Patents by Inventor Mathias Kaempf

Mathias Kaempf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10276748
    Abstract: Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 30, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Mathias Kaempf, Simon Jerebic, Ingo Neudecker, Guenter Spath, Michael Huber, Korbinian Perzlmaier
  • Patent number: 10232471
    Abstract: The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: March 19, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventor: Mathias Kaempf
  • Patent number: 10115869
    Abstract: The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: October 30, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Mathias Kaempf, Simon Jerebic, Ingo Neudecker, Guenter Spath, Michael Huber
  • Patent number: 10090198
    Abstract: Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. The substrate is broken along the separation pattern. A semiconductor chip (15) is also disclosed.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: October 2, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Mathias Kaempf
  • Publication number: 20180233627
    Abstract: Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.
    Type: Application
    Filed: October 7, 2015
    Publication date: August 16, 2018
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Mathias KAEMPF, Simon JEREBIC, Ingo NEUDECKER, Guenter SPATH, Michael HUBER, Korbinian PERZLMAIER
  • Publication number: 20180117706
    Abstract: The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
    Type: Application
    Filed: December 18, 2017
    Publication date: May 3, 2018
    Inventor: Mathias KAEMPF
  • Publication number: 20180047628
    Abstract: A method for singulating an assemblage into a plurality of semiconductor chips is specified, wherein an assemblage comprising a carrier, a semiconductor layer sequence and a metallic layer is provided. Separating trenches are formed in the carrier. The assemblage is subjected to mechanical loading, with the result that the metallic layer breaks along the separating trenches and the assemblage is singulated into semiconductor chips, wherein the singulated semiconductor chips each have part of the semiconductor layer sequence, of the carrier and of the metallic layer. A semiconductor chip is furthermore specified.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 15, 2018
    Inventor: Mathias KAEMPF
  • Patent number: 9873166
    Abstract: The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: January 23, 2018
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventor: Mathias Kaempf
  • Patent number: 9728459
    Abstract: A method for singulating an assemblage (1) into a plurality of semiconductor chips (10) is specified, wherein an assemblage comprising a carrier (4), a semiconductor layer sequence (2) and a metallic layer (3) is provided. Separating trenches (45) are formed in the carrier. The assemblage is subjected to mechanical loading, with the result that the metallic layer breaks along the separating trenches and the assemblage is singulated into semiconductor chips, wherein the singulated semiconductor chips each have part of the semiconductor layer sequence, of the carrier and of the metallic layer. A semiconductor chip (10) is furthermore specified.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: August 8, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Mathias Kaempf
  • Publication number: 20160254415
    Abstract: The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.
    Type: Application
    Filed: October 14, 2014
    Publication date: September 1, 2016
    Inventors: Mathias KAEMPF, Simon JEREBIC, Ingo NEUDECKER, Guenter SPATH, Michael HUBER
  • Publication number: 20160204033
    Abstract: Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. The substrate is broken along the separation pattern. A semiconductor chip (15) is also disclosed.
    Type: Application
    Filed: August 6, 2014
    Publication date: July 14, 2016
    Inventor: Mathias KAEMPF
  • Publication number: 20160204032
    Abstract: The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
    Type: Application
    Filed: July 30, 2014
    Publication date: July 14, 2016
    Inventor: Mathias KAEMPF
  • Publication number: 20150303112
    Abstract: A method for singulating an assemblage (1) into a plurality of semiconductor chips (10) is specified, wherein an assemblage comprising a carrier (4), a semiconductor layer sequence (2) and a metallic layer (3) is provided. Separating trenches (45) are formed in the carrier. The assemblage is subjected to mechanical loading, with the result that the metallic layer breaks along the separating trenches and the assemblage is singulated into semiconductor chips, wherein the singulated semiconductor chips each have part of the semiconductor layer sequence, of the carrier and of the metallic layer. A semiconductor chip (10) is furthermore specified.
    Type: Application
    Filed: November 8, 2013
    Publication date: October 22, 2015
    Inventor: Mathias KAEMPF
  • Patent number: 9165816
    Abstract: A method relates to separating a component composite into a plurality of component regions, wherein the component composite is provided having a semiconductor layer sequence comprising a region for generating or for receiving electromagnetic radiation. The component composite is mounted on a rigid subcarrier. The component composite is separated into the plurality of component regions, wherein one semiconductor body is produced from the semiconductor layer sequence for each component region. The component regions are removed from the subcarrier.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: October 20, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Heribert Zull, Korbinian Perzlmaier, Andreas Ploessl, Thomas Veit, Mathias Kaempf, Jens Dennemarck, Bernd Boehm
  • Patent number: 7445119
    Abstract: Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: November 4, 2008
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Mathias Kaempf, Frank Singer, Jurgen Dachs, Alfred Bachler