cured both by light and by heat. After the prefixing, a permanent connection is made by thermal curing the adhesive in a temporally and/or spatially separate subsequent production step.

Abstract: On a front side, a module has a coupling socket for holding an optical fiber end, and at a rear side the module has a holding region in which an electrooptical component is fixed. A joint gap, filled with an adhesive, between the component and the holding region extends in a plane which is oriented perpendicular to the longitudinal axis of the coupling socket. The component and/or the holding region is provided with openings, which lead to the joint gap and taper toward the joint gap, and are introduced into the adhesive.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.

Abstract: The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.