Patents by Inventor Mathias Reimann

Mathias Reimann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capped microsensor
    Patent number: 6986278
    Abstract: A capped microsensor is described. It is suggested that a current conductor, positioned in the cavity and having at least two voltage taps, be provided, this configuration being used for seal testing, e.g., during quality control, by detecting at least one thermodynamic variable of a gaseous medium present inside the cavity via this configuration.
    Type: Grant
    Filed: May 3, 2004
    Date of Patent: January 17, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Frank Schatz, Carsten Raudzis, Mathias Reimann
  • Capacitive finger coupling element on a silicon support for coupling a strip line structure
    Patent number: 6876268
    Abstract: A coupling element for an HF strip line structure on an HF substrate, implemented in thin-layer technology as a finger coupler structure on a silicon support is described. The bonding to the strip line tracks of the HF strip line structure is effected via metallizations, in particular in the form of spacers.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: April 5, 2005
    Assignee: Robert Bosch GmbH
    Inventors: Thomas Walter, Markus Ulm, Stefan Keith, Dirk Steinbuch, Mathias Reimann
  • Capped microsensor
    Publication number: 20050028582
    Abstract: A capped microsensor is described. It is suggested that a current conductor, positioned in the cavity and having at least two voltage taps, be provided, this configuration being used for seal testing, e.g., during quality control, by detecting at least one thermodynamic variable of a gaseous medium present inside the cavity via this configuration.
    Type: Application
    Filed: May 3, 2004
    Publication date: February 10, 2005
    Inventors: Frank Schatz, Carsten Raudzis, Mathias Reimann
  • Coupling element for a hf stripline structure
    Publication number: 20040036549
    Abstract: A coupling element for an HF strip line structure on an HF substrate, implemented in thin-silicon layer technology as a finger coupler structure on a silicon support is described. The bonding to the strip line tracks of the HF strip line structure is effected via metallizations, in particular in the form of spacers.
    Type: Application
    Filed: September 8, 2003
    Publication date: February 26, 2004
    Inventors: Thomas Walter, Markus Ulm, Stefan Keith, Dirk Steinbuch, Mathias Reimann